JP5215701B2 - 試料検査装置及び試料検査方法 - Google Patents
試料検査装置及び試料検査方法 Download PDFInfo
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- JP5215701B2 JP5215701B2 JP2008080186A JP2008080186A JP5215701B2 JP 5215701 B2 JP5215701 B2 JP 5215701B2 JP 2008080186 A JP2008080186 A JP 2008080186A JP 2008080186 A JP2008080186 A JP 2008080186A JP 5215701 B2 JP5215701 B2 JP 5215701B2
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
- G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/2204—Specimen supports therefor; Sample conveying means therefore
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/22—Optical or photographic arrangements associated with the tube
- H01J37/226—Optical arrangements for illuminating the object; optical arrangements for collecting light from the object
- H01J37/228—Optical arrangements for illuminating the object; optical arrangements for collecting light from the object whereby illumination and light collection take place in the same area of the discharge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/261—Details
- H01J37/265—Controlling the tube; circuit arrangements adapted to a particular application not otherwise provided, e.g. bright-field-dark-field illumination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/30—Accessories, mechanical or electrical features
- G01N2223/307—Accessories, mechanical or electrical features cuvettes-sample holders
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/612—Specific applications or type of materials biological material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/637—Specific applications or type of materials liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/18—Vacuum control means
- H01J2237/182—Obtaining or maintaining desired pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/2002—Controlling environment of sample
- H01J2237/2003—Environmental cells
- H01J2237/2004—Biological samples
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/244—Detection characterized by the detecting means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/28—Scanning microscopes
- H01J2237/2803—Scanning microscopes characterised by the imaging method
- H01J2237/2808—Cathodoluminescence
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- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Description
Claims (18)
- 第1の面に試料が保持される膜と、該膜の第2の面に接する雰囲気を減圧する真空室と、該真空室に接続され該膜を介して試料に一次線を照射する一次線照射手段と、該一次線の照射により試料から発生する二次的信号を検出する信号検出手段と、該真空室内部において、該膜が位置する側と該一次線照射手段が位置する側との間を気密に閉鎖することなく、該膜と該一次線照射手段とが対向する領域を仕切ることが可能な仕切り部材と、該膜の損傷を検知する検知手段と、大気圧復帰手段とを備え、該検知手段により該膜の損傷を検知したときに、該仕切り部材が該領域を仕切るとともに、該大気圧復帰手段が該一次線照射手段内部及び該真空室内部を大気圧に復帰させることを特徴とする試料検査装置。
- 前記検知手段により前記膜の損傷を検知したときに、前記大気圧復帰手段が前記一次線照射手段内部を介して前記真空室内部にガスを供給することにより、前記一次線照射手段内部及び前記真空室内部を大気圧に復帰させることを特徴とする請求項1記載の試料検査装置。
- 前記検知手段は、前記真空室内の圧力上昇に基づいて、前記膜の損傷を検知することを特徴とする請求項1又は2記載の試料検査装置。
- 前記仕切り部材は、受け皿構造を有することを特徴とする請求項1乃至3何れか記載の試料検査装置。
- 前記信号検出手段は、前記仕切り部材に取付けられていることを特徴とする請求項1乃至4何れか記載の試料検査装置。
- 前記膜の第1の面は、外部からアクセス可能なように開放状態で試料を保持することを特徴とする請求項1乃至5何れか記載の試料検査装置。
- 前記膜の第1の面に保持された試料に接近又は接触可能な先端部を具備するマニピュレータと、該試料と該マニピュレータを観察する光学像取得手段とを備えることを特徴とする請求項1乃至6何れか記載の試料検査装置。
- 前記膜の第1の面が該膜の上面となっており、前記膜の第2の面が該膜の下面となっていることを特徴とする請求項1乃至7何れか記載の試料検査装置。
- 前記一次線は、荷電粒子線又は電子線であり、前記二次的信号は、二次電子、反射電子、X線、若しくはカソードルミネッセンス光のうちの少なくとも一つであることを特徴とする請求項1乃至8何れか記載の試料検査装置。
- 請求項1乃至9何れか記載の試料検査装置により、試料の検査を行うことを特徴とする試料検査方法。
- 膜の第1の面に試料を保持し、該膜の第2の面に接する空間を減圧し、一次線照射手段により該膜を介して試料に一次線を照射し、該一次線の照射により試料から発生する二次的信号を検出して試料の検査を行う試料検査方法において、該膜の損傷を検知したときに、該空間における該膜が位置する側と該一次線照射手段が位置する側との間を気密に閉鎖することなく、該膜と該一次線照射手段とが対向する領域を仕切り部材により仕切るとともに、該一次線照射手段内部及び該空間を大気圧に復帰させることを特徴とする試料検査方法。
- 前記膜の損傷を検知したときに、前記一次線照射手段内部を介して前記空間にガスを供給することにより、前記一次線照射手段内部及び前記空間を大気圧に復帰させることを特徴とする請求項11記載の試料検査方法。
- 前記空間の圧力上昇に基づいて、前記膜の損傷を検知することを特徴とする請求項11又は12記載の試料検査方法。
- 前記仕切り部材は、受け皿構造を有することを特徴とする請求項11乃至13何れか記載の試料検査方法。
- 前記膜の第1の面は、外部からアクセス可能なように開放状態で試料を保持することを特徴とする請求項11乃至14何れか記載の試料検査方法。
- 前記膜の第1の面に保持された試料に対するマニピュレーション及び光学像の取得を行うことを特徴とする請求項11乃至15何れか記載の試料検査方法。
- 前記膜の第1の面が該膜の上面となっており、前記膜の第2の面が該膜の下面となっていることを特徴とする請求項11乃至16何れか記載の試料検査方法。
- 前記一次線は、荷電粒子線又は電子線であり、前記二次的信号は、二次電子、反射電子、X線、若しくはカソードルミネッセンス光のうちの少なくとも一つであることを特徴とする請求項11乃至17何れか記載の試料検査方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008080186A JP5215701B2 (ja) | 2008-03-26 | 2008-03-26 | 試料検査装置及び試料検査方法 |
EP09250792.0A EP2105727B1 (en) | 2008-03-26 | 2009-03-20 | Scanning electron microscope comprising a film for holding a sample and a dish for receiving sample material from a damaged film |
US12/407,918 US8119994B2 (en) | 2008-03-26 | 2009-03-20 | Apparatus and method for inspecting sample |
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JP2008080186A JP5215701B2 (ja) | 2008-03-26 | 2008-03-26 | 試料検査装置及び試料検査方法 |
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JP2009238426A JP2009238426A (ja) | 2009-10-15 |
JP5215701B2 true JP5215701B2 (ja) | 2013-06-19 |
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JP2008080186A Expired - Fee Related JP5215701B2 (ja) | 2008-03-26 | 2008-03-26 | 試料検査装置及び試料検査方法 |
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US (1) | US8119994B2 (ja) |
EP (1) | EP2105727B1 (ja) |
JP (1) | JP5215701B2 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2365321B1 (en) * | 2006-12-19 | 2013-10-02 | JEOL Ltd. | Sample inspection apparatus, sample inspection method, and sample inspection system |
JP5318364B2 (ja) * | 2007-01-31 | 2013-10-16 | 日本電子株式会社 | 試料保持体、試料検査装置及び試料検査方法、並びに試料保持体の製造方法 |
US8440969B2 (en) | 2010-08-02 | 2013-05-14 | Omniprobe, Inc. | Method and apparatus for acquiring simultaneous and overlapping optical and charged particle beam images |
TWI472751B (zh) * | 2011-05-03 | 2015-02-11 | Hermes Microvision Inc | 用於檢查與複檢光罩/晶圓缺陷的帶電粒子系統 |
DE112014001109B4 (de) | 2013-04-12 | 2019-11-14 | Hitachi High-Technologies Corporation | Mit einem Strahl geladener Teilchen arbeitende Vorrichtung und Filterelement |
