JP5249979B2 - 脆性材料基板の加工方法およびこれに用いるレーザ加工装置 - Google Patents

脆性材料基板の加工方法およびこれに用いるレーザ加工装置 Download PDF

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Publication number
JP5249979B2
JP5249979B2 JP2010062143A JP2010062143A JP5249979B2 JP 5249979 B2 JP5249979 B2 JP 5249979B2 JP 2010062143 A JP2010062143 A JP 2010062143A JP 2010062143 A JP2010062143 A JP 2010062143A JP 5249979 B2 JP5249979 B2 JP 5249979B2
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Japan
Prior art keywords
substrate
cooling
crack
brittle material
roller
Prior art date
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Active
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JP2010062143A
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English (en)
Japanese (ja)
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JP2011194644A (ja
Inventor
淳史 井村
裕介 平内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2010062143A priority Critical patent/JP5249979B2/ja
Priority to TW100108060A priority patent/TWI454330B/zh
Priority to KR1020110022714A priority patent/KR101275539B1/ko
Priority to CN201110069608.6A priority patent/CN102218778B/zh
Publication of JP2011194644A publication Critical patent/JP2011194644A/ja
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Publication of JP5249979B2 publication Critical patent/JP5249979B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP2010062143A 2010-03-18 2010-03-18 脆性材料基板の加工方法およびこれに用いるレーザ加工装置 Active JP5249979B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010062143A JP5249979B2 (ja) 2010-03-18 2010-03-18 脆性材料基板の加工方法およびこれに用いるレーザ加工装置
TW100108060A TWI454330B (zh) 2010-03-18 2011-03-10 A method for processing a brittle material substrate and a laser processing apparatus for use in the method
KR1020110022714A KR101275539B1 (ko) 2010-03-18 2011-03-15 취성 재료 기판의 가공 방법과 그것에 이용하는 가공 장치
CN201110069608.6A CN102218778B (zh) 2010-03-18 2011-03-18 脆性材料基板的加工方法及用于该方法的激光加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010062143A JP5249979B2 (ja) 2010-03-18 2010-03-18 脆性材料基板の加工方法およびこれに用いるレーザ加工装置

Publications (2)

Publication Number Publication Date
JP2011194644A JP2011194644A (ja) 2011-10-06
JP5249979B2 true JP5249979B2 (ja) 2013-07-31

Family

ID=44775611

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010062143A Active JP5249979B2 (ja) 2010-03-18 2010-03-18 脆性材料基板の加工方法およびこれに用いるレーザ加工装置

Country Status (4)

Country Link
JP (1) JP5249979B2 (zh)
KR (1) KR101275539B1 (zh)
CN (1) CN102218778B (zh)
TW (1) TWI454330B (zh)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102515494B (zh) * 2011-12-05 2014-04-09 深圳市华星光电技术有限公司 一种玻璃基板切割装置
JP6255595B2 (ja) 2012-10-12 2018-01-10 株式会社Ihi 割断装置
JP2014091134A (ja) * 2012-11-01 2014-05-19 Ihi Corp レーザ加工装置
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
CN103896483B (zh) * 2014-03-27 2016-08-17 深圳市华星光电技术有限公司 一种玻璃基板切割设备及切割方法
KR102445217B1 (ko) 2014-07-08 2022-09-20 코닝 인코포레이티드 재료를 레이저 가공하는 방법 및 장치
CN107073642B (zh) 2014-07-14 2020-07-28 康宁股份有限公司 使用长度和直径可调的激光束焦线来加工透明材料的系统和方法
EP3169635B1 (en) 2014-07-14 2022-11-23 Corning Incorporated Method and system for forming perforations
CN107073641B (zh) 2014-07-14 2020-11-10 康宁股份有限公司 接口块；用于使用这种接口块切割在波长范围内透明的衬底的系统和方法
WO2016010943A2 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for arresting crack propagation
KR101659454B1 (ko) * 2014-08-21 2016-09-23 한국미쯔보시다이아몬드공업(주) 기판 브레이크 장치
CN107406293A (zh) 2015-01-12 2017-11-28 康宁股份有限公司 使用多光子吸收方法来对经热回火的基板进行激光切割
EP3274306B1 (en) 2015-03-24 2021-04-14 Corning Incorporated Laser cutting and processing of display glass compositions
EP3274313A1 (en) 2015-03-27 2018-01-31 Corning Incorporated Gas permeable window and method of fabricating the same
CN110121398B (zh) 2016-08-30 2022-02-08 康宁股份有限公司 透明材料的激光加工
US10730783B2 (en) 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
JP7066701B2 (ja) 2016-10-24 2022-05-13 コーニング インコーポレイテッド シート状ガラス基体のレーザに基づく加工のための基体処理ステーション
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
JP2018183838A (ja) * 2017-04-26 2018-11-22 川崎重工業株式会社 脆性材料分断装置及び脆性材料分断方法
FR3066487B1 (fr) * 2017-05-19 2021-12-10 Saint Gobain Procede de rompage d'une feuille de verre
FR3066488B1 (fr) * 2017-05-19 2022-03-04 Saint Gobain Procede de rompage d'une feuille de verre
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
KR102022102B1 (ko) * 2017-12-21 2019-09-17 주식회사 넵시스 레이저 빔을 이용한 절단 장치
CN108751689A (zh) * 2018-07-11 2018-11-06 史千云 一种有效提高切口平整度的玻璃切割设备
CN115121747B (zh) * 2022-08-25 2022-12-06 泰州俊宇不锈钢材料有限公司 一种特种合金微丝用切断装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW568809B (en) * 2001-09-21 2004-01-01 Mitsuboshi Diamond Ind Co Ltd Method for scribing substrate of brittle material and scriber
CN100528507C (zh) * 2002-11-06 2009-08-19 三星钻石工业股份有限公司 划线形成设备和划线形成方法
EP1630140A4 (en) * 2003-04-28 2006-10-25 Mitsuboshi Diamond Ind Co Ltd SYSTEM AND METHOD FOR SEPARATING FRAGILE PLATES
JP4619024B2 (ja) * 2004-03-19 2011-01-26 芝浦メカトロニクス株式会社 脆性材料の割断加工システム及びその方法
US20090050610A1 (en) * 2004-10-13 2009-02-26 Mitsuboshi Diamond Industrial Co., Ltd. Method and apparatus for scribing brittle material board and system for breaking brittle material board
US20090230102A1 (en) * 2005-10-28 2009-09-17 Masanobu Soyama Method for Creating Scribe Line on Brittle Material Substrate and Apparatus for Creating Scribe Line
JPWO2007142264A1 (ja) * 2006-06-08 2009-10-29 東レエンジニアリング株式会社 基板割断装置、基板割断方法、及びこの装置または方法を用いて割断した割断基板
JP2010138046A (ja) * 2008-12-15 2010-06-24 Japan Steel Works Ltd:The 被割断材の加工方法および加工装置
JP5464952B2 (ja) * 2009-09-28 2014-04-09 株式会社ナガセインテグレックス レーザ加工方法

Also Published As

Publication number Publication date
KR101275539B1 (ko) 2013-06-17
CN102218778A (zh) 2011-10-19
TWI454330B (zh) 2014-10-01
CN102218778B (zh) 2014-11-05
JP2011194644A (ja) 2011-10-06
TW201139025A (en) 2011-11-16
KR20110105343A (ko) 2011-09-26

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