JP2009176986A5 - - Google Patents
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- Publication number
- JP2009176986A5 JP2009176986A5 JP2008014573A JP2008014573A JP2009176986A5 JP 2009176986 A5 JP2009176986 A5 JP 2009176986A5 JP 2008014573 A JP2008014573 A JP 2008014573A JP 2008014573 A JP2008014573 A JP 2008014573A JP 2009176986 A5 JP2009176986 A5 JP 2009176986A5
- Authority
- JP
- Japan
- Prior art keywords
- winding
- windings
- coil
- farther
- smaller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008014573A JP5282405B2 (ja) | 2008-01-25 | 2008-01-25 | コイル及び半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008014573A JP5282405B2 (ja) | 2008-01-25 | 2008-01-25 | コイル及び半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009176986A JP2009176986A (ja) | 2009-08-06 |
| JP2009176986A5 true JP2009176986A5 (https=) | 2011-02-03 |
| JP5282405B2 JP5282405B2 (ja) | 2013-09-04 |
Family
ID=41031765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008014573A Expired - Fee Related JP5282405B2 (ja) | 2008-01-25 | 2008-01-25 | コイル及び半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5282405B2 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6639296B2 (ja) * | 2016-03-23 | 2020-02-05 | 株式会社ジャパンディスプレイ | 表示装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11307723A (ja) * | 1998-04-17 | 1999-11-05 | Matsushita Electric Ind Co Ltd | 平面トランス |
| US6396362B1 (en) * | 2000-01-10 | 2002-05-28 | International Business Machines Corporation | Compact multilayer BALUN for RF integrated circuits |
| JP5683765B2 (ja) * | 2001-09-04 | 2015-03-11 | クゥアルコム・インコーポレイテッドQualcomm Incorporated | 集積回路チップ及びその形成方法 |
-
2008
- 2008-01-25 JP JP2008014573A patent/JP5282405B2/ja not_active Expired - Fee Related
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