JP5237088B2 - 粉末材料または粒状材料の制御可能な供給 - Google Patents

粉末材料または粒状材料の制御可能な供給 Download PDF

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Publication number
JP5237088B2
JP5237088B2 JP2008510033A JP2008510033A JP5237088B2 JP 5237088 B2 JP5237088 B2 JP 5237088B2 JP 2008510033 A JP2008510033 A JP 2008510033A JP 2008510033 A JP2008510033 A JP 2008510033A JP 5237088 B2 JP5237088 B2 JP 5237088B2
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Japan
Prior art keywords
granular material
supply position
opening
rotary screw
powder material
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JP2008510033A
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English (en)
Japanese (ja)
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JP2008540829A (ja
JP2008540829A5 (enExample
Inventor
ロング，マイケル
ピーター レッデン，ネイル
エドワード コッペ，ブルース
ウィリアム パローン，トーマス
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グローバル オーエルイーディー テクノロジー リミティド ライアビリティ カンパニー
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
  • Manufacturing And Processing Devices For Dough (AREA)
JP2008510033A 2005-05-03 2006-04-25 粉末材料または粒状材料の制御可能な供給 Active JP5237088B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/121,242 US7625602B2 (en) 2005-05-03 2005-05-03 Controllably feeding powdered or granular material
US11/121,242 2005-05-03
PCT/US2006/015351 WO2006118837A2 (en) 2005-05-03 2006-04-25 Method for feeding powdered or granular material

Publications (3)

Publication Number Publication Date
JP2008540829A JP2008540829A (ja) 2008-11-20
JP2008540829A5 JP2008540829A5 (enExample) 2009-04-16
JP5237088B2 true JP5237088B2 (ja) 2013-07-17

Family

ID=37103274

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008510033A Active JP5237088B2 (ja) 2005-05-03 2006-04-25 粉末材料または粒状材料の制御可能な供給

Country Status (4)

Country Link
US (1) US7625602B2 (enExample)
EP (1) EP1893785B1 (enExample)
JP (1) JP5237088B2 (enExample)
WO (1) WO2006118837A2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5179739B2 (ja) * 2006-09-27 2013-04-10 東京エレクトロン株式会社 蒸着装置、蒸着装置の制御装置、蒸着装置の制御方法および蒸着装置の使用方法
US7883583B2 (en) * 2008-01-08 2011-02-08 Global Oled Technology Llc Vaporization apparatus with precise powder metering
US8048230B2 (en) * 2008-11-14 2011-11-01 Global Oled Technology Llc Metering and vaporizing particulate material
US8062427B2 (en) * 2008-11-14 2011-11-22 Global Oled Technology Llc Particulate material metering and vaporization
US7972443B2 (en) * 2008-11-14 2011-07-05 Global Oled Technology Llc Metering of particulate material and vaporization thereof
JP4974036B2 (ja) 2009-11-19 2012-07-11 株式会社ジャパンディスプレイセントラル 有機ｅｌ装置の製造方法
CN106119781B (zh) * 2016-07-27 2018-10-30 京东方科技集团股份有限公司 蒸发装置、蒸镀设备和蒸镀方法
EP4340969A1 (de) 2021-05-21 2024-03-27 Merck Patent GmbH Verfahren zur kontinuierlichen aufreinigung von mindestens einem funktionalen material und vorrichtung zur kontinuierlichen aufreinigung von mindestens einem funktionalen material
CN115595550B (zh) * 2022-10-24 2024-07-23 广东振华科技股份有限公司 一种af颗粒膜料自动换料连续蒸发镀膜装置及方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2447789A (en) * 1945-03-23 1948-08-24 Polaroid Corp Evaporating crucible for coating apparatus
JPS50109182A (enExample) * 1974-02-07 1975-08-28
SU779441A1 (ru) 1978-07-31 1980-11-15 Институт Механики Металлополимерных Систем Ан Белорусской Сср Дозирующий питатель
DE3530106A1 (de) * 1985-08-23 1987-02-26 Kempten Elektroschmelz Gmbh Aufdampfgut zum aufdampfen anorganischer verbindungen mittels einer photonen-erzeugenden strahlungsheizquelle in kontinuierlich betriebenen vakuumbedampfungsanlagen
US4885211A (en) * 1987-02-11 1989-12-05 Eastman Kodak Company Electroluminescent device with improved cathode
US4769292A (en) * 1987-03-02 1988-09-06 Eastman Kodak Company Electroluminescent device with modified thin film luminescent zone
JPH0645213Y2 (ja) * 1988-02-08 1994-11-16 住友電気工業株式会社 高精度粉体供給装置
EP0585848A1 (de) * 1992-09-02 1994-03-09 Hoechst Aktiengesellschaft Verfahren und Vorrichtung zur chemischen Gasphasenabscheidung dünner Schichten
JP2000248358A (ja) * 1999-03-01 2000-09-12 Casio Comput Co Ltd 蒸着装置および蒸着方法
IT1310745B1 (it) 1999-11-26 2002-02-22 Lawer Spa Dispositivo per l'erogazione dosata di prodotti scorrevoli.
JP2003293121A (ja) * 2002-04-05 2003-10-15 Cluster Ion Beam Technology Kk 蒸着材料供給手段を備えた蒸着用坩堝
US7118783B2 (en) * 2002-06-26 2006-10-10 Micron Technology, Inc. Methods and apparatus for vapor processing of micro-device workpieces
US6837939B1 (en) * 2003-07-22 2005-01-04 Eastman Kodak Company Thermal physical vapor deposition source using pellets of organic material for making OLED displays
US7339139B2 (en) * 2003-10-03 2008-03-04 Darly Custom Technology, Inc. Multi-layered radiant thermal evaporator and method of use
US7288285B2 (en) * 2004-09-21 2007-10-30 Eastman Kodak Company Delivering organic powder to a vaporization zone
US7213347B2 (en) 2005-05-03 2007-05-08 Eastman Kodak Company Metering material to promote rapid vaporization

Also Published As

Publication number Publication date
JP2008540829A (ja) 2008-11-20
EP1893785A2 (en) 2008-03-05
US7625602B2 (en) 2009-12-01
US20060251811A1 (en) 2006-11-09
WO2006118837A3 (en) 2007-04-05
WO2006118837A2 (en) 2006-11-09
EP1893785B1 (en) 2012-07-11

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