JP5176976B2 - 硬化性組成物 - Google Patents
硬化性組成物 Download PDFInfo
- Publication number
- JP5176976B2 JP5176976B2 JP2009011139A JP2009011139A JP5176976B2 JP 5176976 B2 JP5176976 B2 JP 5176976B2 JP 2009011139 A JP2009011139 A JP 2009011139A JP 2009011139 A JP2009011139 A JP 2009011139A JP 5176976 B2 JP5176976 B2 JP 5176976B2
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- JP
- Japan
- Prior art keywords
- group
- curable composition
- bis
- butoxysilane
- tri
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims description 56
- 229920000642 polymer Polymers 0.000 claims description 32
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- 239000007788 liquid Substances 0.000 claims description 25
- 125000003700 epoxy group Chemical group 0.000 claims description 22
- 229920003257 polycarbosilane Polymers 0.000 claims description 21
- 239000004593 Epoxy Substances 0.000 claims description 18
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 17
- 125000004432 carbon atom Chemical group C* 0.000 claims description 16
- 239000003960 organic solvent Substances 0.000 claims description 16
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 239000013522 chelant Substances 0.000 claims description 11
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- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 8
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910052697 platinum Inorganic materials 0.000 claims description 7
- 150000008065 acid anhydrides Chemical class 0.000 claims description 6
- 125000000962 organic group Chemical group 0.000 claims description 6
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 claims description 4
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 4
- 125000000547 substituted alkyl group Chemical group 0.000 claims description 4
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 2
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 claims 1
- -1 polysiloxane Polymers 0.000 description 57
- 239000000463 material Substances 0.000 description 36
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- 125000000217 alkyl group Chemical group 0.000 description 6
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 6
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- 238000010438 heat treatment Methods 0.000 description 4
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
