JP5265875B2 - ワイヤ取付具の幾何学的データを決定するための方法および装置 - Google Patents

ワイヤ取付具の幾何学的データを決定するための方法および装置 Download PDF

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JP5265875B2
JP5265875B2 JP2007058149A JP2007058149A JP5265875B2 JP 5265875 B2 JP5265875 B2 JP 5265875B2 JP 2007058149 A JP2007058149 A JP 2007058149A JP 2007058149 A JP2007058149 A JP 2007058149A JP 5265875 B2 JP5265875 B2 JP 5265875B2
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distance
wire
measurement
wire fixture
determined
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JP2007248463A5 (OSRAM
JP2007248463A (ja
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シユテフアン・ビビロリ
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コマツクス・ホールデイング・アー・ゲー
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/04—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for forming connections by deformation, e.g. crimping tool
    • H01R43/048—Crimping apparatus or processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
JP2007058149A 2006-03-16 2007-03-08 ワイヤ取付具の幾何学的データを決定するための方法および装置 Active JP5265875B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06111270.2 2006-03-16
EP06111270 2006-03-16

Publications (3)

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JP2007248463A JP2007248463A (ja) 2007-09-27
JP2007248463A5 JP2007248463A5 (OSRAM) 2010-04-22
JP5265875B2 true JP5265875B2 (ja) 2013-08-14

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JP2007058149A Active JP5265875B2 (ja) 2006-03-16 2007-03-08 ワイヤ取付具の幾何学的データを決定するための方法および装置

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Country Link
US (1) US7794292B2 (OSRAM)
EP (1) EP1837622B1 (OSRAM)
JP (1) JP5265875B2 (OSRAM)
DE (1) DE502007000626D1 (OSRAM)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7617066B2 (en) * 2007-10-03 2009-11-10 Delphi Technologies, Inc. Virtual crimp validation system
JP5297277B2 (ja) * 2009-06-22 2013-09-25 矢崎総業株式会社 電線と端子の圧着部評価方法および装置
CN102270809A (zh) * 2010-09-08 2011-12-07 苏州新亚电通有限公司 端子压接的金相控制方法
DE102011004298A1 (de) * 2011-02-17 2012-08-23 Robert Bosch Gmbh Verfahren und Vorrichtung zur qualitätssichernden Herstellung eine Crimpung
US20120263344A1 (en) * 2011-04-12 2012-10-18 Stefan Viviroli Measuring apparatus and method for determining at least of the crimp height of a conductor crimp
JP5521011B2 (ja) * 2012-08-07 2014-06-11 古河電気工業株式会社 圧着端子、接続構造体及びコネクタ
MX364007B (es) * 2014-06-11 2019-04-10 Pkc Wiring Systems Oy Arreglo de sensor, dispositivo medidor y metodo de medicion.
JP6933222B2 (ja) 2017-09-11 2021-09-08 横浜ゴム株式会社 ホース継手金具の形状測定装置、ホース継手金具の形状測定方法およびホース継手金具の形状測定プログラム
PL238772B1 (pl) * 2017-09-27 2021-10-04 Zakl Metalowe Erko R Petlak Spolka Jawna Bracia Petlak Sposób zaciskania złączek lub końcówek kablowych
CN109015481B (zh) * 2018-07-25 2020-08-11 中国航空工业集团公司西安飞行自动控制研究所 一种电缆三坐标轴定位工具
DE102019215642A1 (de) 2019-10-11 2021-04-15 Schäfer Werkzeug- und Sondermaschinenbau GmbH Kennzeichnungselement, Verarbeitungssystem sowie Verfahren
WO2023105380A1 (en) * 2021-12-06 2023-06-15 Sandeep Suhas Patki A system for determining the details of a physical parameter of crimps

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5146717B2 (OSRAM) * 1972-06-21 1976-12-10
FR2553914B1 (fr) * 1983-10-25 1986-01-03 Sumitomo Electric Industries Procede d'inspection de bornes connectees par sertissage
US4856186A (en) * 1988-11-04 1989-08-15 Amp Incorporated Apparatus and method for determination of crimp height
JPH04169804A (ja) * 1990-11-02 1992-06-17 Fuji Electric Co Ltd 光式形状測定装置
JPH0650730A (ja) * 1992-08-03 1994-02-25 Yunisun:Kk 三次元形状計測装置
JPH06249625A (ja) * 1993-02-26 1994-09-09 Kenji Mimura 三次元形状解析システム
JPH06307825A (ja) * 1993-04-23 1994-11-04 Hitachi Ltd 寸法測定方法および装置並びにそれが使用された外観検査装置
JP3028724B2 (ja) * 1994-02-09 2000-04-04 住友電装株式会社 クリンプハイト測定装置
JP3506510B2 (ja) * 1994-11-08 2004-03-15 アジア航測株式会社 ソリッドモデリングに有用なスライス計測法
JPH09171878A (ja) * 1995-12-20 1997-06-30 Yazaki Corp 電線端末検査装置用照明装置
JPH1089906A (ja) * 1996-09-12 1998-04-10 Yazaki Corp 端子かしめ部の寸法測定方法および寸法測定装置
CA2284025C (en) * 1997-03-24 2004-01-13 Uteda - Dr. Niebuhr Gmbh Measuring system using laser technique for three-dimensional objects
DE19811573C1 (de) * 1998-03-17 1999-06-02 Siemens Ag Messung der Schlaglänge an Kabeln
GB0008303D0 (en) * 2000-04-06 2000-05-24 British Aerospace Measurement system and method
JP2003344026A (ja) * 2002-05-27 2003-12-03 Mitsubishi Heavy Ind Ltd 中空翼検査方法、及び中空翼検査用コンピュータプログラム
JP3876234B2 (ja) * 2003-06-17 2007-01-31 ファナック株式会社 コネクタ把持装置、同装置を備えたコネクタ検査システム及びコネクタ接続システム
EP1780846B1 (de) 2005-10-27 2009-03-18 komax Holding AG Messkopf und Verfahren zur Bestimmung der Crimphöhe eines Leitercrimps

Also Published As

Publication number Publication date
US20070218749A1 (en) 2007-09-20
US7794292B2 (en) 2010-09-14
DE502007000626D1 (de) 2009-06-04
EP1837622A1 (de) 2007-09-26
JP2007248463A (ja) 2007-09-27
EP1837622B1 (de) 2009-04-22

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