JP5219316B1 - 半導体装置接続用銅白金合金細線 - Google Patents
半導体装置接続用銅白金合金細線 Download PDFInfo
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- JP5219316B1 JP5219316B1 JP2012217879A JP2012217879A JP5219316B1 JP 5219316 B1 JP5219316 B1 JP 5219316B1 JP 2012217879 A JP2012217879 A JP 2012217879A JP 2012217879 A JP2012217879 A JP 2012217879A JP 5219316 B1 JP5219316 B1 JP 5219316B1
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- copper
- wire
- platinum
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- bonding
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- WBLJAACUUGHPMU-UHFFFAOYSA-N copper platinum Chemical compound [Cu].[Pt] WBLJAACUUGHPMU-UHFFFAOYSA-N 0.000 title claims abstract description 41
- 229910001260 Pt alloy Inorganic materials 0.000 title claims abstract description 33
- 239000004065 semiconductor Substances 0.000 title claims description 17
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 142
- 239000010949 copper Substances 0.000 claims abstract description 114
- 229910052802 copper Inorganic materials 0.000 claims abstract description 61
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 60
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 49
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 45
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 44
- 239000001301 oxygen Substances 0.000 claims abstract description 44
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052717 sulfur Inorganic materials 0.000 claims abstract description 30
- 239000011593 sulfur Substances 0.000 claims abstract description 30
- 239000011159 matrix material Substances 0.000 claims abstract description 22
- 239000002344 surface layer Substances 0.000 claims abstract description 13
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 12
- 239000011574 phosphorus Substances 0.000 claims abstract description 11
- 238000005491 wire drawing Methods 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 8
- 229910002056 binary alloy Inorganic materials 0.000 claims description 7
- 229910052755 nonmetal Inorganic materials 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 abstract description 20
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 20
- 238000000034 method Methods 0.000 abstract description 15
- 239000010410 layer Substances 0.000 abstract description 12
- 230000008569 process Effects 0.000 abstract description 10
- 238000005336 cracking Methods 0.000 abstract description 9
- 238000009749 continuous casting Methods 0.000 abstract description 4
- 238000005204 segregation Methods 0.000 abstract description 4
- 230000003068 static effect Effects 0.000 abstract description 4
- 239000000654 additive Substances 0.000 abstract description 3
- 230000000996 additive effect Effects 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 36
- 230000000052 comparative effect Effects 0.000 description 21
- 229910000881 Cu alloy Inorganic materials 0.000 description 18
- 238000010438 heat treatment Methods 0.000 description 15
- 238000012360 testing method Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 9
- 238000005496 tempering Methods 0.000 description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000005266 casting Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000006104 solid solution Substances 0.000 description 3
- 238000005482 strain hardening Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 101000752241 Homo sapiens Rho guanine nucleotide exchange factor 4 Proteins 0.000 description 2
- 102100021709 Rho guanine nucleotide exchange factor 4 Human genes 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009841 combustion method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H01L2224/48799—Principal constituent of the connecting portion of the wire connector being Copper (Cu)
- H01L2224/488—Principal constituent of the connecting portion of the wire connector being Copper (Cu) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/48817—Principal constituent of the connecting portion of the wire connector being Copper (Cu) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950 °C
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Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012217879A JP5219316B1 (ja) | 2012-09-28 | 2012-09-28 | 半導体装置接続用銅白金合金細線 |
TW102116584A TWI437650B (zh) | 2012-09-28 | 2013-05-09 | 半導體裝置連接用銅鉑合金細線 |
SG2013038567A SG2013038567A (en) | 2012-09-28 | 2013-05-17 | Copper-platinum alloy wire for connection in semiconductor device |
CN201310223610.3A CN103295993B (zh) | 2012-09-28 | 2013-06-06 | 用于半导体装置中的连接的铜-铂合金线 |
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JP5871983B2 (ja) | 2014-03-28 | 2016-03-01 | 富士重工業株式会社 | 車体の後部に搭載されるバッテリモジュールの保護構造 |
CN111383935A (zh) | 2014-04-21 | 2020-07-07 | 日铁化学材料株式会社 | 半导体装置用接合线 |
SG10201403532QA (en) * | 2014-06-23 | 2016-01-28 | Heraeus Deutschland Gmbh & Co Kg | Copper bonding wire with angstrom (a) thick surface oxide layer |
SG10201404628TA (en) * | 2014-08-04 | 2016-03-30 | Heraeus Deutschland Gmbh & Co Kg | Ball-bond arrangement |
JP6422768B2 (ja) * | 2014-12-24 | 2018-11-14 | タツタ電線株式会社 | 銅ボンディングワイヤの製造方法 |
CN104789813A (zh) * | 2015-01-26 | 2015-07-22 | 汕头市骏码凯撒有限公司 | 一种led封装用超细键合铜合金丝及其制造方法 |
CN104752385B (zh) * | 2015-01-26 | 2018-02-02 | 汕头市骏码凯撒有限公司 | 一种ic封装用超软键合丝及其制造方法 |
US10384314B2 (en) | 2015-04-22 | 2019-08-20 | Hitachi Metals, Ltd. | Metal particle and method for producing the same, covered metal particle, and metal powder |
CN106489199B (zh) | 2015-06-15 | 2019-09-03 | 日铁新材料股份有限公司 | 半导体装置用接合线 |
WO2017013796A1 (ja) * | 2015-07-23 | 2017-01-26 | 日鉄住金マイクロメタル株式会社 | 半導体装置用ボンディングワイヤ |
KR101758038B1 (ko) | 2015-08-12 | 2017-07-13 | 닛데쓰스미킹 마이크로 메탈 가부시키가이샤 | 반도체 장치용 본딩 와이어 |
WO2017221434A1 (ja) * | 2016-06-20 | 2017-12-28 | 日鉄住金マイクロメタル株式会社 | 半導体装置用ボンディングワイヤ |
JP6710141B2 (ja) * | 2016-10-14 | 2020-06-17 | 田中電子工業株式会社 | ボールボンディング用銅合金線 |
EP3667709A4 (en) | 2017-08-09 | 2021-06-09 | NIPPON STEEL Chemical & Material Co., Ltd. | CU ALLOY BOND WIRE FOR SEMICONDUCTOR COMPONENTS |
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WO2011129256A1 (ja) * | 2010-04-14 | 2011-10-20 | タツタ電線株式会社 | ボンディングワイヤ |
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JP2014070252A (ja) | 2014-04-21 |
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CN103295993A (zh) | 2013-09-11 |
SG2013038567A (en) | 2014-04-28 |
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