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- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical class C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
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- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- 239000004954 Polyphthalamide Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- VYGUBTIWNBFFMQ-UHFFFAOYSA-N [N+](#[C-])N1C(=O)NC=2NC(=O)NC2C1=O Chemical group [N+](#[C-])N1C(=O)NC=2NC(=O)NC2C1=O VYGUBTIWNBFFMQ-UHFFFAOYSA-N 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
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- 239000000084 colloidal system Substances 0.000 description 3
- 238000012937 correction Methods 0.000 description 3
- 125000000753 cycloalkyl group Chemical group 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000012769 display material Substances 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
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- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 150000002736 metal compounds Chemical class 0.000 description 3
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 3
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- 239000011368 organic material Substances 0.000 description 3
- INFDPOAKFNIJBF-UHFFFAOYSA-N paraquat Chemical compound C1=C[N+](C)=CC=C1C1=CC=[N+](C)C=C1 INFDPOAKFNIJBF-UHFFFAOYSA-N 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
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- 230000002829 reductive effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
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- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 2
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- JJRUAPNVLBABCN-UHFFFAOYSA-N 2-(ethenoxymethyl)oxirane Chemical compound C=COCC1CO1 JJRUAPNVLBABCN-UHFFFAOYSA-N 0.000 description 2
- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
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- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
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- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 125000005595 acetylacetonate group Chemical group 0.000 description 2
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- 125000003172 aldehyde group Chemical group 0.000 description 2
- MQPPCKJJFDNPHJ-UHFFFAOYSA-K aluminum;3-oxohexanoate Chemical compound [Al+3].CCCC(=O)CC([O-])=O.CCCC(=O)CC([O-])=O.CCCC(=O)CC([O-])=O MQPPCKJJFDNPHJ-UHFFFAOYSA-K 0.000 description 2
