JP5251031B2 - 圧電素子、液体噴射ヘッド、液体噴射装置、センサー - Google Patents
圧電素子、液体噴射ヘッド、液体噴射装置、センサー Download PDFInfo
- Publication number
- JP5251031B2 JP5251031B2 JP2007205320A JP2007205320A JP5251031B2 JP 5251031 B2 JP5251031 B2 JP 5251031B2 JP 2007205320 A JP2007205320 A JP 2007205320A JP 2007205320 A JP2007205320 A JP 2007205320A JP 5251031 B2 JP5251031 B2 JP 5251031B2
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- JP
- Japan
- Prior art keywords
- layer
- piezoelectric
- film
- electrode film
- lower electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
- H10N30/878—Conductive materials the principal material being non-metallic, e.g. oxide or carbon based
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007205320A JP5251031B2 (ja) | 2006-09-08 | 2007-08-07 | 圧電素子、液体噴射ヘッド、液体噴射装置、センサー |
| US11/851,196 US7535157B2 (en) | 2006-09-08 | 2007-09-06 | Piezoelectric element, actuator device, liquid-jet head, and liquid-jet apparatus |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006243769 | 2006-09-08 | ||
| JP2006243769 | 2006-09-08 | ||
| JP2007205320A JP5251031B2 (ja) | 2006-09-08 | 2007-08-07 | 圧電素子、液体噴射ヘッド、液体噴射装置、センサー |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008091877A JP2008091877A (ja) | 2008-04-17 |
| JP2008091877A5 JP2008091877A5 (enExample) | 2010-08-12 |
| JP5251031B2 true JP5251031B2 (ja) | 2013-07-31 |
Family
ID=39169162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007205320A Active JP5251031B2 (ja) | 2006-09-08 | 2007-08-07 | 圧電素子、液体噴射ヘッド、液体噴射装置、センサー |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7535157B2 (enExample) |
| JP (1) | JP5251031B2 (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5083496B2 (ja) * | 2006-09-21 | 2012-11-28 | セイコーエプソン株式会社 | アクチュエータ装置及び液体噴射ヘッド並びに画像記録装置 |
| JP5320886B2 (ja) * | 2008-07-28 | 2013-10-23 | セイコーエプソン株式会社 | 液体噴射ヘッド及び液体噴射装置並びに圧電素子 |
| US8164234B2 (en) * | 2009-02-26 | 2012-04-24 | Fujifilm Corporation | Sputtered piezoelectric material |
| JP2010201830A (ja) * | 2009-03-04 | 2010-09-16 | Seiko Epson Corp | 液体噴射ヘッド及び液体噴射装置並びに圧電素子 |
| JP5660274B2 (ja) * | 2010-01-05 | 2015-01-28 | セイコーエプソン株式会社 | 液体噴射ヘッドの製造方法、圧電素子の製造方法、液体噴射ヘッド、液体噴射装置及び圧電素子 |
| US8866367B2 (en) | 2011-10-17 | 2014-10-21 | The United States Of America As Represented By The Secretary Of The Army | Thermally oxidized seed layers for the production of {001} textured electrodes and PZT devices and method of making |
| US9761785B2 (en) | 2011-10-17 | 2017-09-12 | The United States Of America As Represented By The Secretary Of The Army | Stylo-epitaxial piezoelectric and ferroelectric devices and method of manufacturing |
| US20130320813A1 (en) | 2012-06-04 | 2013-12-05 | Tdk Corporation | Dielectric device |
