JP5257729B2 - 研磨装置 - Google Patents
研磨装置 Download PDFInfo
- Publication number
- JP5257729B2 JP5257729B2 JP2007200771A JP2007200771A JP5257729B2 JP 5257729 B2 JP5257729 B2 JP 5257729B2 JP 2007200771 A JP2007200771 A JP 2007200771A JP 2007200771 A JP2007200771 A JP 2007200771A JP 5257729 B2 JP5257729 B2 JP 5257729B2
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- Prior art keywords
- polishing
- polished
- wafer
- polishing member
- head housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005498 polishing Methods 0.000 title claims description 141
- 238000012423 maintenance Methods 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 description 20
- 230000002093 peripheral effect Effects 0.000 description 19
- 125000006850 spacer group Chemical group 0.000 description 9
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000005489 elastic deformation Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910000963 austenitic stainless steel Inorganic materials 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
30 研磨ヘッド
33 ドライブプレート(支持板)
40 研磨部材保持部
50 研磨部材
63 パッドプレート 64 プレート部材
65 研磨パッド 66 研磨面
90 ウェハ(被研磨物)
95 ウェハ保持装置
Claims (2)
- 被研磨物を保持する保持装置と、前記保持装置に保持された前記被研磨物を研磨可能な研磨部材を有する研磨ヘッドとを備え、前記研磨部材を前記被研磨物に当接させながら相対移動させて前記被研磨物の研磨を行うように構成された研磨装置において、
前記研磨ヘッドは、前記保持装置に保持された前記被研磨物と対向するように開口が形成されたヘッドハウジングと、前記ヘッドハウジングの内側に設けられて前記開口を塞ぐように前記研磨部材を保持する研磨部材保持部とを有し、
前記研磨部材保持部は、略平板状に形成されて厚さ方向に弾性を有し前記ヘッドハウジングの内側部と前記研磨部材とに連結される複数の支持板を有し、
前記複数の支持板はそれぞれ、前記研磨部材が前記被研磨物に当接するときに作用する外力に応じて弾性変形可能な厚さを有しており、
前記複数の支持板は、前記被研磨物に向かう方向に互いに間隙をおいて平行に配置されており、前記ヘッドハウジングの内側部と前記研磨部材とに跨って連結されることを特徴とする研磨装置。 - 前記研磨部材は、前記ヘッドハウジング内に給排される空気を利用して前記被研磨物に向かう方向へ往復移動可能に前記研磨部材保持部に保持されることを特徴とする請求項1に記載の研磨装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007200771A JP5257729B2 (ja) | 2007-08-01 | 2007-08-01 | 研磨装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007200771A JP5257729B2 (ja) | 2007-08-01 | 2007-08-01 | 研磨装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013091923A Division JP2013173226A (ja) | 2013-04-25 | 2013-04-25 | 研磨装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009034768A JP2009034768A (ja) | 2009-02-19 |
JP5257729B2 true JP5257729B2 (ja) | 2013-08-07 |
Family
ID=40437170
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007200771A Active JP5257729B2 (ja) | 2007-08-01 | 2007-08-01 | 研磨装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5257729B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5408790B2 (ja) * | 2009-03-06 | 2014-02-05 | エルジー・ケム・リミテッド | フロートガラス研磨システム |
JP5408788B2 (ja) * | 2009-03-06 | 2014-02-05 | エルジー・ケム・リミテッド | フロートガラス研磨システム |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3076291B2 (ja) * | 1997-12-02 | 2000-08-14 | 日本電気株式会社 | 研磨装置 |
JP2000343422A (ja) * | 1999-06-04 | 2000-12-12 | Mitsubishi Materials Corp | ウェーハ研磨装置及びウェーハ製造方法 |
JP4402228B2 (ja) * | 1999-12-21 | 2010-01-20 | パナソニック株式会社 | 研磨工具、研磨装置および研磨方法 |
JP2007152498A (ja) * | 2005-12-06 | 2007-06-21 | Nikon Corp | 研磨装置、研磨方法、この研磨方法を用いた半導体デバイスの製造方法及びこの半導体デバイスの製造方法により製造された半導体デバイス |
-
2007
- 2007-08-01 JP JP2007200771A patent/JP5257729B2/ja active Active
Also Published As
Publication number | Publication date |
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JP2009034768A (ja) | 2009-02-19 |
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