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- DCFKHNIGBAHNSS-UHFFFAOYSA-N chloro(triethyl)silane Chemical compound CC[Si](Cl)(CC)CC DCFKHNIGBAHNSS-UHFFFAOYSA-N 0.000 description 2
- KQIADDMXRMTWHZ-UHFFFAOYSA-N chloro-tri(propan-2-yl)silane Chemical compound CC(C)[Si](Cl)(C(C)C)C(C)C KQIADDMXRMTWHZ-UHFFFAOYSA-N 0.000 description 2
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- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
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- ZVQNVYMTWXEMSF-UHFFFAOYSA-N ethyl-tris[(2-methylpropan-2-yl)oxy]silane Chemical compound CC(C)(C)O[Si](CC)(OC(C)(C)C)OC(C)(C)C ZVQNVYMTWXEMSF-UHFFFAOYSA-N 0.000 description 2
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- 125000000468 ketone group Chemical group 0.000 description 2
- 125000002868 norbornyl group Chemical group C12(CCC(CC1)C2)* 0.000 description 2
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- 238000007151 ring opening polymerisation reaction Methods 0.000 description 2
- RINCXYDBBGOEEQ-UHFFFAOYSA-N succinic anhydride Chemical class O=C1CCC(=O)O1 RINCXYDBBGOEEQ-UHFFFAOYSA-N 0.000 description 2
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- QDOHRQCMIFOPEY-UHFFFAOYSA-N tripropoxy(2-tripropoxysilylethyl)silane Chemical compound CCCO[Si](OCCC)(OCCC)CC[Si](OCCC)(OCCC)OCCC QDOHRQCMIFOPEY-UHFFFAOYSA-N 0.000 description 2
- NBAPKCYEEBMZDW-UHFFFAOYSA-N tripropoxy-(2-tripropoxysilylphenyl)silane Chemical compound CCCO[Si](OCCC)(OCCC)C1=CC=CC=C1[Si](OCCC)(OCCC)OCCC NBAPKCYEEBMZDW-UHFFFAOYSA-N 0.000 description 2
- YMAKWPVRMIUZBP-UHFFFAOYSA-N tripropoxy-(3-tripropoxysilylphenyl)silane Chemical compound CCCO[Si](OCCC)(OCCC)C1=CC=CC([Si](OCCC)(OCCC)OCCC)=C1 YMAKWPVRMIUZBP-UHFFFAOYSA-N 0.000 description 2
- FOUOZDXPXSKVEL-UHFFFAOYSA-N tripropoxy-(4-tripropoxysilylphenyl)silane Chemical compound CCCO[Si](OCCC)(OCCC)C1=CC=C([Si](OCCC)(OCCC)OCCC)C=C1 FOUOZDXPXSKVEL-UHFFFAOYSA-N 0.000 description 2
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- NOMOPRKYOOSZKV-UHFFFAOYSA-N 2-(diethoxymethylsilyl)ethyl-triethoxysilane Chemical compound CCOC(OCC)[SiH2]CC[Si](OCC)(OCC)OCC NOMOPRKYOOSZKV-UHFFFAOYSA-N 0.000 description 1
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- CCJXRLHGBZEQIB-UHFFFAOYSA-J 3,5-dioxohexanoate zirconium(4+) Chemical compound [Zr+4].CC(=O)CC(=O)CC([O-])=O.CC(=O)CC(=O)CC([O-])=O.CC(=O)CC(=O)CC([O-])=O.CC(=O)CC(=O)CC([O-])=O CCJXRLHGBZEQIB-UHFFFAOYSA-J 0.000 description 1
