JP5255742B2 - 導電性トラックを設けた透明基板 - Google Patents
導電性トラックを設けた透明基板 Download PDFInfo
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- JP5255742B2 JP5255742B2 JP2001576726A JP2001576726A JP5255742B2 JP 5255742 B2 JP5255742 B2 JP 5255742B2 JP 2001576726 A JP2001576726 A JP 2001576726A JP 2001576726 A JP2001576726 A JP 2001576726A JP 5255742 B2 JP5255742 B2 JP 5255742B2
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- screen
- paste
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- 239000000758 substrate Substances 0.000 title claims abstract description 27
- 238000007650 screen-printing Methods 0.000 claims abstract description 34
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052709 silver Inorganic materials 0.000 claims abstract description 22
- 239000004332 silver Substances 0.000 claims abstract description 22
- 238000000576 coating method Methods 0.000 claims abstract description 19
- 239000011248 coating agent Substances 0.000 claims abstract description 17
- 239000002245 particle Substances 0.000 claims abstract description 17
- 230000009974 thixotropic effect Effects 0.000 claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 22
- 238000007639 printing Methods 0.000 claims description 20
- 238000010304 firing Methods 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 206010034972 Photosensitivity reaction Diseases 0.000 claims description 4
- 239000000839 emulsion Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 description 17
- 239000011521 glass Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 241001604129 Polydactylus Species 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000001447 compensatory effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000005336 safety glass Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Surface Heating Bodies (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Electric Cables (AREA)
- Non-Insulated Conductors (AREA)
- Surface Treatment Of Glass (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Conductive Materials (AREA)
- Printing Methods (AREA)
Description
Claims (20)
- 透明基板上に導電性のトラックを作製する方法であって、トラックの所定のパターンを形成するために、透明基板の表面にスクリーン印刷によって導電性ペーストが塗布されて、前記トラックが焼成され、
スクリーン印刷時にスクリーンとドクターブレードとの間に印加される剪断応力下の粘度に対する非剪断応力下の粘度の比率が少なくとも50であり、35%よりも多い銀含有量を有し、銀粒子の少なくとも98%が25μmよりも小さいサイズを有するチキソトロピーペーストが使用され、かつスクリーンが使用され、該スクリーンのコーティングが、少なくとも部分的にミゾを設けられ、印刷によって形成される導電性トラックの最小の幅が0.3mm以下となるように、前記ミゾの最も狭い幅が約0.25mm±0.05mmにほぼ等しく、
スクリーンのコーティングの厚さが50μmから100μmの間であり、一回通過の印刷によって形成され焼成されて得られた導電性トラックの厚さが35μm未満であり、
前記チキソトロピーペーストが、ドクターブレードを用いてスクリーンを通して透明基板の表面に塗布され、前記ドクターブレードが、65から85のショア硬さAを有し、かつ直角であるか、45°で面取りされるか、または丸くされた印刷エッジを有することを特徴とする方法。
- 前記ペーストの粒子の98%が、25μm以下のサイズを有する粒子から成ること、およびスクリーンが、1cm当たり少なくとも90本の糸を有することを特徴とする請求項1に記載の方法。
- 50%よりも多い銀含有量を有し、銀の粒子のうちの少なくとも98%が12μmよりも小さいサイズを有するチキソトロピーペーストが使用されることを特徴とする請求項1および2のいずれかに記載の方法。
- 前記銀含有量が、70%より多いことを特徴とする請求項3に記載の方法。
- 1cm当たり少なくとも95本の糸を有するスクリーンが使用されること、および個々の導電性トラックが印刷によって塗布され、導電性トラックの最小の幅が0.25mmよりも小さいことを特徴とする請求項1から4のいずれか一項に記載の方法。
- スクリーンがコーティングを設けられ、印刷パターンに対応するコーティングのエッジが、厚さの範囲内で実質的に平行であることを特徴とする請求項1から5のいずれか一項に記載の方法。
