JP5275001B2 - 多層フレキシブル配線板の製造方法 - Google Patents

多層フレキシブル配線板の製造方法 Download PDF

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Publication number
JP5275001B2
JP5275001B2 JP2008314074A JP2008314074A JP5275001B2 JP 5275001 B2 JP5275001 B2 JP 5275001B2 JP 2008314074 A JP2008314074 A JP 2008314074A JP 2008314074 A JP2008314074 A JP 2008314074A JP 5275001 B2 JP5275001 B2 JP 5275001B2
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Japan
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layer
wiring board
manufacturing
plating
adhesive
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JP2008314074A
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Japanese (ja)
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JP2010140989A (ja
JP2010140989A5 (zh
Inventor
間 史 朗 赤
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Nippon Mektron KK
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Nippon Mektron KK
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Priority to JP2008314074A priority Critical patent/JP5275001B2/ja
Priority to CN200910163346.2A priority patent/CN101754571B/zh
Priority to TW98126739A priority patent/TWI433630B/zh
Publication of JP2010140989A publication Critical patent/JP2010140989A/ja
Publication of JP2010140989A5 publication Critical patent/JP2010140989A5/ja
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JP2008314074A 2008-12-10 2008-12-10 多層フレキシブル配線板の製造方法 Active JP5275001B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008314074A JP5275001B2 (ja) 2008-12-10 2008-12-10 多層フレキシブル配線板の製造方法
CN200910163346.2A CN101754571B (zh) 2008-12-10 2009-08-07 柔性多层布线板及其制造方法
TW98126739A TWI433630B (zh) 2008-12-10 2009-08-10 Method for manufacturing multilayer flexible wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008314074A JP5275001B2 (ja) 2008-12-10 2008-12-10 多層フレキシブル配線板の製造方法

Publications (3)

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JP2010140989A JP2010140989A (ja) 2010-06-24
JP2010140989A5 JP2010140989A5 (zh) 2011-08-11
JP5275001B2 true JP5275001B2 (ja) 2013-08-28

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JP2008314074A Active JP5275001B2 (ja) 2008-12-10 2008-12-10 多層フレキシブル配線板の製造方法

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JP (1) JP5275001B2 (zh)
CN (1) CN101754571B (zh)
TW (1) TWI433630B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016197675A (ja) * 2015-04-06 2016-11-24 大日本印刷株式会社 Ｌｅｄ素子用のフレキシブル多層回路基板
JPWO2018123974A1 (ja) * 2016-12-28 2019-06-27 株式会社フジクラ 配線体、配線基板、及びタッチセンサ
CN110662342B (zh) * 2018-06-28 2021-02-02 鹏鼎控股(深圳)股份有限公司 软硬结合板及其制作方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB863115A (en) * 1956-08-02 1961-03-15 Fairey Co Ltd Improvements relating to aerofoils or sheet material impregnated with a synthetic resin and to methods of making such aerofoils
JP3680321B2 (ja) * 1994-06-28 2005-08-10 日立化成工業株式会社 多層プリント配線板の製造法
CN1283132C (zh) * 2001-09-28 2006-11-01 钟渊化学工业株式会社 用于软性印刷电路板的聚酰亚胺膜以及采用该膜的软性印刷电路板
JP4228677B2 (ja) * 2002-12-06 2009-02-25 パナソニック株式会社 回路基板
JP4063082B2 (ja) * 2003-01-10 2008-03-19 日本電気株式会社 フレキシブル電子デバイスとその製造方法
JP2007129153A (ja) * 2005-11-07 2007-05-24 Cmk Corp リジッドフレックス多層プリント配線板

Also Published As

Publication number Publication date
TW201023713A (en) 2010-06-16
JP2010140989A (ja) 2010-06-24
TWI433630B (zh) 2014-04-01
CN101754571B (zh) 2014-06-04
CN101754571A (zh) 2010-06-23

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