JP5243510B2 - 配線材料、配線の製造方法、及びナノ粒子分散液 - Google Patents

配線材料、配線の製造方法、及びナノ粒子分散液 Download PDF

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Publication number
JP5243510B2
JP5243510B2 JP2010224031A JP2010224031A JP5243510B2 JP 5243510 B2 JP5243510 B2 JP 5243510B2 JP 2010224031 A JP2010224031 A JP 2010224031A JP 2010224031 A JP2010224031 A JP 2010224031A JP 5243510 B2 JP5243510 B2 JP 5243510B2
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JP
Japan
Prior art keywords
wiring
copper
resistivity
wiring material
substrate
Prior art date
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Expired - Fee Related
Application number
JP2010224031A
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English (en)
Japanese (ja)
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JP2012079933A5 (enExample
JP2012079933A (ja
Inventor
隆満 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
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Fujifilm Corp
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Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Priority to JP2010224031A priority Critical patent/JP5243510B2/ja
Priority to US13/250,142 priority patent/US8551369B2/en
Publication of JP2012079933A publication Critical patent/JP2012079933A/ja
Publication of JP2012079933A5 publication Critical patent/JP2012079933A5/ja
Application granted granted Critical
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Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Composite Materials (AREA)
  • Dispersion Chemistry (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Electric Cables (AREA)
JP2010224031A 2010-10-01 2010-10-01 配線材料、配線の製造方法、及びナノ粒子分散液 Expired - Fee Related JP5243510B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010224031A JP5243510B2 (ja) 2010-10-01 2010-10-01 配線材料、配線の製造方法、及びナノ粒子分散液
US13/250,142 US8551369B2 (en) 2010-10-01 2011-09-30 Wiring material, method of manufacturing wiring, and nano-particle dispersion

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010224031A JP5243510B2 (ja) 2010-10-01 2010-10-01 配線材料、配線の製造方法、及びナノ粒子分散液

Publications (3)

Publication Number Publication Date
JP2012079933A JP2012079933A (ja) 2012-04-19
JP2012079933A5 JP2012079933A5 (enExample) 2012-07-19
JP5243510B2 true JP5243510B2 (ja) 2013-07-24

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010224031A Expired - Fee Related JP5243510B2 (ja) 2010-10-01 2010-10-01 配線材料、配線の製造方法、及びナノ粒子分散液

Country Status (2)

Country Link
US (1) US8551369B2 (enExample)
JP (1) JP5243510B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6057379B2 (ja) * 2013-01-31 2017-01-11 国立研究開発法人産業技術総合研究所 窒化銅微粒子およびその製造方法
JP6574553B2 (ja) * 2014-06-26 2019-09-11 昭和電工株式会社 導電パターン形成用組成物および導電パターン形成方法
WO2018147136A1 (ja) * 2017-02-08 2018-08-16 三井金属鉱業株式会社 配線構造及びその製造方法、スパッタリングターゲット材、並びに酸化防止方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0179822B1 (ko) * 1995-04-01 1999-04-15 문정환 반도체 장치의 배선 구조 및 그 제조 방법
WO2005122230A1 (ja) 2004-06-07 2005-12-22 Kyushu Institute Of Technology 銅表面の処理方法及び銅パターン配線形成方法、並びに該方法を用いて作成された半導体装置
JP5068925B2 (ja) * 2004-09-03 2012-11-07 Ｊｘ日鉱日石金属株式会社 スパッタリングターゲット
JP3870273B2 (ja) * 2004-12-28 2007-01-17 国立大学法人九州工業大学 銅パターン配線形成方法及び該方法を用いて作成された半導体装置、並びにナノ銅金属粒子
US7314786B1 (en) * 2006-06-16 2008-01-01 International Business Machines Corporation Metal resistor, resistor material and method
JP2008274324A (ja) * 2007-04-26 2008-11-13 Tosoh Corp 組成物及び銅膜の形成方法
KR20110041432A (ko) * 2008-07-11 2011-04-21 미츠이 마이닝 & 스멜팅 콤파니 리미티드 도전성 페이스트용 구리분말 및 도전성 페이스트
JP5778382B2 (ja) 2008-10-22 2015-09-16 東ソー株式会社 金属膜製造用組成物、金属膜の製造方法及び金属粉末の製造方法
JP2010161331A (ja) 2008-12-12 2010-07-22 Hitachi Ltd 電極，電極ペースト及びそれを用いた電子部品
JP5420964B2 (ja) * 2009-04-28 2014-02-19 株式会社神戸製鋼所 表示装置およびこれに用いるＣｕ合金膜

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Publication number Publication date
US8551369B2 (en) 2013-10-08
US20120082780A1 (en) 2012-04-05
JP2012079933A (ja) 2012-04-19

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