- XBIUWALDKXACEA-UHFFFAOYSA-N 3-[bis(2,4-dioxopentan-3-yl)alumanyl]pentane-2,4-dione Chemical compound CC(=O)C(C(C)=O)[Al](C(C(C)=O)C(C)=O)C(C(C)=O)C(C)=O XBIUWALDKXACEA-UHFFFAOYSA-N 0.000 description 1
- YNWKUDCYTJQZLH-UHFFFAOYSA-N 3-bicyclo[2.2.1]heptanyl(tribromo)silane Chemical compound C1CC2C([Si](Br)(Br)Br)CC1C2 YNWKUDCYTJQZLH-UHFFFAOYSA-N 0.000 description 1
- FMUGJGVGEWHETE-UHFFFAOYSA-N 3-bicyclo[2.2.1]heptanyl(trichloro)silane Chemical compound C1CC2C([Si](Cl)(Cl)Cl)CC1C2 FMUGJGVGEWHETE-UHFFFAOYSA-N 0.000 description 1
- XRFPPNWNTQXEMU-UHFFFAOYSA-N 3-bicyclo[2.2.1]heptanyl(triiodo)silane Chemical compound C1CC2C([Si](I)(I)I)CC1C2 XRFPPNWNTQXEMU-UHFFFAOYSA-N 0.000 description 1
- AMUZLNGQQFNPTQ-UHFFFAOYSA-J 3-oxohexanoate zirconium(4+) Chemical compound [Zr+4].CCCC(=O)CC([O-])=O.CCCC(=O)CC([O-])=O.CCCC(=O)CC([O-])=O.CCCC(=O)CC([O-])=O AMUZLNGQQFNPTQ-UHFFFAOYSA-J 0.000 description 1
- WCZOJLBQHTXIPU-UHFFFAOYSA-N 3-tri(butan-2-yloxy)silylpropane-1-thiol Chemical compound CCC(C)O[Si](CCCS)(OC(C)CC)OC(C)CC WCZOJLBQHTXIPU-UHFFFAOYSA-N 0.000 description 1
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
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- KGOOITCIBGXHJO-UHFFFAOYSA-N tris[(2-methylpropan-2-yl)oxy]-phenylsilane Chemical compound CC(C)(C)O[Si](OC(C)(C)C)(OC(C)(C)C)C1=CC=CC=C1 KGOOITCIBGXHJO-UHFFFAOYSA-N 0.000 description 1
- DIZPPYBTFPZSGK-UHFFFAOYSA-N tris[(2-methylpropan-2-yl)oxy]-propylsilane Chemical compound CCC[Si](OC(C)(C)C)(OC(C)(C)C)OC(C)(C)C DIZPPYBTFPZSGK-UHFFFAOYSA-N 0.000 description 1
- QCKKBOHAYRLMQP-UHFFFAOYSA-N tris[(2-methylpropan-2-yl)oxy]silane Chemical compound CC(C)(C)O[SiH](OC(C)(C)C)OC(C)(C)C QCKKBOHAYRLMQP-UHFFFAOYSA-N 0.000 description 1
- DJECDCLXTNZYDL-UHFFFAOYSA-N tritert-butyl(chloro)silane Chemical compound CC(C)(C)[Si](Cl)(C(C)(C)C)C(C)(C)C DJECDCLXTNZYDL-UHFFFAOYSA-N 0.000 description 1
- FUGWOYOEVNYBJX-UHFFFAOYSA-N tritert-butyl(iodo)silane Chemical compound CC(C)(C)[Si](I)(C(C)(C)C)C(C)(C)C FUGWOYOEVNYBJX-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000000870 ultraviolet spectroscopy Methods 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
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Description
上記含ケイ素重合体としては、主鎖にケイ素原子と炭素原子とを有するポリカルボシランや、主鎖にケイ素原子と酸素原子とを有するポリシロキサン等が知られている。
前記(A)重合体は、1気圧、25℃において液状であり、
前記(A)重合体が、(1)Si−H結合を有するポリカルボシランと(2)炭素-炭素多重結合およびエポキシ基を有する化合物とを反応させることにより得られ、
前記(a1)ポリカルボシランは、1気圧、25℃で液状であり、
前記(1)ポリカルボシランは、数平均分子量が300〜1,000,000であり、かつ有機溶媒に可溶であり、
