JP5268061B2 - 基板検査装置 - Google Patents

基板検査装置 Download PDF

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Publication number
JP5268061B2
JP5268061B2 JP2008284702A JP2008284702A JP5268061B2 JP 5268061 B2 JP5268061 B2 JP 5268061B2 JP 2008284702 A JP2008284702 A JP 2008284702A JP 2008284702 A JP2008284702 A JP 2008284702A JP 5268061 B2 JP5268061 B2 JP 5268061B2
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Japan
Prior art keywords
inspection
substrate
light
inspection apparatus
focus
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Expired - Fee Related
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JP2008284702A
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English (en)
Japanese (ja)
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JP2010112803A (ja
JP2010112803A5 (enrdf_load_stackoverflow
Inventor
米澤  良
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Lasertec Corp
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Lasertec Corp
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Priority to JP2008284702A priority Critical patent/JP5268061B2/ja
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Publication of JP2010112803A5 publication Critical patent/JP2010112803A5/ja
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  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2008284702A 2008-11-05 2008-11-05 基板検査装置 Expired - Fee Related JP5268061B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008284702A JP5268061B2 (ja) 2008-11-05 2008-11-05 基板検査装置

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Application Number Priority Date Filing Date Title
JP2008284702A JP5268061B2 (ja) 2008-11-05 2008-11-05 基板検査装置

Publications (3)

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JP2010112803A JP2010112803A (ja) 2010-05-20
JP2010112803A5 JP2010112803A5 (enrdf_load_stackoverflow) 2011-12-01
JP5268061B2 true JP5268061B2 (ja) 2013-08-21

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JP2008284702A Expired - Fee Related JP5268061B2 (ja) 2008-11-05 2008-11-05 基板検査装置

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JP (1) JP5268061B2 (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014238534A (ja) 2013-06-10 2014-12-18 シャープ株式会社 光制御フィルムの検査装置および光制御フィルムの製造装置
US10495446B2 (en) 2015-06-29 2019-12-03 Kla-Tencor Corporation Methods and apparatus for measuring height on a semiconductor wafer
JP5961909B1 (ja) * 2015-11-17 2016-08-03 列真株式会社 欠陥検査装置
JP6517734B2 (ja) * 2016-06-09 2019-05-22 列真株式会社 散乱光検出ヘッド
JP6783644B2 (ja) * 2016-12-12 2020-11-11 株式会社日立製作所 異物検査装置
JP2019082496A (ja) * 2019-03-11 2019-05-30 列真株式会社 欠陥検査装置
JP7247075B2 (ja) * 2019-11-11 2023-03-28 株式会社東芝 レーザ光集光装置、レーザ光受光装置、およびレーザ光集光方法
JP7247077B2 (ja) * 2019-11-21 2023-03-28 株式会社東芝 受信用レーザ光受信装置、レーザ超音波計測装置およびレーザ超音波計測方法
JP7405685B2 (ja) * 2020-05-07 2023-12-26 レーザーテック株式会社 検査装置
KR20230090740A (ko) 2021-12-15 2023-06-22 삼성전자주식회사 광학 계측 설비, 그를 이용한 광학 계측 방법 및 그를 이용한 반도체 장치의 제조 방법
WO2023135681A1 (ja) * 2022-01-12 2023-07-20 株式会社日立ハイテク 表面検査装置
JP7692878B2 (ja) * 2022-06-23 2025-06-16 クアーズテック合同会社 光透過性板状体の欠陥検査方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61260211A (ja) * 1985-05-15 1986-11-18 Hitachi Ltd 自動異物検出方法及びその装置
JPH04194609A (ja) * 1990-11-27 1992-07-14 Kobe Steel Ltd 透明円板の欠陥検査装置
JPH05180778A (ja) * 1991-04-11 1993-07-23 Hitachi Electron Eng Co Ltd ガラス基板異物検査装置
JPH04120364U (ja) * 1991-04-12 1992-10-28 三菱重工業株式会社 欠陥検出装置
JPH10160683A (ja) * 1996-11-29 1998-06-19 Matsushita Electric Ind Co Ltd 異物検査方法とその装置
JP4543141B2 (ja) * 1999-07-13 2010-09-15 レーザーテック株式会社 欠陥検査装置
JP2001284423A (ja) * 2000-03-29 2001-10-12 Mitsubishi Electric Corp 半導体検査装置及び半導体装置の製造方法
JP4175766B2 (ja) * 2000-09-07 2008-11-05 株式会社日立ハイテクノロジーズ 透明基板検査装置
JP4547562B2 (ja) * 2005-01-17 2010-09-22 レーザーテック株式会社 検査装置
TWI428686B (zh) * 2006-12-05 2014-03-01 Hoya Corp 光罩之檢查裝置、光罩之檢查方法、液晶裝置製造用光罩之製造方法以及圖案轉印方法
JP4822548B2 (ja) * 2007-04-23 2011-11-24 レーザーテック株式会社 欠陥検査装置

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JP2010112803A (ja) 2010-05-20

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