JP5266438B2 - センサ装置 - Google Patents
センサ装置 Download PDFInfo
- Publication number
- JP5266438B2 JP5266438B2 JP2010501361A JP2010501361A JP5266438B2 JP 5266438 B2 JP5266438 B2 JP 5266438B2 JP 2010501361 A JP2010501361 A JP 2010501361A JP 2010501361 A JP2010501361 A JP 2010501361A JP 5266438 B2 JP5266438 B2 JP 5266438B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- contact element
- sensor
- sensor device
- collar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 claims description 14
- 238000000465 moulding Methods 0.000 claims description 14
- 230000008878 coupling Effects 0.000 claims description 11
- 238000010168 coupling process Methods 0.000 claims description 11
- 238000005859 coupling reaction Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000926 separation method Methods 0.000 claims description 2
- 239000000428 dust Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6683—Structural association with built-in electrical component with built-in electronic circuit with built-in sensor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/026—Housings for speed measuring devices, e.g. pulse generator
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/24—Assembling by moulding on contact members
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/26—Connectors or connections adapted for particular applications for vehicles
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Manufacture Of Switches (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Description
Claims (8)
- 接触素子(6)及びセンサ素子(3)を含むセンサ装置(1)の製造方法であって、接触素子(6)が、一方ではセンサ素子(3)に電気接触し、他方では接触ピン(4)に電気接触しているものにおいて、
接触素子(6)を成形金型へ挿入し、
ただ1つの被覆成形過程においてプラスチック体(5)で接触素子(6)を被覆成形し、その際成形金型内の接触素子(6)を固定位置(7)に保持し、被覆成形過程後に固定位置(7)を露出させ、
固定位置(7)の周りにプラスチック材料からカラー(8)を形成し、その際 接触素子(6)の露出する個所を包囲するようにカラー(8)を形成し、
センサ素子(3)をプラスチック体(5)の受け入れ部(10)へ挿入し、
センサ素子(3)を接触素子(6)と接触させる
ことを特徴とする方法。 - 被覆成形の際同時にカラー(8)を固定位置(7)の周りに形成することを特徴とする、請求項1に記載の方法。
- 被覆成形中に、接触素子(6)に一体に形成されている結合体(9)を介して接触素子(6)を保持し、被覆成形後に、接触素子(6)を結合体(9)から分離することを特徴とする、請求項1又は2に記載の方法。
- すべての接触ピン(4)を介して接触素子(6)を結合体(9)に結合することを特徴とする、請求項3に記載の方法。
- カラー(8)の形成後にこれらのカラー(8)を、固定位置(7)を覆うように押しつぶし、従って押しつぶし後以前に露出していた接触素子(6)の個所が固定位置(7)においてもはや露出しないことを特徴とする、請求項1〜4の1つに記載の方法。
- 請求項1〜5の1つに記載の方法により製造されるセンサ装置(1)であって、センサ素子(3)、及び一方ではセンサ素子(3)にまた他方では接触ピン(4)に電気的に接触する接触素子(6)を持ち、接触素子(6)がプラスチック体(5)により被覆成形されており、被覆成形の際接触素子(6)が固定され従って被覆成形後接触素子(6)が露出している固定位置(7)が、接触素子(6)の露出する個所を包囲するそれぞれ1つのプラスチック材料製カラー(8)を持っていることを特徴とする、センサ装置。
- カラー(8)が、プラスチック体(5)にそれぞれ一体に形成されていること を特徴とする、請求項6に記載のセンサ装置。
- センサ素子(3)を少なくとも部分的に覆う蓋(2)が、プラスチック体(5)に結合されていることを特徴とする、請求項6又は7に記載のセンサ装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007014279.1 | 2007-03-19 | ||
DE102007014279 | 2007-03-19 | ||
PCT/DE2008/000189 WO2008113312A1 (de) | 2007-03-19 | 2008-02-02 | Sensoranordnung |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010521695A JP2010521695A (ja) | 2010-06-24 |
JP5266438B2 true JP5266438B2 (ja) | 2013-08-21 |
Family
ID=39418221
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010501361A Active JP5266438B2 (ja) | 2007-03-19 | 2008-02-02 | センサ装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8286469B2 (ja) |
EP (1) | EP2122784B1 (ja) |
JP (1) | JP5266438B2 (ja) |
DE (1) | DE112008000345A5 (ja) |
WO (1) | WO2008113312A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009028963A1 (de) * | 2009-08-28 | 2011-03-03 | Robert Bosch Gmbh | Anschlussanordnung für eine Sensoranordnung und Sensoranordnung |
CN103987215B (zh) * | 2013-02-08 | 2017-05-03 | 佳能企业股份有限公司 | 壳体结构及应用该结构的电子装置 |
DE102015219571A1 (de) | 2015-10-09 | 2017-04-13 | Conti Temic Microelectronic Gmbh | Sensordom-Anordnung |
DE102015219569B4 (de) | 2015-10-09 | 2024-05-16 | Vitesco Technologies Germany Gmbh | Elektronische Anordnung, Kombination und Verfahren zur Montage einer elektronischen Anordnung |