- スクリーンが使用され、前記スクリーンのコーティングが、予め感光化された光架橋可能な樹脂の照射によって得られることを特徴とする請求項1から6のいずれか一項に記載の方法。
- 前記光架橋可能な樹脂が、エマルジョンの形態、またはスクリーンの表面に塗布される前記光架橋可能な樹脂を支持するフィルムの形態で堆積されることを特徴とする請求項7に記載の方法。
- 80%以上の銀含有量を有するチキソトロピーのペーストが使用されること、および個々の導電性トラックが形成され、前記導電性トラックの最小の幅が0.1mmから0.25mmの間であることを特徴とする請求項1から8のいずれか一項に記載の方法。
- 1cm当たり少なくとも90本の糸を含む印刷スクリーンを使用する請求項1から9のいずれか一項に記載の方法。
- 印刷スクリーンが、1cm当たり95本の糸を含むことを特徴とする請求項10に記載の方法。
- 透明基板が導電性トラックを含み、該導電性トラックの最小幅が0.3mm以下である、請求項1から11のいずれか一項に記載の方法によって得られる透明基板。
- 透明基板が、グレージングパネルであることを特徴とする請求項12に記載の基板。
- 導電性トラックの最小幅が、0.25mm以下であることを特徴とする請求項12に記載の基板。
- 導電性トラックが、35%よりも多い銀含有量を有するスクリーン印刷ペーストから成ることを特徴とする請求項12から14のいずれか一項に記載の基板。
- 導電性トラックが、50%よりも多い銀含有量を有するスクリーン印刷ペーストから成ることを特徴とする請求項15に記載の基板。
- スクリーン印刷ペーストの銀含有量が、70%よりも多いことを特徴とする請求項16に記載の基板。
- 導電性トラックが、35μmよりも低い高さで表面の上に隆起していることを特徴とする請求項12から17のいずれか一項に記載の基板。
- さらに2つの電流のバー状母線を含み、該電流のバー状母線の間に導電性トラックが置かれ、該導電性トラックの少なくとも複数部分が0.3mm以下の幅を有し、前記バー状母線の付近で温度が、11から14ボルトの電源電圧についての450ワットを超えない公称電力について、標準的な周囲温度条件下で50℃を超えないことを特徴とする請求項12から18のいずれか一項に記載の基板。
- アンテナまたはアラームを備えて加熱される自動車用グレージングパネルとしての請求項12から19のいずれか一項に記載の基板の使用。
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10018902.4 | 2000-04-14 | ||
DE10018902 | 2000-04-14 | ||
DE10038768.3 | 2000-08-09 | ||
DE10038768A DE10038768A1 (de) | 2000-04-14 | 2000-08-09 | Verfahren zum Herstellen von elektrischen Leiterbahnen auf Glasscheiben und transparentes Substrat mit einem Muster aus elektrisch leitfähigen Leiterbahnen |
DE10056777.0 | 2000-11-16 | ||
DE10056777A DE10056777A1 (de) | 2000-04-14 | 2000-11-16 | Verfahren zum Herstellen von elektrischen Leiterbahnen auf Glasscheiben und transparentes Substrat mit einem Muster aus elektrisch leitfähigen Leiterbahnen |
FR00/16199 | 2000-12-13 | ||
FR0016199A FR2818087B3 (fr) | 2000-12-13 | 2000-12-13 | Procede de fabrication de pistes electroconductrices sur un substrat transparent et substrat obtenu |
PCT/FR2001/001175 WO2001080608A1 (fr) | 2000-04-14 | 2001-04-17 | Substrat transparent pourvu de pistes electroconductrices |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012222864A Division JP2013062249A (ja) | 2000-04-14 | 2012-10-05 | 導電性トラックを設けた透明基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2003531461A JP2003531461A (ja) | 2003-10-21 |
JP5255742B2 true JP5255742B2 (ja) | 2013-08-07 |
Family
ID=41394093
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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JP2001576726A Expired - Fee Related JP5255742B2 (ja) | 2000-04-14 | 2001-04-17 | 導電性トラックを設けた透明基板 |
JP2012222864A Pending JP2013062249A (ja) | 2000-04-14 | 2012-10-05 | 導電性トラックを設けた透明基板 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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JP2012222864A Pending JP2013062249A (ja) | 2000-04-14 | 2012-10-05 | 導電性トラックを設けた透明基板 |
Country Status (17)
Country | Link |
---|---|
US (2) | US7053313B2 (ja) |
EP (1) | EP2140742B1 (ja) |
JP (2) | JP5255742B2 (ja) |
KR (1) | KR100758255B1 (ja) |
CN (1) | CN1279797C (ja) |
AT (1) | ATE511743T1 (ja) |
AU (1) | AU5486201A (ja) |
BE (1) | BE1014124A5 (ja) |