前記(B)硬化剤は、金属キレート化合物、酸無水物、および白金からなる群より選ばれる少なくとも1つであり、
発光ダイオードの封止材として用いられる。
(A)重合体
(A)重合体は、下記一般式(1)で表される繰り返し単位および下記一般式(2)で表される繰り返し単位を有する。
また、前記(A)重合体は、1気圧で、25℃において液体であることが好ましい。前記(A)重合体がこの条件で液体であると、本硬化性組成物の無溶剤での成形加工が可能となる点で好ましい。
(繰り返し単位(1))
(繰り返し単位(2))
(その他の構成単位)
本発明の重合体は、その他の構成単位として下記に記載されている少なくとも1種のシラン化合物由来の構成単位を含有していてもよい。
上記(A)重合体は、たとえば、上記式(1)で示される繰り返し単位(1)を形成し得る化合物と、上記式(2)で示される繰り返し単位(2)を形成し得る化合物とを共重合させることによって得ることができる。前記繰り返し単位(1)を形成し得る化合物としては、たとえば、(a1)Si−H結合を有するポリカルボシラン等を挙げることができる。前記繰り返し単位(2)を形成し得る化合物としては、たとえば、(a2)炭素-炭素多重結合およびエポキシ基を有する化合物等を挙げることができる。
(a1)ポリカルボシランとしては、たとえば、ポリヒドリドメチルジメチルカルボシラン、ポリヒドリドメチルジメチルシリルエチレン、ポリヒドリドメチルジメチルシリルプロピレン、ポリヒドリドメチルジメチルシリルブテン等を挙げることができる。
(a2)化合物としては、一分子内に炭素―炭素多重結合とエポキシ基を含有した化合物が挙げられる。たとえば、ビニルシクロヘキセンモノオキサイド、アリルシクロヘキセンオキシド、エポキシシクロヘキシルメチルメタクリラート、ビニルグリシジルエーテル、アリルグリシジルエーテル、グリシジルエーテルメチルメタクリラート等を挙げることができる。これらの中で、ビニルシクロヘキセンモノオキサイド、ビニルグリシジルエーテル等が好ましい。
上記(a1)ポリカルボシランと(a2)化合物とでカップリング反応を行うことにより、(A)重合体が得られる。
上記カップリング反応において、(a1)ポリカルボシランと(a2)化合物との混合モル比は、90:10〜10:90であることが望ましい。より好ましいモル比は80:20〜20:80であり、特に好ましいモル比は70:30〜30:70である。混合モル比が上記の範囲にあるとカップリング反応の反応効率が高く、より高分子量の重合体が得られ、耐熱性に優れた硬化物を得ることが出来る。
上記カップリング反応において用いられる有機溶媒としては、たとえば、アルコール類、芳香族炭化水素類、エーテル類、ケトン類、エステル類などを挙げることができる。上記アルコール類としては、メタノール、エタノール、n−プロピルアルコール、i−プロピルアルコール、i−ブチルアルコール、n−ブチルアルコール、sec−ブチルアルコール、t−ブチルアルコール、n−ヘキシルアルコール、n−オクチルアルコール、エチレングリコール、ジエチレングリコール、トリエチレングリコール、エチレングリコールモノブチルエーテル、エチレングリコールモノエチルエーテルアセテート、ジエチレングリコールモノエチルエーテル、プロピレングリコールモノメチルエーテル、プロピレンモノメチルエーテルアセテート、ジアセトンアルコールなどを挙げることができる。また、芳香族炭化水素類としては、ベンゼン、トルエン、キシレンなどが挙げられ、エーテル類としては、テトラヒドロフラン、ジオキサンなどが挙げられ、ケトン類としては、アセトン、メチルエチルケトン、メチルイソブチルケトン、ジイソブチルケトンなどが挙げられ、エステル類としては、酢酸エチル、酢酸プロピル、酢酸ブチル、炭酸プロピレン、乳酸メチル、乳酸エチル、乳酸ノルマルプロピル、乳酸イソプロピル、3−エトキシプロピオン酸メチル、3−エトキシプロピオン酸エチルなどが挙げられる。これらの有機溶剤は、1種単独で用いても、2種以上を混合して用いてもよい。これらの有機溶媒のうち、カップリング反応では、溶解性の観点からアルコール以外の有機溶媒、たとえば、メチルエチルケトン、メチルイソブチルケトン、トルエン、キシレンなどを使用することが好ましい。
上記カップリング反応に用いられる触媒としては、遷移金属化合物が挙げられる。
(遷移金属化合物)
上記遷移金属化合物としては特に限定されず、例えば、白金 単体、アルミナ、シリカ、カーボンブラック等の担体に白金 固体を分散させたもの、塩化白金 酸、塩化白金 酸とアルコール、アルデヒド、ケトン等との錯体、白金 −オレフィン錯体、白金 (0)−ジビニルテトラメチルジシロキサン錯体が挙げられる。白金 化合物以外の触媒の例としては、RhCl(PPh3)3,RhCl3,RuCl3,IrCl3,FeCl3,AlCl3,PdCl2・H2O,NiCl2,TiCl4等が挙げられる。これらの触媒は単独で用いてもよく、2種類以上を併用してもかまわない。触媒量としては特に制限はないが、(A)成分の環状カルボシラン基1molに対し、10-1〜10-8molの範囲で用いるのが良く、好ましくは10-3〜10-6molの範囲で用いるのがよい。10-8molより少ないと硬化が十分に進行しない。またヒドロシリル化 触媒は一般に高価で腐食性であり、また、水素ガスを大量に発生して硬化物が発泡してしまう場合があるので10-1mol以上用いないのが好ましい。また、上記触媒中にゲル化防止を目的に反応抑制剤を併用してもかまわない。反応抑制剤としては、アセチレンアルコールが好ましく、具体的には1-ブテン-2-オ-ルが好ましい。
