JP5271394B2 - レーザスクライブ装置 - Google Patents

レーザスクライブ装置 Download PDF

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Publication number
JP5271394B2
JP5271394B2 JP2011158884A JP2011158884A JP5271394B2 JP 5271394 B2 JP5271394 B2 JP 5271394B2 JP 2011158884 A JP2011158884 A JP 2011158884A JP 2011158884 A JP2011158884 A JP 2011158884A JP 5271394 B2 JP5271394 B2 JP 5271394B2
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JP
Japan
Prior art keywords
frame
laser
unit
processing unit
transport
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011158884A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013022612A (ja
Inventor
欣也 太田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2011158884A priority Critical patent/JP5271394B2/ja
Priority to TW101115274A priority patent/TWI445587B/zh
Priority to CN201210167823.4A priority patent/CN102886608B/zh
Priority to KR1020120065474A priority patent/KR101398792B1/ko
Publication of JP2013022612A publication Critical patent/JP2013022612A/ja
Application granted granted Critical
Publication of JP5271394B2 publication Critical patent/JP5271394B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
JP2011158884A 2011-07-20 2011-07-20 レーザスクライブ装置 Expired - Fee Related JP5271394B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011158884A JP5271394B2 (ja) 2011-07-20 2011-07-20 レーザスクライブ装置
TW101115274A TWI445587B (zh) 2011-07-20 2012-04-27 Lightning scribing device
CN201210167823.4A CN102886608B (zh) 2011-07-20 2012-05-28 激光划线装置
KR1020120065474A KR101398792B1 (ko) 2011-07-20 2012-06-19 레이저 스크라이브 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011158884A JP5271394B2 (ja) 2011-07-20 2011-07-20 レーザスクライブ装置

Publications (2)

Publication Number Publication Date
JP2013022612A JP2013022612A (ja) 2013-02-04
JP5271394B2 true JP5271394B2 (ja) 2013-08-21

Family

ID=47530394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011158884A Expired - Fee Related JP5271394B2 (ja) 2011-07-20 2011-07-20 レーザスクライブ装置

Country Status (4)

Country Link
JP (1) JP5271394B2 (ko)
KR (1) KR101398792B1 (ko)
CN (1) CN102886608B (ko)
TW (1) TWI445587B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105479012A (zh) * 2015-12-25 2016-04-13 苏州爱能杰节能科技有限公司 一种自动激光打标机的激光打标装置
CN105479013A (zh) * 2015-12-25 2016-04-13 苏州爱能杰节能科技有限公司 一种自动激光打标机
CN105428968A (zh) * 2015-12-25 2016-03-23 苏州智合源电子科技有限公司 一种激光打标机的激光装置
CN110449744A (zh) * 2019-08-12 2019-11-15 安徽龙芯微科技有限公司 一种芯片加工用打标机及其操作方法
CN114889336B (zh) * 2022-05-24 2024-05-03 珠海海平办公设备有限公司 一种便于激光打印用辅助上料设备

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3257157B2 (ja) * 1993-07-16 2002-02-18 松下電器産業株式会社 Ｃｏ２レーザ穴加工装置及び方法
JP3457370B2 (ja) * 1993-12-27 2003-10-14 株式会社アマダ レーザ加工機
JP2002361411A (ja) * 2001-06-05 2002-12-18 Matsushita Electric Ind Co Ltd 加工装置
JP4006968B2 (ja) * 2001-09-28 2007-11-14 松下電器産業株式会社 レーザ加工装置
JP2003225786A (ja) * 2002-01-30 2003-08-12 Uht Corp レーザー加工ユニット及び該レーザー加工ユニットを備えた加工装置
JP2006061979A (ja) 2004-08-30 2006-03-09 Sunx Ltd レーザ加工装置
JP2009291815A (ja) * 2008-06-05 2009-12-17 Kyushu Mitoyo Kk レーザ加工装置
JP2010089143A (ja) * 2008-10-10 2010-04-22 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の割断方法及び割断装置
CN201324912Y (zh) * 2008-11-19 2009-10-14 深圳市大族激光科技股份有限公司 一种非晶硅薄膜太阳能电池激光刻划设备
JP5416445B2 (ja) * 2009-03-25 2014-02-12 三星ダイヤモンド工業株式会社 レーザスクライブ装置
JP2011020161A (ja) * 2009-07-17 2011-02-03 Kataoka Seisakusho:Kk レーザ加工機
JP5438422B2 (ja) * 2009-07-31 2014-03-12 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法並びに加工装置
JP5123923B2 (ja) * 2009-12-08 2013-01-23 三星ダイヤモンド工業株式会社 脆性基板の加工方法及び装置
CN101894883A (zh) * 2010-06-03 2010-11-24 江西赛维Best太阳能高科技有限公司 新型透光型非/微叠层硅基薄膜太阳电池激光刻划工艺
CN101983825A (zh) * 2010-10-09 2011-03-09 苏州德龙激光有限公司 Led晶圆皮秒激光划片装置

Also Published As

Publication number Publication date
KR101398792B1 (ko) 2014-05-30
KR20130011912A (ko) 2013-01-30
CN102886608A (zh) 2013-01-23
JP2013022612A (ja) 2013-02-04
CN102886608B (zh) 2015-07-08
TWI445587B (zh) 2014-07-21
TW201304893A (zh) 2013-02-01

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