JP5194076B2 - レーザ割断装置 - Google Patents

レーザ割断装置 Download PDF

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Publication number
JP5194076B2
JP5194076B2 JP2010190704A JP2010190704A JP5194076B2 JP 5194076 B2 JP5194076 B2 JP 5194076B2 JP 2010190704 A JP2010190704 A JP 2010190704A JP 2010190704 A JP2010190704 A JP 2010190704A JP 5194076 B2 JP5194076 B2 JP 5194076B2
Authority
JP
Japan
Prior art keywords
substrate
fixing
shaped member
rod
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010190704A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012045830A (ja
Inventor
陽一 今泉
健司 音田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2010190704A priority Critical patent/JP5194076B2/ja
Priority to TW100129921A priority patent/TWI507265B/zh
Priority to KR1020110084765A priority patent/KR101369211B1/ko
Priority to CN201110245629.9A priority patent/CN102380713B/zh
Publication of JP2012045830A publication Critical patent/JP2012045830A/ja
Application granted granted Critical
Publication of JP5194076B2 publication Critical patent/JP5194076B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0012—Brazing heat exchangers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/034—Observing the temperature of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/044—Seam tracking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP2010190704A 2010-08-27 2010-08-27 レーザ割断装置 Expired - Fee Related JP5194076B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010190704A JP5194076B2 (ja) 2010-08-27 2010-08-27 レーザ割断装置
TW100129921A TWI507265B (zh) 2010-08-27 2011-08-22 雷射割斷裝置
KR1020110084765A KR101369211B1 (ko) 2010-08-27 2011-08-24 레이저 할단 장치
CN201110245629.9A CN102380713B (zh) 2010-08-27 2011-08-25 激光切割装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010190704A JP5194076B2 (ja) 2010-08-27 2010-08-27 レーザ割断装置

Publications (2)

Publication Number Publication Date
JP2012045830A JP2012045830A (ja) 2012-03-08
JP5194076B2 true JP5194076B2 (ja) 2013-05-08

Family

ID=45820766

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010190704A Expired - Fee Related JP5194076B2 (ja) 2010-08-27 2010-08-27 レーザ割断装置

Country Status (4)

Country Link
JP (1) JP5194076B2 (ko)
KR (1) KR101369211B1 (ko)
CN (1) CN102380713B (ko)
TW (1) TWI507265B (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5202595B2 (ja) * 2010-09-10 2013-06-05 三星ダイヤモンド工業株式会社 レーザ割断装置
KR101351490B1 (ko) * 2012-03-26 2014-03-12 주식회사 엘티에스 박판 용접장치의 고정지그유닛
JP2014091134A (ja) * 2012-11-01 2014-05-19 Ihi Corp レーザ加工装置
JP6379392B2 (ja) * 2013-05-28 2018-08-29 Ａｇｃ株式会社 ガラス基板の切断方法及びガラス基板の製造方法
JP6420648B2 (ja) * 2014-12-05 2018-11-07 川崎重工業株式会社 ガラス板の割断装置
KR101862088B1 (ko) * 2016-03-03 2018-05-30 에이피시스템 주식회사 Ela 공정용 레이저 빔 조절 모듈
CN105643819B (zh) * 2016-03-18 2017-10-03 武汉华工激光工程有限责任公司 基于激光划线加工工艺的蓝宝石晶圆裂片装置及方法
CN106977089B (zh) * 2017-05-05 2019-11-08 东旭科技集团有限公司 玻璃压断装置、玻璃压断方法和玻璃切割系统
JP6916718B2 (ja) * 2017-11-15 2021-08-11 東レエンジニアリング株式会社 レーザ加工装置
KR102122427B1 (ko) * 2019-01-09 2020-06-12 한국미쯔보시다이아몬드공업(주) 단재 제거 장치
CN110828615A (zh) * 2019-11-20 2020-02-21 苏州沃特维自动化系统有限公司 叠瓦电池串的制作方法
CN111517630B (zh) * 2020-05-29 2024-09-24 河北南玻玻璃有限公司 一种玻璃清边装置
CN113601023B (zh) * 2021-07-27 2023-07-18 杭州康奋威科技股份有限公司 一种电池片低温无损切割装置及方法
CN115521054A (zh) * 2022-10-25 2022-12-27 深圳市益铂晶科技有限公司 一种化学钢化玻璃的激光裂片方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2700136B2 (ja) * 1994-06-02 1998-01-19 双栄通商株式会社 脆性材料の割断方法
JPH1071483A (ja) * 1996-08-29 1998-03-17 Hitachi Constr Mach Co Ltd 脆性材料の割断方法
JP2003321233A (ja) * 2002-04-25 2003-11-11 Nec Kagoshima Ltd ガラス基板切断装置および切断方法
JP4598407B2 (ja) * 2004-01-09 2010-12-15 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP2006175847A (ja) * 2004-11-26 2006-07-06 Shibaura Mechatronics Corp 脆性材料の割断加工システム及びその方法
JP2006199553A (ja) * 2005-01-24 2006-08-03 Sharp Corp 基板分断装置及び基板分断方法
JP2007076937A (ja) * 2005-09-13 2007-03-29 Lemi Ltd スクライブしたガラスの割断方法及び装置
JP2007083693A (ja) * 2005-09-26 2007-04-05 Matsushita Electric Works Ltd セラミック基板の分割方法
JP4675786B2 (ja) * 2006-01-20 2011-04-27 株式会社東芝 レーザー割断装置、割断方法
TWI409122B (zh) * 2007-07-13 2013-09-21 Mitsuboshi Diamond Ind Co Ltd A method for processing a brittle material substrate and a crack forming apparatus for the method
JP5171186B2 (ja) * 2007-09-27 2013-03-27 三星ダイヤモンド工業株式会社 脆性材料基板の割断装置および割断方法
TWI466749B (zh) * 2007-11-02 2015-01-01 Mitsuboshi Diamond Ind Co Ltd Method for Segmentation of Fragile Material Substrate
JP2009154516A (ja) * 2007-12-05 2009-07-16 Nippon Emikku:Kk 脆性基板切断補助装置
JP2010229005A (ja) * 2009-03-30 2010-10-14 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の分断方法
JP5627201B2 (ja) * 2009-06-17 2014-11-19 三星ダイヤモンド工業株式会社 脆性材料基板の割断方法

Also Published As

Publication number Publication date
KR101369211B1 (ko) 2014-03-04
CN102380713A (zh) 2012-03-21
KR20120020065A (ko) 2012-03-07
TW201217094A (en) 2012-05-01
TWI507265B (zh) 2015-11-11
JP2012045830A (ja) 2012-03-08
CN102380713B (zh) 2015-02-11

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