上記カップリング反応において、触媒はポリジメチルシロキサンの重量部100に対して0.01〜100重量部、好ましくは0.1〜50重量部添加される。
上記で得られた(A)重合体の貯蔵安定性の点から、カップリング反応後に脱触媒工程として水洗を行うことが好ましい。
水洗に使用する水は、(A)重合体100重量部に対して、通常10〜500重量部、好ましくは20〜300部、より好ましくは30〜200部である。
水洗は、水を添加して十分に攪拌した後、静置し、水相と有機溶媒相との相分離を確認後、下層の水相を除去することにより行う。水洗回数は好ましくは1回以上、さらに好ましくは2回以上である。
また、水洗後に不純物の除去を目的に有機溶媒で抽出しても良い。抽出に必要な有機溶媒は上記の有機溶媒が使用できる。有機溶媒の種類、及びその配合量は適宜選択できる。
(B)硬化剤としては、金属キレート化合物、酸無水物、および白金からなる群より選ばれる少なくとも1つであることが好ましい。
ジ−i−プロポキシ・ビス(エチルアセトアセテート)チタニウム、ジ−i−プロポキシ・ビス(アセチルアセテート)チタニウム、ジ−i−プロポキシ・ビス(アセチルアセトン)チタニウムなどのチタンキレート化合物;ジ−i−プロポキシ・エチルアセトアセテートアルミニウム、ジ−i−プロポキシ・アセチルアセトナートアルミニウム、i−プロポキシ・ビス(エチルアセトアセテート)アルミニウム、i−プロポキシ・ビス(アセチルアセトナート)アルミニウム、トリス(エチルアセトアセテート)アルミニウム、トリス(アセチルアセトナート)アルミニウム、モノアセチルアセトナート・ビス(エチルアセトアセテート)アルミニウムなどのアルミニウムキレート化合物などが挙げられ、これらのうち、得られる硬化物の硬化性と耐湿熱性の観点でアルミニウムキレート化合物が好ましい。
上記(B)硬化剤のうち、金属キレート化合物が特に好ましい。
本発明の硬化性組成物は、さらにシリカ粒子や、エポキシ基含有ポリシロキサン、あるいはオキセタン化合物、チオール化合物、イソシアヌル環構造を有する化合物、アルコキシシランやその加水分解物または縮合物などを含んでいてもよい。また充填剤や蛍光体などの添加剤と混合することで重合体組成物として使用することがより好ましい。例えば、充填剤等を添加することによって、形成される硬化体の強度を向上させることができる。また、蛍光体を加えることにより、LED用の封止材として使用することができる。シリカ粒子を配合する場合は、粉体、またはイソプロピルアルコールなどの極性溶媒やトルエンなどの非極性溶媒に分散した溶媒系のゾルもしくはコロイドなどの形態で使用することもできる。溶媒系のゾルもしくはコロイドの場合、配合後に溶媒溜去すればよい。シリカ粒子の分散性を向上させるために表面処理して用いてもよい。
シリカ粒子溶媒系のゾルもしくはコロイドである場合、その固形分濃度は通常0重量%を超えて50量%以下、好ましくは0.01重量%以上40重量%以下である。
オキセタン化合物としては、下記式(O−1)〜(O−10)で表される化合物が挙げられる。
前記硬化性組成物を硬化することにより硬化物が得られる。
本発明に係る硬化物は、以下の方法により作成することができる。
本発明の硬化性組成物は、LED 素子封止 用、特に青色LED や紫外LED の素子封止用として有用である。つまり、本発明の硬化性組成物はLED封止材用硬化性組成物として好適に使用することができる。本発明の硬化性組成物によりLED封止材を形成すると、従来の素子封止用の硬化物と比較して基材に対する密着性に優れ、電極の黒変防止が可能となる点で好ましい。
ディスプレイ材料としては、例えば、液晶ディスプレイの基板材料、導光板、プリズムシート、偏向板、位相差板、視野角補正フィルム、接着剤、偏光子保護フィルム等の液晶用フィルム等の液晶表示装置周辺材料;次世代フラットパネルディスプレイであるカラープラズマディスプレイ(PDP)の封止 剤、反射防止フィルム、光学補正フィルム、ハウジング材、前面ガラスの保護フィルム、前面ガラス代替材料、接着剤、前面ガラスの保護フィルム、前面ガラス代替材料、接着剤等;プラズマアドレス液晶(PALC)ディスプレイの基板材料、導光板、プリズムシート、偏向板、位相差板、視野角補正フィルム、接着剤、偏光子保護フィルム等;有機EL(エレクトロルミネッセンス)ディスプレイの前面ガラスの保護フィルム、前面ガラス代替材料、接着剤等;フィールドエミッションディスプレイ(FED)の各種フィルム基板、前面ガラスの保護フィルム、前面ガラス代替材料、接着剤等が挙げられる。
光記録材料としては、例えば、VD(ビデオディスク)、CD、CD−ROM、CD−R/CD−RW、DVD±R/DVD±RW/DVD−RAM、MO、MD、PD(相変化ディスク)、光カード用のディスク基板材料、ピックアップレンズ、保護フィルム、封止 剤、接着剤等が挙げられる。
光学機器材料としては、例えば、スチールカメラのレンズ用材料、ファインダープリズム、ターゲットプリズム、ファインダーカバー、受光センサー部等;ビデオカメラの撮影レンズ、ファインダー等;プロジェクションテレビの投射レンズ、保護フィルム、封止 剤、接着剤等;光センシング機器のレンズ用材料、封止 剤、接着剤、フィルム等が挙げられる。
光部品材料としては、例えば、光通信システムでの光スイッチ周辺のファイバー材料、レンズ、導波路、素子の封止 剤、接着剤等;光コネクタ周辺の光ファイバー材料、フェルール、封止 剤、接着剤等;光受動部品、光回路部品である、レンズ、導波路、LED 素子の封止 剤、接着剤等;光電子集積回路(OEIC)周辺の基板材料、ファイバー材料、素子の封止 剤、接着剤等が挙げられる。