DE102016207664A1 (de) | 2016-05-03 | 2017-11-09 | Continental Teves Ag & Co. Ohg | Sensorelement für ein kraftfahrzeug |
DE102016210519B4 (de) * | 2016-06-14 | 2020-09-10 | Robert Bosch Gmbh | Sensoranordnung und Verfahren zur Herstellung einer Sensoranordnung |
DE102016225174A1 (de) * | 2016-12-15 | 2018-06-21 | Conti Temic Microelectronic Gmbh | Selbsttragender Anschlussrahmen für einen Sensorturm |
DE102016226156A1 (de) * | 2016-12-23 | 2018-06-28 | Conti Temic Microelectronic Gmbh | Sensoranordnung und Steuergerät mit Sensoranordnung |
DE102017214780A1 (de) | 2017-08-23 | 2019-02-28 | Conti Temic Microelectronic Gmbh | Sensorbauteil, Vormontageanordnung für ein Sensorbauteil und Verfahren zur Herstellung eines Sensorbauteils |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3611224A1 (de) | 1986-04-04 | 1987-10-08 | Siemens Ag | Herstellungsverfahren eines kombinationsteils aus kunststoff mit einem einlegeteil |
WO1993014618A1 (en) * | 1992-01-13 | 1993-07-22 | Asm-Fico Tooling B.V. | Apparatus for moulding a lead frame and chips arranged thereon |
JP3223769B2 (ja) * | 1995-10-11 | 2001-10-29 | 三菱電機株式会社 | 回転センサとその製造方法 |
JPH11185926A (ja) * | 1997-12-25 | 1999-07-09 | Yazaki Corp | コネクタ、コネクタの製造方法及びこの製造方法に用いられる型構造 |
US6561038B2 (en) * | 2000-01-06 | 2003-05-13 | Rosemount Inc. | Sensor with fluid isolation barrier |
US6759594B2 (en) * | 2001-08-16 | 2004-07-06 | Nissin Kogyo Co., Ltd. | Wheel speed sensor, method for producing the same, terminal and method for welding terminal and electric wire |
JP3840948B2 (ja) * | 2001-10-17 | 2006-11-01 | 株式会社大泉製作所 | 温度測定センサと、温度測定センサの製造方法並びに温度測定センサの製造に用いる成形型 |
FR2837926B1 (fr) * | 2002-03-27 | 2004-05-28 | Siemens Vdo Automotive | Procede de fabrication d'un capteur de vitesse d'une roue et capteur correspondant |
FR2861836B1 (fr) * | 2003-10-29 | 2006-03-10 | Siemens Vdo Automotive | Bougie de prechauffage comprenant un capteur de pression et moteur ainsi equipe |
JP4661236B2 (ja) * | 2005-01-28 | 2011-03-30 | アイシン精機株式会社 | 回転検出センサ |
JP2006307834A (ja) * | 2005-03-31 | 2006-11-09 | Ngk Spark Plug Co Ltd | 燃焼圧センサおよびそれを備えたグロープラグ |
FR2884298B1 (fr) * | 2005-04-12 | 2007-08-10 | Siemens Vdo Automotive Sas | Bougie de prechauffage a capteur de pression integre |
US7269992B2 (en) * | 2005-06-15 | 2007-09-18 | Honeywell International Inc. | Magnet orientation and calibration for small package turbocharger speed sensor |
DE102005039086B4 (de) * | 2005-08-04 | 2007-10-31 | Prettl, Rolf | Verfahren zum Herstellen einer elektrischen Verbindungseinrichtung sowie derart hergestellte Verbindungseinrichtung |
DE602005021236D1 (de) * | 2005-12-30 | 2010-06-24 | Schlumberger Technology Bv | Dichte- und Viskositätssensor |
EP2005126B1 (de) * | 2006-04-03 | 2017-07-26 | vonRoll infratec (investment) ag | Schwingungssensoranordnung |
US7600433B2 (en) * | 2007-02-23 | 2009-10-13 | Silicon Micro Sensors Gmbh | Pressure sensor with roughened and treated surface for improving adhesive strength and method of manufacturing the sensor |
JP2008261796A (ja) * | 2007-04-13 | 2008-10-30 | Denso Corp | 温度センサ一体型圧力センサ装置 |
JP5027834B2 (ja) * | 2008-07-14 | 2012-09-19 | 日本特殊陶業株式会社 | ノッキングセンサ |
-
2008
- 2008-02-02 WO PCT/DE2008/000189 patent/WO2008113312A1/de active Application Filing
- 2008-02-02 EP EP08706854.0A patent/EP2122784B1/de active Active
- 2008-02-02 US US12/531,622 patent/US8286469B2/en active Active
- 2008-02-02 JP JP2010501361A patent/JP5266438B2/ja active Active
- 2008-02-02 DE DE112008000345T patent/DE112008000345A5/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP2122784A1 (de) | 2009-11-25 |
US8286469B2 (en) | 2012-10-16 |
EP2122784B1 (de) | 2014-01-15 |
US20100071449A1 (en) | 2010-03-25 |
JP2010521695A (ja) | 2010-06-24 |
WO2008113312A1 (de) | 2008-09-25 |
DE112008000345A5 (de) | 2009-11-05 |
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