| US8981627B2 (en) * | 2012-06-04 | 2015-03-17 | Tdk Corporation | Piezoelectric device with electrode films and electroconductive oxide film |
| JP2015079935A (ja) * | 2013-09-11 | 2015-04-23 | 株式会社リコー | 圧電アクチュエータ及び液滴吐出ヘッド、並びに画像形成装置 |
| JP6263950B2 (ja) * | 2013-10-22 | 2018-01-24 | 株式会社リコー | 電気−機械変換素子とその製造方法及び電気−機械変換素子を備えた液滴吐出ヘッド、インクカートリッジ並びに画像形成装置 |
| JP6282735B2 (ja) * | 2014-06-24 | 2018-02-21 | 株式会社アルバック | Pzt薄膜積層体の製造方法 |
| JP6460387B2 (ja) * | 2015-01-26 | 2019-01-30 | Tdk株式会社 | 圧電薄膜素子、圧電アクチュエータ、圧電センサ、並びにハードディスクドライブ、及びインクジェットプリンタ装置 |
| CN112864304A (zh) * | 2019-11-12 | 2021-05-28 | 应用材料公司 | 具有pmnpt层的压电装置的制造 |
| WO2022151472A1 (en) * | 2021-01-18 | 2022-07-21 | Applied Materials, Inc. | Deposition of piezoelectric films |
| WO2025204536A1 (ja) * | 2024-03-26 | 2025-10-02 | 富士フイルム株式会社 | 圧電積層体、圧電素子及び圧電積層体の製造方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3890634B2 (ja) * | 1995-09-19 | 2007-03-07 | セイコーエプソン株式会社 | 圧電体薄膜素子及びインクジェット式記録ヘッド |
| JPH09129827A (ja) | 1995-11-02 | 1997-05-16 | Sony Corp | 強誘電体キャパシタ |
| JP4144043B2 (ja) * | 1997-04-16 | 2008-09-03 | セイコーエプソン株式会社 | 圧電体薄膜素子の製造方法 |
| JPH11151815A (ja) | 1997-07-25 | 1999-06-08 | Seiko Epson Corp | インクジェット式記録ヘッド及びインクジェット式記録装置 |
| JPH1197630A (ja) * | 1997-09-22 | 1999-04-09 | Sharp Corp | 強誘電体薄膜の製造方法及び強誘電体メモリ素子 |
| JP3589560B2 (ja) | 1998-01-27 | 2004-11-17 | 株式会社リコー | インクジェットヘッド及びその製造方法 |
| US6398349B1 (en) * | 1998-03-04 | 2002-06-04 | Seiko Epson Corporation | Piezoelectric device, ink-jet printing head, and method for manufacturing same, and printer |
| JPH11348277A (ja) | 1998-06-04 | 1999-12-21 | Ricoh Co Ltd | インクジェットプリンタヘッド |
| JP3685318B2 (ja) * | 1999-11-09 | 2005-08-17 | セイコーエプソン株式会社 | 強誘電体薄膜素子の製造方法及び加熱処理装置 |
| JP2001223403A (ja) * | 2000-02-08 | 2001-08-17 | Matsushita Electric Ind Co Ltd | 強誘電体薄膜およびその形成方法とこれを用いた強誘電体薄膜素子 |
| JP3567977B2 (ja) | 2000-03-24 | 2004-09-22 | セイコーエプソン株式会社 | 圧電体素子、インクジェット式記録ヘッド、プリンタ、及び圧電体素子の製造方法 |
| US6534357B1 (en) * | 2000-11-09 | 2003-03-18 | Micron Technology, Inc. | Methods for forming conductive structures and structures regarding same |
| JP4029162B2 (ja) | 2002-03-08 | 2008-01-09 | 株式会社村田製作所 | 圧電素子の製造方法 |
| JP4208234B2 (ja) | 2003-03-24 | 2009-01-14 | 株式会社ノリタケカンパニーリミテド | 圧電セラミック材用導体ペースト及びその利用 |
| JP4761019B2 (ja) * | 2004-10-04 | 2011-08-31 | セイコーエプソン株式会社 | 電極膜、圧電素子、強誘電体キャパシタ及び半導体装置 |
-
2007
- 2007-08-07 JP JP2007205320A patent/JP5251031B2/ja active Active
- 2007-09-06 US US11/851,196 patent/US7535157B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US7535157B2 (en) | 2009-05-19 |
| JP2008091877A (ja) | 2008-04-17 |
| US20080062228A1 (en) | 2008-03-13 |
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