JP5243715B2 - プリプレグ、基板および半導体装置 - Google Patents

プリプレグ、基板および半導体装置 Download PDF

Info

Publication number
JP5243715B2
JP5243715B2 JP2006324709A JP2006324709A JP5243715B2 JP 5243715 B2 JP5243715 B2 JP 5243715B2 JP 2006324709 A JP2006324709 A JP 2006324709A JP 2006324709 A JP2006324709 A JP 2006324709A JP 5243715 B2 JP5243715 B2 JP 5243715B2
Authority
JP
Japan
Prior art keywords
resin
prepreg
thickness
substrate
fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006324709A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007176169A5 (enExample
JP2007176169A (ja
Inventor
猛 八月朔日
孝幸 馬塲
円 湯浅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP2006324709A priority Critical patent/JP5243715B2/ja
Publication of JP2007176169A publication Critical patent/JP2007176169A/ja
Publication of JP2007176169A5 publication Critical patent/JP2007176169A5/ja
Application granted granted Critical
Publication of JP5243715B2 publication Critical patent/JP5243715B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H10W70/63—
    • H10W90/724—

Landscapes

  • Reinforced Plastic Materials (AREA)
JP2006324709A 2005-12-01 2006-11-30 プリプレグ、基板および半導体装置 Active JP5243715B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006324709A JP5243715B2 (ja) 2005-12-01 2006-11-30 プリプレグ、基板および半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005348546 2005-12-01
JP2005348546 2005-12-01
JP2006324709A JP5243715B2 (ja) 2005-12-01 2006-11-30 プリプレグ、基板および半導体装置

Related Child Applications (8)

Application Number Title Priority Date Filing Date
JP2010272041A Division JP5141754B2 (ja) 2005-12-01 2010-12-06 プリプレグ、基板および半導体装置
JP2010272035A Division JP2011102035A (ja) 2005-12-01 2010-12-06 プリプレグ、基板および半導体装置
JP2010272039A Division JP5331781B2 (ja) 2005-12-01 2010-12-06 プリプレグ、基板および半導体装置
JP2010272038A Division JP5368419B2 (ja) 2005-12-01 2010-12-06 プリプレグ、基板および半導体装置
JP2010272034A Division JP5141751B2 (ja) 2005-12-01 2010-12-06 プリプレグ、基板および半導体装置
JP2010272037A Division JP2011068908A (ja) 2005-12-01 2010-12-06 プリプレグ、基板および半導体装置
JP2010272040A Division JP5141753B2 (ja) 2005-12-01 2010-12-06 プリプレグの製造方法
JP2010272036A Division JP5141752B2 (ja) 2005-12-01 2010-12-06 プリプレグ、基板および半導体装置

Publications (3)

Publication Number Publication Date
JP2007176169A JP2007176169A (ja) 2007-07-12
JP2007176169A5 JP2007176169A5 (enExample) 2011-01-27
JP5243715B2 true JP5243715B2 (ja) 2013-07-24

Family

ID=38301796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006324709A Active JP5243715B2 (ja) 2005-12-01 2006-11-30 プリプレグ、基板および半導体装置

Country Status (1)

Country Link
JP (1) JP5243715B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11214660B2 (en) 2017-02-17 2022-01-04 Showa Denko Materials Co., Ltd. Prepreg, laminate, printed wiring board, coreless substrate, semiconductor package and method for producing coreless substrate

