JP4055687B2 - 半導体装置及び電子装置 - Google Patents
半導体装置及び電子装置 Download PDFInfo
- Publication number
- JP4055687B2 JP4055687B2 JP2003333756A JP2003333756A JP4055687B2 JP 4055687 B2 JP4055687 B2 JP 4055687B2 JP 2003333756 A JP2003333756 A JP 2003333756A JP 2003333756 A JP2003333756 A JP 2003333756A JP 4055687 B2 JP4055687 B2 JP 4055687B2
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- Japan
- Prior art keywords
- external electrode
- electrode terminal
- substrate
- semiconductor device
- plating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 title claims description 57
- 239000000758 substrate Substances 0.000 claims description 89
- 239000004020 conductor Substances 0.000 claims description 33
- 238000007747 plating Methods 0.000 claims description 31
- 230000002093 peripheral effect Effects 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 230000001681 protective effect Effects 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 6
- 238000012360 testing method Methods 0.000 description 13
- 238000007789 sealing Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 238000004891 communication Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 6
- 238000010304 firing Methods 0.000 description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910020658 PbSn Inorganic materials 0.000 description 2
- 101150071746 Pbsn gene Proteins 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Wire Bonding (AREA)
Description
本発明の目的は、耐衝撃性の高い半導体装置を提供することにある。
本発明の他の目的は、耐衝撃性の高い電子装置を提供することにある。
本発明の他の目的は、耐衝撃性の高い携帯電話機を提供することにある。
第1の面(上面)に素子搭載部や導体層を有し、第1の面と反対の面である第2の面(下面)に外部電極端子を有する低温焼成セラミックからなる基板(低温焼成基板)と、
前記基板の上面に搭載される回路素子(能動素子や受動素子)と、
前記回路素子の電極と、前記基板に設けた導体層を電気的に接続する接続手段とを有し、
前記外部電極端子はその周縁部分を絶縁性の保護膜で被われ、かつ前記保護膜で被われない表面はメッキ膜で被われ、
前記外部電極端子の周縁部分の厚さは、前記周縁部分の内側部分の厚さよりも厚くなっていることを特徴とする。
(1)半導体装置1の外部電極端子4は、クラックが発生し易い外部電極端子4の周縁部分が厚く形成されて機械的強度が高くなっている。この結果、実装基板40に半導体装置1を搭載した電子装置の落下試験を行った場合、落下時の衝撃で外部電極端子部分にクラックが入り難くなり、電子装置の耐衝撃性が高くなり、実装の信頼性が高くなる。従って、携帯電話機の実装基板40に本発明による耐衝撃性の高い半導体装置1を組み込めば、携帯電話機等の耐衝撃性も高いものとなる。
Claims (4)
- 第1の面に素子搭載部および導体層の少なくとも1つを有し、前記第1の面と反対の面である第2の面に外部電極端子を有するセラミックからなる基板と、
前記基板の前記第1の面に搭載された回路素子と、
前記回路素子の電極と、前記基板に設けた導体層とを電気的に接続する接続手段とを具備して成り、
前記外部電極端子はその周縁部分を全周に亘って絶縁性の保護膜で被って前記基板の内部に埋め、
前記外部電極端子の前記保護膜で被われた部分を含む周縁部分は、前記基板の表面に現れる前記外部電極端子の平面中央部分の厚さよりも厚くなっていることを特徴とする半導体装置。 - 前記外部電極端子の周縁部分は16〜25μmの厚さで、かつその厚い部分の幅は50〜80μmであり、
前記外部電極端子の平面中央部分の厚さは5〜16μmであることを特徴とする請求項1に記載の半導体装置。 - 前記基板は低温焼成基板であり、
前記外部電極端子はAg−Ptを含む層であり、
前記外部電極端子の表面にはメッキ膜が形成され、
前記メッキ膜は、下層のNiメッキ膜と、このNiメッキ膜上に形成されるAuメッキ膜とを含んで成ることを特徴とする請求項1に記載の半導体装置。 - 請求項1乃至3のいずれか1項に記載の半導体装置と、
前記半導体装置の前記外部電極端子に対応するランドを有する実装基板とを具備して成り、
前記半導体装置の前記外部電極端子は導電性の接着材によって前記ランドに電気的に接続されてなることを特徴とする電子装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003333756A JP4055687B2 (ja) | 2003-09-25 | 2003-09-25 | 半導体装置及び電子装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003333756A JP4055687B2 (ja) | 2003-09-25 | 2003-09-25 | 半導体装置及び電子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005101321A JP2005101321A (ja) | 2005-04-14 |
JP4055687B2 true JP4055687B2 (ja) | 2008-03-05 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003333756A Expired - Lifetime JP4055687B2 (ja) | 2003-09-25 | 2003-09-25 | 半導体装置及び電子装置 |
Country Status (1)
Country | Link |
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JP (1) | JP4055687B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5036257B2 (ja) * | 2006-09-13 | 2012-09-26 | 京セラ株式会社 | 配線基板 |
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2003
- 2003-09-25 JP JP2003333756A patent/JP4055687B2/ja not_active Expired - Lifetime
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JP2005101321A (ja) | 2005-04-14 |
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