光ファイバー材料としては、装飾ディスプレイ用照明・ライトガイド等;工業用のセンサー類、表示・標識類等;通信インフラ用および家庭内のデジタル機器接続用の光ファイバー等が挙げられる。
半導体集積回路周辺材料としては、例えば、LSI、超LSI材料のマイクロリソグラフィー用のレジスト材料等が挙げられる。
光・電子機能有機材料としては、例えば、有機EL素子周辺材料、有機フォトリフラクティブ素子;光−光変換デバイスである光増幅素子、光演算素子、有機太陽電池周辺の基板材料;ファイバー材料;これらの素子の封止 剤、接着剤等が挙げられる。
カルボシランの重量平均分子量は、ゲルパーミエーションクロマトグラフィーにより下記条件で測定し、ポリスチレン換算値として示した。
装置:HLC−8120C(東ソー社製)
カラム:TSK−gel MultiporeHXL−M(東ソー社製)
溶離液:THF、流量0.5mL/min、負荷量5.0%、100μL
得られたエポキシ基含有ポリカルボシランをポリエチレン製容器内で常温で1ヶ月間密栓保存して、ゲル化の有無を目視により判定した。ゲル化していないものについては東京計器社製のBM型粘度計により25℃で粘度測定を行い、下記基準で評価した。
A:保存前後の粘度変化率が20%以下
B:保存前後の粘度変化率が20%超
得られた硬化性組成物を乾燥膜厚が1mmになるように石英ガラス上に塗布した後、100℃で1時間乾燥硬化させ、次いで150℃で5時間乾燥硬化させて硬化体を作製した。この硬化体の硬化性を下記基準で評価した。
A:流動性は無く、タックも無し
B:流動性は無いが、タックが僅かに有る
C:流動性有り
得られた硬化性組成物を乾燥膜厚が1mmになるように石英ガラス上に塗布した後、100℃で1時間乾燥硬化させ、次いで150℃で5時間乾燥硬化させて硬化体を作製した。この硬化体について、波長400〜700nmの分光透過率を紫外可視分光光度計により測定し、下記基準で評価した。
A:光透過率が90%超
B:光透過率が70〜90%
C:光透過率が70%未満
得られた硬化性組成物を乾燥膜厚が1mmになるように石英ガラス上に塗布した後、100℃で1時間乾燥硬化させ、次いで150℃で5時間乾燥硬化させて硬化体を作製した。この硬化体に波長350nm以下の光をカットしたスポットUV照射装置(ウシオ電機社製:SP−VII)を使用して照度5000mW/cm2の紫外線を500時間照射した。紫外線照射後の硬化体の外観を目視で観察し、下記基準で評価した。
A:変化なし
B:黄変した
C:黒く焼け焦げた
得られた硬化性組成物を乾燥膜厚が1mmになるように石英ガラス上に塗布した後、100℃で1時間乾燥硬化させ、次いで150℃で5時間乾燥硬化させて硬化体を作製した。この硬化体を150℃で500時間保管し、保管後の硬化体の外観を目視で観察し、下記基準で評価した。
(色変化)A:変化なし
B:わずかに変色
C:黄色化した
(クラック)A:変化無し
B:少量発生
C:全面に発生
得られた硬化性組成物約2gをアルミ皿に正確に秤量し、100℃で1時間乾燥硬化させ、次いで150℃で5時間乾燥硬化させて硬化体を作製した。この硬化体を温度85℃、湿度85%RHの条件下で14日間保管し、保管前後の重量から重量保持率を算出し、下記基準で評価した。
A:99%以上
B:95%以上〜99%未満
C:95%未満
得られた硬化性組成物を乾燥膜厚が100μmとなるように市販の表面実装型のLEDパッケージ(銀メッキ付)に仕込み、所定の条件で乾燥させ、銀黒色化抑制能評価用サンプルを作製した。容積150cm3の耐圧容器内で0.06gの硫化鉄と0.20gの硫酸を混合後、直ちに銀黒色化抑制能評価用サンプルを仕込み密閉した(硫化水素の理論濃度10vol%)。この耐圧容器を70℃で加熱し、後に冷却して試験サンプルを取出し銀メッキの外観を観察し下記基準で評価した。加熱時間は5時間、10時間で実施した。
A :変化なし
A-:わずかに変色
B :やや変色
C :黒く変色
得られた硬化性組成物をポリフタルアミド基材上に乾燥膜厚が1mmになるように膜を形成した後、所定の温度で6時間加熱することで密着性評価用のサンプルを作成した。
密着評価用のサンプルを85℃、85RH%の恒温恒湿槽に16時間加えた後、直ちに260℃に加熱したハンダリフロー装置中で10分間リフローを行なった。
リフロー後の基板との密着性を顕微鏡で確認し、下記の3点を基準に密着性の評価を行なった。
A:剥離なし
B:硬化体とポリフタルアミド基材間で剥離が発生
JIS C2105に準拠し、得られたエポキシ基含有ポリカルボシランのエポキシ当量を測定した。
冷却器を備え付けた、反応容器中にトルエン360部とビニル基含有エポキシ化合物としてビニルシクロヘキセンモノオキサイド(ダイセル化学工業株式会社製、製品名 セロキサイド2000)21重量部、0.3重量%になるようイソプロピルアルコールで希釈した白金(0)ジビニルテトラメチルシロキサン錯体0.4部を加えて、室温で攪拌・混合を行なった。
滴下が終わった後、反応溶液の温度を60℃まで上昇させた後、さらに2時間反応を追加した。
1H−NMR:-0.2ppm(Si-CH2-Si)Broad,0ppm(Si-CH3)Broad, 1−2ppm(Epoxy)Broad
