JP5269990B2 - 湿度検出センサパッケージの製造方法 - Google Patents

湿度検出センサパッケージの製造方法 Download PDF

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Publication number
JP5269990B2
JP5269990B2 JP2011518426A JP2011518426A JP5269990B2 JP 5269990 B2 JP5269990 B2 JP 5269990B2 JP 2011518426 A JP2011518426 A JP 2011518426A JP 2011518426 A JP2011518426 A JP 2011518426A JP 5269990 B2 JP5269990 B2 JP 5269990B2
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Japan
Prior art keywords
humidity detection
detection sensor
partition member
substrate
base
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Expired - Fee Related
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JP2011518426A
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English (en)
Japanese (ja)
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JPWO2010140545A1 (ja
Inventor
進矢 横山
聡 和賀
澄人 森田
達也 斉藤
志浩 牛来
淳 遁所
崇 佐藤
浩司 佐藤
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Alps Alpine Co Ltd
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Alps Electric Co Ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/0004—Gaseous mixtures, e.g. polluted air
    • G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Food Science & Technology (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
JP2011518426A 2009-06-01 2010-05-28 湿度検出センサパッケージの製造方法 Expired - Fee Related JP5269990B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011518426A JP5269990B2 (ja) 2009-06-01 2010-05-28 湿度検出センサパッケージの製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2009132015 2009-06-01
JP2009132015 2009-06-01
PCT/JP2010/059086 WO2010140545A1 (ja) 2009-06-01 2010-05-28 湿度検出センサパッケージ及びその製造方法
JP2011518426A JP5269990B2 (ja) 2009-06-01 2010-05-28 湿度検出センサパッケージの製造方法

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JPWO2010140545A1 JPWO2010140545A1 (ja) 2012-11-15
JP5269990B2 true JP5269990B2 (ja) 2013-08-21

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CN (1) CN102341698B (zh)
WO (1) WO2010140545A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9914638B2 (en) 2015-01-14 2018-03-13 Sensirion Ag Sensor package

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202011051190U1 (de) * 2011-09-02 2011-11-21 Sensirion Ag Sensorbaustein
EP2765410B1 (en) 2014-06-06 2023-02-22 Sensirion AG Gas sensor package
JP6477225B2 (ja) * 2015-05-15 2019-03-06 富士通株式会社 ガスセンサデバイス部品、ガスセンサデバイス及びその製造方法、情報処理システム
EP3124962B1 (en) * 2015-07-29 2022-09-28 Sensirion AG Gas sensor array and a method for manufacturing thereof
JP6450506B2 (ja) * 2016-09-09 2019-01-16 北陸電気工業株式会社 容量型ガスセンサ
CN109690302B (zh) * 2016-09-30 2022-07-19 美蓓亚三美株式会社 湿度传感器
JP2019027842A (ja) * 2017-07-27 2019-02-21 株式会社デンソー 粒子センサ
JP2019184453A (ja) * 2018-04-12 2019-10-24 セイコーエプソン株式会社 センサーユニットおよび構造物監視装置

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61214566A (ja) * 1985-03-20 1986-09-24 Toshiba Corp 半導体光センサ装置
JPH0394453A (ja) * 1989-09-06 1991-04-19 Ibiden Co Ltd 電子部品搭載用基板
JPH07174599A (ja) * 1991-12-09 1995-07-14 Mitsubishi Electric Corp 半導体センサー装置およびその製造方法
JPH09162208A (ja) * 1995-12-08 1997-06-20 Denso Corp ベアチップ封止方法
JP2001196644A (ja) * 2000-01-11 2001-07-19 Nichia Chem Ind Ltd 光半導体装置及びその製造方法
JP2001210755A (ja) * 2000-01-28 2001-08-03 Nec Corp 半導体装置用基板および半導体装置の製造方法
JP2003318336A (ja) * 2002-04-25 2003-11-07 Kyocera Corp 電子部品装置及び製造方法
WO2004023126A1 (ja) * 2002-09-03 2004-03-18 Ngk Spark Plug Co., Ltd. シリコン製マイクロセンサの実装方法、製造方法およびシリコン製マイクロセンサ
JP2008064561A (ja) * 2006-09-06 2008-03-21 Denso Corp 湿度センサ
JP2008211124A (ja) * 2007-02-28 2008-09-11 Misuzu Kogyo:Kk 半導体装置収納パッケージ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN86102535B (zh) * 1986-10-17 1988-11-16 中国科学院上海冶金研究所 金属—氧化铝—硅结构湿度传感器及其制备工艺
KR100379471B1 (ko) * 2000-07-19 2003-04-10 엘지전자 주식회사 절대습도센서 및 이를 이용한 온/습도 검출 회로

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61214566A (ja) * 1985-03-20 1986-09-24 Toshiba Corp 半導体光センサ装置
JPH0394453A (ja) * 1989-09-06 1991-04-19 Ibiden Co Ltd 電子部品搭載用基板
JPH07174599A (ja) * 1991-12-09 1995-07-14 Mitsubishi Electric Corp 半導体センサー装置およびその製造方法
JPH09162208A (ja) * 1995-12-08 1997-06-20 Denso Corp ベアチップ封止方法
JP2001196644A (ja) * 2000-01-11 2001-07-19 Nichia Chem Ind Ltd 光半導体装置及びその製造方法
JP2001210755A (ja) * 2000-01-28 2001-08-03 Nec Corp 半導体装置用基板および半導体装置の製造方法
JP2003318336A (ja) * 2002-04-25 2003-11-07 Kyocera Corp 電子部品装置及び製造方法
WO2004023126A1 (ja) * 2002-09-03 2004-03-18 Ngk Spark Plug Co., Ltd. シリコン製マイクロセンサの実装方法、製造方法およびシリコン製マイクロセンサ
JP2008064561A (ja) * 2006-09-06 2008-03-21 Denso Corp 湿度センサ
JP2008211124A (ja) * 2007-02-28 2008-09-11 Misuzu Kogyo:Kk 半導体装置収納パッケージ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9914638B2 (en) 2015-01-14 2018-03-13 Sensirion Ag Sensor package

Also Published As

Publication number Publication date
WO2010140545A1 (ja) 2010-12-09
CN102341698B (zh) 2013-10-09
JPWO2010140545A1 (ja) 2012-11-15
CN102341698A (zh) 2012-02-01

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