JP5275001B2 - 多層フレキシブル配線板の製造方法 - Google Patents
多層フレキシブル配線板の製造方法 Download PDFInfo
- Publication number
- JP5275001B2 JP5275001B2 JP2008314074A JP2008314074A JP5275001B2 JP 5275001 B2 JP5275001 B2 JP 5275001B2 JP 2008314074 A JP2008314074 A JP 2008314074A JP 2008314074 A JP2008314074 A JP 2008314074A JP 5275001 B2 JP5275001 B2 JP 5275001B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- wiring board
- manufacturing
- plating
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008314074A JP5275001B2 (ja) | 2008-12-10 | 2008-12-10 | 多層フレキシブル配線板の製造方法 |
CN200910163346.2A CN101754571B (zh) | 2008-12-10 | 2009-08-07 | 柔性多层布线板及其制造方法 |
TW98126739A TWI433630B (zh) | 2008-12-10 | 2009-08-10 | Method for manufacturing multilayer flexible wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008314074A JP5275001B2 (ja) | 2008-12-10 | 2008-12-10 | 多層フレキシブル配線板の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010140989A JP2010140989A (ja) | 2010-06-24 |
JP2010140989A5 JP2010140989A5 (zh) | 2011-08-11 |
JP5275001B2 true JP5275001B2 (ja) | 2013-08-28 |
Family
ID=42350890
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008314074A Active JP5275001B2 (ja) | 2008-12-10 | 2008-12-10 | 多層フレキシブル配線板の製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5275001B2 (zh) |
CN (1) | CN101754571B (zh) |
TW (1) | TWI433630B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016197675A (ja) * | 2015-04-06 | 2016-11-24 | 大日本印刷株式会社 | Led素子用のフレキシブル多層回路基板 |
JPWO2018123974A1 (ja) * | 2016-12-28 | 2019-06-27 | 株式会社フジクラ | 配線体、配線基板、及びタッチセンサ |
CN110662342B (zh) * | 2018-06-28 | 2021-02-02 | 鹏鼎控股(深圳)股份有限公司 | 软硬结合板及其制作方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB863115A (en) * | 1956-08-02 | 1961-03-15 | Fairey Co Ltd | Improvements relating to aerofoils or sheet material impregnated with a synthetic resin and to methods of making such aerofoils |
JP3680321B2 (ja) * | 1994-06-28 | 2005-08-10 | 日立化成工業株式会社 | 多層プリント配線板の製造法 |
CN1283132C (zh) * | 2001-09-28 | 2006-11-01 | 钟渊化学工业株式会社 | 用于软性印刷电路板的聚酰亚胺膜以及采用该膜的软性印刷电路板 |
JP4228677B2 (ja) * | 2002-12-06 | 2009-02-25 | パナソニック株式会社 | 回路基板 |
JP4063082B2 (ja) * | 2003-01-10 | 2008-03-19 | 日本電気株式会社 | フレキシブル電子デバイスとその製造方法 |
JP2007129153A (ja) * | 2005-11-07 | 2007-05-24 | Cmk Corp | リジッドフレックス多層プリント配線板 |
-
2008
- 2008-12-10 JP JP2008314074A patent/JP5275001B2/ja active Active
-
2009
- 2009-08-07 CN CN200910163346.2A patent/CN101754571B/zh not_active Expired - Fee Related
- 2009-08-10 TW TW98126739A patent/TWI433630B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW201023713A (en) | 2010-06-16 |
JP2010140989A (ja) | 2010-06-24 |
TWI433630B (zh) | 2014-04-01 |
CN101754571B (zh) | 2014-06-04 |
CN101754571A (zh) | 2010-06-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4767269B2 (ja) | 印刷回路基板の製造方法 | |
US8347493B2 (en) | Wiring board with built-in electronic component and method of manufacturing same | |
JP5259240B2 (ja) | 多層フレキシブルプリント配線板およびその製造方法 | |
JP4855186B2 (ja) | 両面フレキシブルプリント配線板の製造方法 | |
JP2009231770A (ja) | 多層フレキシブルプリント配線板およびその製造方法 | |
WO2008004382A1 (fr) | Procédé de fabrication d'une plaque de circuit imprimé à couches multiples | |
JP5275001B2 (ja) | 多層フレキシブル配線板の製造方法 | |
KR100731819B1 (ko) | 다층 연성인쇄회로기판의 제조방법 | |
JP4705400B2 (ja) | 多層プリント配線板の製造方法 | |
JP2010278067A (ja) | 多層フレキシブルプリント配線板の製造方法および多層回路基材 | |
KR101046084B1 (ko) | 메탈 코어 기판 및 이를 포함하는 다층 인쇄회로 기판과 이들의 제조방법 | |
JP2007287721A (ja) | ケーブル部を有する多層回路基板およびその製造方法 | |
JP2010016061A (ja) | プリント配線板およびその製造方法 | |
TWI778356B (zh) | 軟硬結合電路板及其製作方法 | |
JP2007288023A (ja) | リジッドフレックス多層プリント配線板の製造方法 | |
JP2011243767A (ja) | 多層配線板とその製造方法 | |
JP5000446B2 (ja) | プリント配線板の製造方法 | |
KR100658972B1 (ko) | 인쇄회로기판 및 그 제조방법 | |
JP4347143B2 (ja) | 回路基板およびその製造方法 | |
KR100754071B1 (ko) | 전층 ivh 공법의 인쇄회로기판의 제조방법 | |
KR100601476B1 (ko) | 메탈코어를 이용한 패키지 기판 및 그 제조방법 | |
JP2014222733A (ja) | プリント配線板およびその製造方法 | |
JP2006156576A (ja) | リジッドフレックス多層プリント配線板の製造方法 | |
US11792929B2 (en) | Wiring substrate and method for manufacturing wiring substrate | |
JP4302045B2 (ja) | 多層フレキシブル回路配線基板及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110623 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110623 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120921 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120925 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121126 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130419 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130515 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 5275001 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |