JP5195196B2 - スパッタリング装置及び半導体装置の製造方法 - Google Patents

スパッタリング装置及び半導体装置の製造方法 Download PDF

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Publication number
JP5195196B2
JP5195196B2 JP2008235013A JP2008235013A JP5195196B2 JP 5195196 B2 JP5195196 B2 JP 5195196B2 JP 2008235013 A JP2008235013 A JP 2008235013A JP 2008235013 A JP2008235013 A JP 2008235013A JP 5195196 B2 JP5195196 B2 JP 5195196B2
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chamber
film
substrate
dummy
heating
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JP2010065305A (ja
JP2010065305A5 (enExample
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秀和 柳澤
剛 椎野
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Seiko Epson Corp
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Seiko Epson Corp
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JP2008235013A 2008-09-12 2008-09-12 スパッタリング装置及び半導体装置の製造方法 Expired - Fee Related JP5195196B2 (ja)

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JP2008235013A JP5195196B2 (ja) 2008-09-12 2008-09-12 スパッタリング装置及び半導体装置の製造方法

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JP2008235013A JP5195196B2 (ja) 2008-09-12 2008-09-12 スパッタリング装置及び半導体装置の製造方法

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JP2010065305A JP2010065305A (ja) 2010-03-25
JP2010065305A5 JP2010065305A5 (enExample) 2011-10-20
JP5195196B2 true JP5195196B2 (ja) 2013-05-08

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JP2008235013A Expired - Fee Related JP5195196B2 (ja) 2008-09-12 2008-09-12 スパッタリング装置及び半導体装置の製造方法

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6149568B2 (ja) * 2013-07-19 2017-06-21 三菱電機株式会社 半導体装置の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3869499B2 (ja) * 1996-07-22 2007-01-17 大日本スクリーン製造株式会社 基板処理方法
JP3737570B2 (ja) * 1996-07-30 2006-01-18 大日本スクリーン製造株式会社 基板処理装置
JPH10189719A (ja) * 1996-12-27 1998-07-21 Sony Corp 半導体装置の製造方法
JP4473410B2 (ja) * 2000-05-24 2010-06-02 キヤノンアネルバ株式会社 スパッタリング装置及び成膜方法

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