JP5268061B2 - 基板検査装置 - Google Patents
基板検査装置 Download PDFInfo
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- JP5268061B2 JP5268061B2 JP2008284702A JP2008284702A JP5268061B2 JP 5268061 B2 JP5268061 B2 JP 5268061B2 JP 2008284702 A JP2008284702 A JP 2008284702A JP 2008284702 A JP2008284702 A JP 2008284702A JP 5268061 B2 JP5268061 B2 JP 5268061B2
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2008284702A JP5268061B2 (ja) | 2008-11-05 | 2008-11-05 | 基板検査装置 |
Applications Claiming Priority (1)
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JP2008284702A JP5268061B2 (ja) | 2008-11-05 | 2008-11-05 | 基板検査装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010112803A JP2010112803A (ja) | 2010-05-20 |
JP2010112803A5 JP2010112803A5 (enrdf_load_stackoverflow) | 2011-12-01 |
JP5268061B2 true JP5268061B2 (ja) | 2013-08-21 |
Family
ID=42301469
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2008284702A Expired - Fee Related JP5268061B2 (ja) | 2008-11-05 | 2008-11-05 | 基板検査装置 |
Country Status (1)
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JP (1) | JP5268061B2 (enrdf_load_stackoverflow) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014238534A (ja) | 2013-06-10 | 2014-12-18 | シャープ株式会社 | 光制御フィルムの検査装置および光制御フィルムの製造装置 |
US10495446B2 (en) | 2015-06-29 | 2019-12-03 | Kla-Tencor Corporation | Methods and apparatus for measuring height on a semiconductor wafer |
JP5961909B1 (ja) * | 2015-11-17 | 2016-08-03 | 列真株式会社 | 欠陥検査装置 |
JP6517734B2 (ja) * | 2016-06-09 | 2019-05-22 | 列真株式会社 | 散乱光検出ヘッド |
JP6783644B2 (ja) * | 2016-12-12 | 2020-11-11 | 株式会社日立製作所 | 異物検査装置 |
JP2019082496A (ja) * | 2019-03-11 | 2019-05-30 | 列真株式会社 | 欠陥検査装置 |
JP7247075B2 (ja) * | 2019-11-11 | 2023-03-28 | 株式会社東芝 | レーザ光集光装置、レーザ光受光装置、およびレーザ光集光方法 |
JP7247077B2 (ja) * | 2019-11-21 | 2023-03-28 | 株式会社東芝 | 受信用レーザ光受信装置、レーザ超音波計測装置およびレーザ超音波計測方法 |
JP7405685B2 (ja) * | 2020-05-07 | 2023-12-26 | レーザーテック株式会社 | 検査装置 |
KR20230090740A (ko) | 2021-12-15 | 2023-06-22 | 삼성전자주식회사 | 광학 계측 설비, 그를 이용한 광학 계측 방법 및 그를 이용한 반도체 장치의 제조 방법 |
WO2023135681A1 (ja) * | 2022-01-12 | 2023-07-20 | 株式会社日立ハイテク | 表面検査装置 |
JP7692878B2 (ja) * | 2022-06-23 | 2025-06-16 | クアーズテック合同会社 | 光透過性板状体の欠陥検査方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61260211A (ja) * | 1985-05-15 | 1986-11-18 | Hitachi Ltd | 自動異物検出方法及びその装置 |
JPH04194609A (ja) * | 1990-11-27 | 1992-07-14 | Kobe Steel Ltd | 透明円板の欠陥検査装置 |
JPH05180778A (ja) * | 1991-04-11 | 1993-07-23 | Hitachi Electron Eng Co Ltd | ガラス基板異物検査装置 |
JPH04120364U (ja) * | 1991-04-12 | 1992-10-28 | 三菱重工業株式会社 | 欠陥検出装置 |
JPH10160683A (ja) * | 1996-11-29 | 1998-06-19 | Matsushita Electric Ind Co Ltd | 異物検査方法とその装置 |
JP4543141B2 (ja) * | 1999-07-13 | 2010-09-15 | レーザーテック株式会社 | 欠陥検査装置 |
JP2001284423A (ja) * | 2000-03-29 | 2001-10-12 | Mitsubishi Electric Corp | 半導体検査装置及び半導体装置の製造方法 |
JP4175766B2 (ja) * | 2000-09-07 | 2008-11-05 | 株式会社日立ハイテクノロジーズ | 透明基板検査装置 |
JP4547562B2 (ja) * | 2005-01-17 | 2010-09-22 | レーザーテック株式会社 | 検査装置 |
TWI428686B (zh) * | 2006-12-05 | 2014-03-01 | Hoya Corp | 光罩之檢查裝置、光罩之檢查方法、液晶裝置製造用光罩之製造方法以及圖案轉印方法 |
JP4822548B2 (ja) * | 2007-04-23 | 2011-11-24 | レーザーテック株式会社 | 欠陥検査装置 |
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2008
- 2008-11-05 JP JP2008284702A patent/JP5268061B2/ja not_active Expired - Fee Related
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JP2010112803A (ja) | 2010-05-20 |
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