JP5280995B2 - 電子装置の製造方法 - Google Patents

電子装置の製造方法 Download PDF

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Publication number
JP5280995B2
JP5280995B2 JP2009291019A JP2009291019A JP5280995B2 JP 5280995 B2 JP5280995 B2 JP 5280995B2 JP 2009291019 A JP2009291019 A JP 2009291019A JP 2009291019 A JP2009291019 A JP 2009291019A JP 5280995 B2 JP5280995 B2 JP 5280995B2
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JP
Japan
Prior art keywords
solder
electronic device
semiconductor chip
manufacturing
pcb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009291019A
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English (en)
Japanese (ja)
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JP2010114454A (ja
JP2010114454A5 (https=
Inventor
邦雄 重村
賢次 花田
正樹 中西
隆文 西田
政佳 篠田
晴一 友井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Priority to JP2009291019A priority Critical patent/JP5280995B2/ja
Publication of JP2010114454A publication Critical patent/JP2010114454A/ja
Publication of JP2010114454A5 publication Critical patent/JP2010114454A5/ja
Application granted granted Critical
Publication of JP5280995B2 publication Critical patent/JP5280995B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2009291019A 2009-12-22 2009-12-22 電子装置の製造方法 Expired - Fee Related JP5280995B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009291019A JP5280995B2 (ja) 2009-12-22 2009-12-22 電子装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009291019A JP5280995B2 (ja) 2009-12-22 2009-12-22 電子装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2004336113A Division JP4524454B2 (ja) 2004-11-19 2004-11-19 電子装置およびその製造方法

Publications (3)

Publication Number Publication Date
JP2010114454A JP2010114454A (ja) 2010-05-20
JP2010114454A5 JP2010114454A5 (https=) 2011-05-26
JP5280995B2 true JP5280995B2 (ja) 2013-09-04

Family

ID=42302723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009291019A Expired - Fee Related JP5280995B2 (ja) 2009-12-22 2009-12-22 電子装置の製造方法

Country Status (1)

Country Link
JP (1) JP5280995B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5970316B2 (ja) 2012-09-26 2016-08-17 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN114639669B (zh) * 2022-03-02 2025-04-08 江苏长电科技股份有限公司 埋入式天线芯片封装结构及制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3235452B2 (ja) * 1995-03-20 2001-12-04 松下電器産業株式会社 高周波集積回路装置
JP3739650B2 (ja) * 2000-12-21 2006-01-25 太陽誘電株式会社 ハイブリッドｉｃ実装体及びハイブリッドｉｃ
JP2002208668A (ja) * 2001-01-10 2002-07-26 Hitachi Ltd 半導体装置およびその製造方法
JP2004327556A (ja) * 2003-04-22 2004-11-18 Matsushita Electric Works Ltd 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JP2010114454A (ja) 2010-05-20

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