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009028493A1 (ja) * 2007-08-28 2009-03-05 Sumitomo Bakelite Company, Ltd. 多層プリント配線板用絶縁樹脂組成物、基材付き絶縁樹脂シート、多層プリント配線板及び半導体装置
WO2010035445A1 (ja) * 2008-09-26 2010-04-01 住友ベークライト株式会社 積層板、回路板および半導体装置
JP5056787B2 (ja) * 2009-03-31 2012-10-24 住友ベークライト株式会社 積層板、多層プリント配線板および半導体装置
JP5685946B2 (ja) * 2010-01-22 2015-03-18 住友ベークライト株式会社 プリプレグの積層方法、プリント配線板の製造方法およびプリプレグのロール
TW201220977A (en) * 2010-07-01 2012-05-16 Sumitomo Bakelite Co Preppreg, circuit board, and semiconductor device
JP5659673B2 (ja) * 2010-10-06 2015-01-28 住友ベークライト株式会社 樹脂シート、積層板、電子部品、プリント配線板及び半導体装置
WO2012172792A1 (ja) * 2011-06-17 2012-12-20 住友ベークライト株式会社 プリント配線板および製造方法
CN103718657B (zh) * 2011-07-20 2016-09-28 松下知识产权经营株式会社 印刷配线板
JP2013149941A (ja) * 2011-12-22 2013-08-01 Ngk Spark Plug Co Ltd 多層配線基板及びその製造方法
JP5403190B1 (ja) * 2011-12-28 2014-01-29 日本ゼオン株式会社 プリプレグ及び積層体の製造方法
WO2013128841A1 (ja) * 2012-02-28 2013-09-06 住友ベークライト株式会社 プリプレグおよびプリプレグの製造方法
JP2012193373A (ja) * 2012-06-25 2012-10-11 Sumitomo Bakelite Co Ltd ビルドアップ用プリプレグ
JP2012193374A (ja) * 2012-06-25 2012-10-11 Sumitomo Bakelite Co Ltd ビルドアップ用プリプレグ
JP2015038911A (ja) * 2012-09-27 2015-02-26 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
WO2014174827A1 (ja) * 2013-04-26 2014-10-30 株式会社デンソー 多層基板、多層基板を用いた電子装置、多層基板の製造方法、基板、および基板を用いた電子装置
JP2015228390A (ja) * 2014-05-30 2015-12-17 京セラケミカル株式会社 基板の製造方法
JP7010684B2 (ja) * 2017-12-11 2022-02-10 旭化成株式会社 ガラスクロス、プリプレグ、及びプリント配線板
WO2022054928A1 (ja) 2020-09-11 2022-03-17 昭和電工マテリアルズ株式会社 Ｆｒｐ前駆体の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07216111A (ja) * 1994-01-31 1995-08-15 Hitachi Chem Co Ltd プリプレグの製造方法
JPH09202834A (ja) * 1996-01-26 1997-08-05 Hitachi Chem Co Ltd プリント配線板用のプリプレグ及びその製造方法
JPH1034649A (ja) * 1996-07-24 1998-02-10 Toutoku Toryo Kk 回路基板におけるプリプレグの製造法
JP2003340952A (ja) * 2002-05-28 2003-12-02 Mitsubishi Gas Chem Co Inc アディティブ用繊維布基材入りｂステージ樹脂組成物シートの製造方法。
WO2004027136A1 (ja) * 2002-09-20 2004-04-01 Asahi-Schwebel Co., Ltd. ガラスクロス及びそれを用いたフィルム基材

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11214660B2 (en) 2017-02-17 2022-01-04 Showa Denko Materials Co., Ltd. Prepreg, laminate, printed wiring board, coreless substrate, semiconductor package and method for producing coreless substrate

Also Published As

Publication number Publication date
JP2007176169A (ja) 2007-07-12

Similar Documents

Publication Publication Date Title
JP5141751B2 (ja) プリプレグ、基板および半導体装置
JP5243715B2 (ja) プリプレグ、基板および半導体装置
KR101025055B1 (ko) 프리프레그, 프리프레그의 제조 방법, 기판 및 반도체 장치
KR101103451B1 (ko) 적층체, 기판의 제조 방법, 기판 및 반도체 장치
KR101298354B1 (ko) 캐리어 장착 프리프레그의 제조방법, 캐리어 장착 프리프레그, 박형 양면판의 제조방법, 박형 양면판, 및 다층 프린트 배선판의 제조방법
JPWO2012002434A1 (ja) プリプレグ、配線板および半導体装置
JP2008244189A (ja) 回路基板および半導体装置
JP5157103B2 (ja) プリプレグ、基板および半導体装置
JP4983190B2 (ja) プリプレグ、回路基板および半導体装置
JP2013057065A (ja) プリプレグ、基板および半導体装置
JP2011179001A (ja) プリプレグ、回路基板および半導体装置
JP2012051988A (ja) プリプレグ、基板および半導体装置
JP2012057169A (ja) プリプレグ、回路基板および半導体装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090522

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101206

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110729

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110809

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110930

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20111025

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120124

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20120213

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20120224

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130405

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160412

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 5243715

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150