JP5185380B2 - 基板加工システム - Google Patents

基板加工システム Download PDF

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Publication number
JP5185380B2
JP5185380B2 JP2010517785A JP2010517785A JP5185380B2 JP 5185380 B2 JP5185380 B2 JP 5185380B2 JP 2010517785 A JP2010517785 A JP 2010517785A JP 2010517785 A JP2010517785 A JP 2010517785A JP 5185380 B2 JP5185380 B2 JP 5185380B2
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JP
Japan
Prior art keywords
substrate
unit display
display panel
terminal
scribe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010517785A
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English (en)
Japanese (ja)
Other versions
JPWO2009154022A1 (ja
Inventor
生芳 ▲高▼松
和哉 前川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2010517785A priority Critical patent/JP5185380B2/ja
Publication of JPWO2009154022A1 publication Critical patent/JPWO2009154022A1/ja
Application granted granted Critical
Publication of JP5185380B2 publication Critical patent/JP5185380B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • B28D1/226—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles with plural scoring tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
JP2010517785A 2008-06-18 2009-02-20 基板加工システム Expired - Fee Related JP5185380B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010517785A JP5185380B2 (ja) 2008-06-18 2009-02-20 基板加工システム

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008159590 2008-06-18
JP2008159590 2008-06-18
PCT/JP2009/052946 WO2009154022A1 (ja) 2008-06-18 2009-02-20 基板加工システム
JP2010517785A JP5185380B2 (ja) 2008-06-18 2009-02-20 基板加工システム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013005730A Division JP5542976B2 (ja) 2008-06-18 2013-01-16 貼り合せ基板スクライブ加工装置

Publications (2)

Publication Number Publication Date
JPWO2009154022A1 JPWO2009154022A1 (ja) 2011-11-24
JP5185380B2 true JP5185380B2 (ja) 2013-04-17

Family

ID=41433940

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2010517785A Expired - Fee Related JP5185380B2 (ja) 2008-06-18 2009-02-20 基板加工システム
JP2013005730A Expired - Fee Related JP5542976B2 (ja) 2008-06-18 2013-01-16 貼り合せ基板スクライブ加工装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2013005730A Expired - Fee Related JP5542976B2 (ja) 2008-06-18 2013-01-16 貼り合せ基板スクライブ加工装置

Country Status (5)

Country Link
JP (2) JP5185380B2 (zh)
KR (1) KR101105631B1 (zh)
CN (1) CN102057314B (zh)
TW (1) TWI409230B (zh)
WO (1) WO2009154022A1 (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5583478B2 (ja) * 2010-05-25 2014-09-03 株式会社シライテック パネルの折割装置
JP5553242B2 (ja) * 2011-08-01 2014-07-16 三星ダイヤモンド工業株式会社 基板分断方法
KR101281472B1 (ko) * 2011-11-04 2013-07-03 주식회사 탑 엔지니어링 이중 컨트롤러를 구비하는 기판절단장치
JP6207307B2 (ja) * 2013-09-03 2017-10-04 三星ダイヤモンド工業株式会社 ブレイク装置
JP6287548B2 (ja) * 2014-04-28 2018-03-07 三星ダイヤモンド工業株式会社 脆性材料基板の端材分離方法及び端材分離装置
KR20150129156A (ko) 2014-05-08 2015-11-19 삼성디스플레이 주식회사 표시 패널 제조 방법
JP3195489U (ja) * 2014-11-05 2015-01-22 株式会社シライテック パネルの折割装置
KR102471114B1 (ko) * 2016-01-07 2022-11-28 삼성디스플레이 주식회사 기판 절단 장치 및 기판 절단 방법
WO2018016038A1 (ja) * 2016-07-20 2018-01-25 堺ディスプレイプロダクト株式会社 切断装置及び切断方法
JP6829870B2 (ja) * 2016-11-25 2021-02-17 三星ダイヤモンド工業株式会社 基板分断システム
KR102267730B1 (ko) * 2019-05-14 2021-06-23 주식회사 탑 엔지니어링 스크라이브 장치의 제어 방법
JP7455538B2 (ja) 2019-09-19 2024-03-26 キヤノン株式会社 流路形成基板の製造方法、及び液体吐出ヘッドの製造方法
CN111362568A (zh) * 2020-04-30 2020-07-03 河北南玻玻璃有限公司 一种玻璃清边辅助装置
USD973116S1 (en) 2020-11-17 2022-12-20 Applied Materials, Inc. Mainframe of substrate processing system
USD973737S1 (en) 2020-11-17 2022-12-27 Applied Materials, Inc. Mainframe of substrate processing system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004348111A (ja) * 2003-04-28 2004-12-09 Hitachi Displays Ltd 表示装置の製造方法及び製造装置
WO2005087458A1 (ja) * 2004-03-15 2005-09-22 Mitsuboshi Diamond Industrial Co., Ltd. 基板分断システム、基板製造装置、基板スクライブ方法および基板分断方法
JP2005266684A (ja) * 2004-03-22 2005-09-29 Seiko Epson Corp 電気光学装置の製造方法、電気光学装置、電子機器
JP2008056507A (ja) * 2006-08-29 2008-03-13 Seiko Epson Corp 貼合せマザー基板のスクライブ方法および貼合せマザー基板の分割方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100309919B1 (ko) * 1998-11-26 2002-10-25 삼성전자 주식회사 작업대상물의절단및분류자동화시스템과그제어방법
TW200408061A (en) * 2002-07-02 2004-05-16 Mitsuboshi Diamond Ind Co Ltd Substrate slicing system for sealed substrates and the substrate slicing method
US20070063402A1 (en) * 2003-02-21 2007-03-22 Masanobu Soyama Substrate processing table and substrate processing device
WO2005053925A1 (ja) * 2003-12-04 2005-06-16 Mitsuboshi Diamond Industrial Co., Ltd. 基板加工方法、基板加工装置および基板搬送方法、基板搬送機構
JP4777881B2 (ja) * 2004-05-20 2011-09-21 三星ダイヤモンド工業株式会社 マザー基板分断方法、マザー基板スクライブ装置、プログラムおよび記録媒体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004348111A (ja) * 2003-04-28 2004-12-09 Hitachi Displays Ltd 表示装置の製造方法及び製造装置
WO2005087458A1 (ja) * 2004-03-15 2005-09-22 Mitsuboshi Diamond Industrial Co., Ltd. 基板分断システム、基板製造装置、基板スクライブ方法および基板分断方法
JP2005266684A (ja) * 2004-03-22 2005-09-29 Seiko Epson Corp 電気光学装置の製造方法、電気光学装置、電子機器
JP2008056507A (ja) * 2006-08-29 2008-03-13 Seiko Epson Corp 貼合せマザー基板のスクライブ方法および貼合せマザー基板の分割方法

Also Published As

Publication number Publication date
KR20100122954A (ko) 2010-11-23
JPWO2009154022A1 (ja) 2011-11-24
CN102057314A (zh) 2011-05-11
TW201000417A (en) 2010-01-01
TWI409230B (zh) 2013-09-21
KR101105631B1 (ko) 2012-01-18
JP5542976B2 (ja) 2014-07-09
WO2009154022A1 (ja) 2009-12-23
CN102057314B (zh) 2012-03-28
JP2013121913A (ja) 2013-06-20

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