ヒドリドシリルユニットとビニルエポキシモノマーとのモル比が1:1となるように、トルエン510部、ビニルシクロヘキセンモノオキサイド(ダイセル化学工業株式会社製 製品名 セロキサイド2000)70部、0.3重量%になるようイソプロピルアルコールで希釈した白金(0)ジビニルテトラメチルシロキサン錯体0.6部、starfire systems社製の液状ポリヒドリドメチルジメチルカルボシラン(製品名 HMPCS Si−H含有量=5.7mmol/g)100部を用いた以外は実施例1と同様の操作を行なうことにより、側鎖にエポキシ基を含有したポリジメチルカルボシラン(2)を1気圧、25℃において透明液体として得た。得られたポリジメチルカルボシラン(2)のエポキシ当量を測定した結果、300g/molであった。得られたポリジメチルカルボシラン(2)に対して、1H−NMR,13C−NMR,IR測定により構造同定を行なった。
ヒドリドシリルユニットとビニルエポキシモノマーとのモル比が1:2となるように、トルエン720部、ビニルシクロヘキセンモノオキサイド(ダイセル化学工業株式会社製 製品名 セロキサイド2000)140部、0.3重量%になるようイソプロピルアルコールで希釈した白金(0)ジビニルテトラメチルシロキサン錯体0.8重量部、starfire systems社製の液状ポリヒドリドメチルジメチルカルボシラン(製品名 HMPCS Si−H含有量=5.7mmol/g)100部を用いた以外は実施例1と同様の操作を行なうことにより、側鎖にエポキシ基を含有したポリジメチルカルボシラン(4)を1気圧、25℃において淡黄色液体として得た。得られたポリジメチルカルボシラン(4)のエポキシ当量を測定した結果、200g/molだった。得られたポリジメチルカルボシラン(3)に対して、1H−NMR,13C−NMR,IR測定により構造同定を行なった。
実施例1で用いた液状ポリヒドリドメチルジメチルカルボシラン(1気圧、25℃において液体)100部に硬化剤としてトリス(アセチルアセトナート)アルミニウムの10重量%トルエン溶液を1部加えて充分に攪拌し、硬化性組成物(4)を調製した。この組成物について、上記方法により分子量、保存安定性、硬化性、透明性、耐光性、耐熱性、耐湿熱性、硫化水素バリア性、密着性の評価を行なった。結果を表1に示す。
液状ポリヒドリドメチルジメチルカルボシランの代わりに、分子の末端以外にヒドリドシリル基を有したポリジメチルシロキサン(gelest社製 製品名 HMS−301 Si−H含有量=4.0mmol/g)を使用した以外は実施例1と同様の操作を行なうことにより、側鎖にエポキシ基を含有したポリジメチルシロキサン(5)を1気圧、25℃において無色透明液体として得た。得られたポリジメチルカルボシラン(5)のエポキシ当量を測定した結果、700g/molだった。得られたポリジメチルシロキサン(5)に対して、1H−NMR,13C−NMR,IR測定により構造同定を行なった。
液状ポリヒドリドメチルジメチルカルボシランの代わりに、分子の両末端にヒドリドシリル基を有したポリジメチルシロキサン(gelest社製 製品名 DMS−H03 Si−H含有量=4.4mmol/g)を使用した以外は実施例1と同様の操作を行なうことにより、両末端にエポキシ基を含有したポリジメチルシロキサン(6)を1気圧、25℃において無色透明液体として得た。得られたポリジメチルカルボシラン(6)のエポキシ当量を測定した結果、700g/molだった。得られたポリジメチルシロキサン(6)に対して、1H−NMR,13C−NMR,IR測定により構造同定を行なった。
セロキサイド2021(商品名、ダイセル化学工業(株)製、3,4−エポキシシクロヘキシルメチル−3,4−エポキシシクロヘキサンカルボキシレート)100部に、リカシッドMH−700G(商品名、新日本理化社製、4−メチルヘキサヒドロ無水フタル酸/ヘキサヒドロ無水フタル酸=70/30)、120部を混合して、硬化性組成物(7)を調製した。この組成物について、上記方法により透明性、耐光性、耐熱性、耐湿熱性、硫化水素バリア性、密着性の評価を行なった。結果を表1に示す。
市販の直鎖ポリジメチルシロキサンを主成分とするシリコーン封止剤(モメンティブ・パフォーマンス・マテリアルズ社製のTSE3033A、TSE3033B)を硬化性組成物(8)として、この組成物について、上記方法により透明性、耐光性、耐熱性、硫化水素バリア性、密着性の評価を行なった。結果を表1に示す。
Claims (8)
- (A)下記一般式(1)で表される繰り返し単位および下記一般式(2)で表される繰り返し単位を有する重合体、および(B)硬化剤を含有することを特徴とする硬化性組成物。
- 前記(A)重合体のエポキシ当量が200〜10000g/molであることを特徴とする請求項1に記載の硬化性組成物。
- 前記(A)重合体は、1気圧、25℃において液状であることを特徴とする請求項1または2に記載の硬化性組成物。
- 前記(A)重合体が、(a1)Si−H結合を有するポリカルボシランと(a2)炭素-炭素多重結合およびエポキシ基を有する化合物とを反応させることにより得られることを特徴とする請求項1〜3いずれかに記載の硬化性組成物。
- 前記(a1)ポリカルボシランは、1気圧、25℃で液状であることを特徴とする請求項4に記載の硬化性組成物。
- 前記(a1)ポリカルボシランは、重量平均分子量が300〜1,000,000であり、かつ有機溶媒に可溶であることを特徴とする請求項4に記載の硬化性組成物。
- 前記(B)硬化剤は、金属キレート化合物、酸無水物、および白金からなる群より選ばれる少なくとも1つであることを特徴とする請求項1〜6のいずれかに記載の硬化性組成物。
- 発光ダイオードの封止材として用いられることを特徴とする請求項1〜7のいずれかに記載の硬化性組成物。
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