BR (1) | BRPI0110089B1 (ja) |
CA (1) | CA2405991C (ja) |
CZ (1) | CZ307170B6 (ja) |
IT (1) | ITMI20010807A1 (ja) |
MX (1) | MXPA02010116A (ja) |
PL (1) | PL198898B1 (ja) |
PT (1) | PT2140742E (ja) |
SK (1) | SK287628B6 (ja) |
WO (1) | WO2001080608A1 (ja) |
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EP3762871B1 (en) | 2018-03-07 | 2024-08-07 | X-Card Holdings, LLC | Metal card |
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-
2001
- 2001-04-13 IT IT2001MI000807A patent/ITMI20010807A1/it unknown
- 2001-04-17 WO PCT/FR2001/001175 patent/WO2001080608A1/fr active Application Filing
- 2001-04-17 BR BRPI0110089-0A patent/BRPI0110089B1/pt not_active IP Right Cessation
- 2001-04-17 AT AT01927980T patent/ATE511743T1/de not_active IP Right Cessation
- 2001-04-17 CN CNB01811217XA patent/CN1279797C/zh not_active Expired - Fee Related
- 2001-04-17 PL PL365984A patent/PL198898B1/pl unknown
- 2001-04-17 KR KR1020027013671A patent/KR100758255B1/ko active IP Right Grant
- 2001-04-17 MX MXPA02010116A patent/MXPA02010116A/es active IP Right Grant
- 2001-04-17 BE BE2001/0259A patent/BE1014124A5/fr not_active IP Right Cessation
- 2001-04-17 CZ CZ2002-3414A patent/CZ307170B6/cs not_active IP Right Cessation
- 2001-04-17 SK SK1475-2002A patent/SK287628B6/sk not_active IP Right Cessation
- 2001-04-17 EP EP01927980A patent/EP2140742B1/fr not_active Expired - Lifetime
- 2001-04-17 AU AU54862/01A patent/AU5486201A/en not_active Abandoned
- 2001-04-17 US US10/257,439 patent/US7053313B2/en not_active Expired - Lifetime
- 2001-04-17 CA CA002405991A patent/CA2405991C/fr not_active Expired - Lifetime
- 2001-04-17 JP JP2001576726A patent/JP5255742B2/ja not_active Expired - Fee Related
- 2001-04-17 PT PT01927980T patent/PT2140742E/pt unknown
-
2005
- 2005-10-25 US US11/256,924 patent/US7582833B2/en not_active Expired - Fee Related
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2012
- 2012-10-05 JP JP2012222864A patent/JP2013062249A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
PT2140742E (pt) | 2011-09-08 |
SK14752002A3 (sk) | 2003-04-01 |
JP2013062249A (ja) | 2013-04-04 |
PL365984A1 (en) | 2005-01-24 |
BE1014124A5 (fr) | 2003-05-06 |
WO2001080608A1 (fr) | 2001-10-25 |
BRPI0110089B1 (pt) | 2015-08-18 |
JP2003531461A (ja) | 2003-10-21 |
EP2140742B1 (fr) | 2011-06-01 |
ATE511743T1 (de) | 2011-06-15 |
PL198898B1 (pl) | 2008-07-31 |
MXPA02010116A (es) | 2003-06-04 |
KR100758255B1 (ko) | 2007-09-13 |
AU5486201A (en) | 2001-10-30 |
CZ307170B6 (cs) | 2018-02-21 |
US7582833B2 (en) | 2009-09-01 |
KR20040029941A (ko) | 2004-04-08 |
SK287628B6 (sk) | 2011-04-05 |
US20040031146A1 (en) | 2004-02-19 |
BR0110089A (pt) | 2004-12-28 |
ITMI20010807A0 (it) | 2001-04-13 |
CN1436439A (zh) | 2003-08-13 |
CZ20023414A3 (cs) | 2003-08-13 |
US20060065435A1 (en) | 2006-03-30 |
US7053313B2 (en) | 2006-05-30 |
CN1279797C (zh) | 2006-10-11 |
EP2140742A1 (fr) | 2010-01-06 |
CA2405991C (fr) | 2009-07-14 |
CA2405991A1 (fr) | 2001-10-25 |
ITMI20010807A1 (it) | 2002-10-13 |
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