US9842724B2 (en) * | 2015-02-03 | 2017-12-12 | Kla-Tencor Corporation | Method and system for imaging of a photomask through a pellicle |
JP2017174504A (ja) * | 2016-03-18 | 2017-09-28 | 株式会社日立ハイテクサイエンス | 複合荷電粒子ビーム装置 |
CN106645250B (zh) * | 2016-11-21 | 2024-04-26 | 宁波聚瑞精密仪器有限公司 | 一种具备光学成像功能的扫描透射电子显微镜 |
CN106770405A (zh) * | 2016-12-09 | 2017-05-31 | 清华大学 | 一种完全大气压下超光学衍射成像装置 |
US10921268B1 (en) * | 2019-09-09 | 2021-02-16 | Fei Company | Methods and devices for preparing sample for cryogenic electron microscopy |
CN114280092B (zh) * | 2020-09-28 | 2023-07-28 | 华南师范大学 | 一种原位观测晶体生长方法及观测装置 |
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JPS4724961U (ja) | 1971-04-14 | 1972-11-20 | ||
JPS522785A (en) * | 1975-06-24 | 1977-01-10 | Shimadzu Corp | Analyzing method and its device for the same |
JPH01103249U (ja) * | 1987-12-28 | 1989-07-12 | ||
JP2781320B2 (ja) | 1993-01-18 | 1998-07-30 | 株式会社蛋白工学研究所 | 電子顕微鏡等の試料ホルダ |
JPH1064467A (ja) * | 1996-08-23 | 1998-03-06 | Toshiba Corp | 電子顕微鏡 |
AU2101902A (en) | 2000-12-01 | 2002-06-11 | Yeda Res & Dev | Device and method for the examination of samples in a non-vacuum environment using a scanning electron microscope |
JP4028255B2 (ja) * | 2002-02-26 | 2007-12-26 | ソニー株式会社 | 電子ビーム照射装置及び電子ビーム照射方法 |
AU2003231893A1 (en) * | 2002-06-05 | 2003-12-22 | Quantomix Ltd. | A sample enclosure for a scanning electron microscope and methods of use thereof |
JP2006147430A (ja) * | 2004-11-22 | 2006-06-08 | Hokkaido Univ | 電子顕微鏡 |
JP2007292702A (ja) * | 2006-04-27 | 2007-11-08 | Jeol Ltd | 試料検査装置及び試料検査方法並びに試料検査システム |
JP2007294365A (ja) * | 2006-04-27 | 2007-11-08 | Jeol Ltd | 試料検査方法、試料保持体、及び試料検査装置並びに試料検査システム |
JP2008010269A (ja) * | 2006-06-28 | 2008-01-17 | Horon:Kk | 低真空電子光学系画像生成装置および低真空電子光学系画像生成方法 |
JP5084188B2 (ja) * | 2006-07-04 | 2012-11-28 | 日本電子株式会社 | 試料保持体、試料検査方法及び試料検査装置並びに試料検査システム |
JP2008047411A (ja) * | 2006-08-15 | 2008-02-28 | Jeol Ltd | 試料保持体及び試料検査方法並びに試料検査装置 |
EP2365321B1 (en) * | 2006-12-19 | 2013-10-02 | JEOL Ltd. | Sample inspection apparatus, sample inspection method, and sample inspection system |
JP2009250904A (ja) * | 2008-04-10 | 2009-10-29 | Jeol Ltd | 検査装置及び検査方法 |
JP5237728B2 (ja) * | 2008-08-29 | 2013-07-17 | 日本電子株式会社 | 粒子線装置 |
JP2010230417A (ja) * | 2009-03-26 | 2010-10-14 | Jeol Ltd | 試料の検査装置及び検査方法 |
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2008
- 2008-03-26 JP JP2008080186A patent/JP5215701B2/ja not_active Expired - Fee Related
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2009
- 2009-03-20 EP EP09250792.0A patent/EP2105727B1/en not_active Not-in-force
- 2009-03-20 US US12/407,918 patent/US8119994B2/en not_active Expired - Fee Related
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US8119994B2 (en) | 2012-02-21 |
JP2009238426A (ja) | 2009-10-15 |
EP2105727B1 (en) | 2016-03-16 |
EP2105727A1 (en) | 2009-09-30 |
US20090242762A1 (en) | 2009-10-01 |
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