KR100890321B1 - 적층체, 적층체의 형성 방법, 절연막 및 반도체용 기판 - Google Patents
적층체, 적층체의 형성 방법, 절연막 및 반도체용 기판 Download PDFInfo
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- KR100890321B1 KR100890321B1 KR1020020057737A KR20020057737A KR100890321B1 KR 100890321 B1 KR100890321 B1 KR 100890321B1 KR 1020020057737 A KR1020020057737 A KR 1020020057737A KR 20020057737 A KR20020057737 A KR 20020057737A KR 100890321 B1 KR100890321 B1 KR 100890321B1
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- South Korea
- Prior art keywords
- film
- bis
- alkoxysilane
- group
- acid
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- OZWKZRFXJPGDFM-UHFFFAOYSA-N tripropoxysilane Chemical compound CCCO[SiH](OCCC)OCCC OZWKZRFXJPGDFM-UHFFFAOYSA-N 0.000 description 1
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- GBGOZMPAPWGNGR-UHFFFAOYSA-N tris[(2-methylpropan-2-yl)oxy]-[2-[tris[(2-methylpropan-2-yl)oxy]silyl]ethyl]silane Chemical compound CC(C)(C)O[Si](OC(C)(C)C)(OC(C)(C)C)CC[Si](OC(C)(C)C)(OC(C)(C)C)OC(C)(C)C GBGOZMPAPWGNGR-UHFFFAOYSA-N 0.000 description 1
- ZZEMYLNHCSTIPH-UHFFFAOYSA-N tris[(2-methylpropan-2-yl)oxy]-[2-[tris[(2-methylpropan-2-yl)oxy]silyl]phenyl]silane Chemical compound CC(C)(C)O[Si](OC(C)(C)C)(OC(C)(C)C)C1=CC=CC=C1[Si](OC(C)(C)C)(OC(C)(C)C)OC(C)(C)C ZZEMYLNHCSTIPH-UHFFFAOYSA-N 0.000 description 1
- NNKMRNUOGTXRCM-UHFFFAOYSA-N tris[(2-methylpropan-2-yl)oxy]-[3-[tris[(2-methylpropan-2-yl)oxy]silyl]phenyl]silane Chemical compound CC(C)(C)O[Si](OC(C)(C)C)(OC(C)(C)C)C1=CC=CC([Si](OC(C)(C)C)(OC(C)(C)C)OC(C)(C)C)=C1 NNKMRNUOGTXRCM-UHFFFAOYSA-N 0.000 description 1
- PITXUFPLSLHXRV-UHFFFAOYSA-N tris[(2-methylpropan-2-yl)oxy]-[4-[tris[(2-methylpropan-2-yl)oxy]silyl]phenyl]silane Chemical compound CC(C)(C)O[Si](OC(C)(C)C)(OC(C)(C)C)C1=CC=C([Si](OC(C)(C)C)(OC(C)(C)C)OC(C)(C)C)C=C1 PITXUFPLSLHXRV-UHFFFAOYSA-N 0.000 description 1
- KGOOITCIBGXHJO-UHFFFAOYSA-N tris[(2-methylpropan-2-yl)oxy]-phenylsilane Chemical compound CC(C)(C)O[Si](OC(C)(C)C)(OC(C)(C)C)C1=CC=CC=C1 KGOOITCIBGXHJO-UHFFFAOYSA-N 0.000 description 1
- DIZPPYBTFPZSGK-UHFFFAOYSA-N tris[(2-methylpropan-2-yl)oxy]-propylsilane Chemical compound CCC[Si](OC(C)(C)C)(OC(C)(C)C)OC(C)(C)C DIZPPYBTFPZSGK-UHFFFAOYSA-N 0.000 description 1
- QCKKBOHAYRLMQP-UHFFFAOYSA-N tris[(2-methylpropan-2-yl)oxy]silane Chemical compound CC(C)(C)O[SiH](OC(C)(C)C)OC(C)(C)C QCKKBOHAYRLMQP-UHFFFAOYSA-N 0.000 description 1
- XMUJIPOFTAHSOK-UHFFFAOYSA-N undecan-2-ol Chemical compound CCCCCCCCCC(C)O XMUJIPOFTAHSOK-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
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Abstract
본 발명은 반도체 소자 등의 층간 절연막 재료로서, 화학증착법 (CVD; Chemical Vapor Deposition)으로 형성되는 막과의 밀착성이 우수한 반도체용 절연막의 형성 방법에 관한 것이다.
본 발명은 (A) 평균 관성(慣性) 반경이 10 내지 30 nm인 알콕시실란 화합물 가수분해 축합물(a)를 가열 경화하여 이루어지는 막, 및 (B) 평균 관성 반경이 10 nm 미만인 알콕시실란 가수분해 축합물 (b)를 가열경화하여 이루어지는 막을 적층하여 형성되며, 상기 알콕시실란 화합물의 가수분해 축합물 (a)와 알콕시실란 가수분해 축합물 (b)와의 평균 관성 반경의 차는 5 nm 이상인 것을 특징으로 하는 적층체에 관한 것이다.
적층체, 반도체, 기판, 절연막, 화학증착법, 밀착성, 관성 반경
Description
본 발명은 막 형성법에 관한 것이며, 더욱 상세하게는 반도체 소자 등의 층간 절연막 재료로서, CVD(Chemical Vapor Deposition)법으로 형성되는 막과의 밀착성이 우수한 반도체용 절연막의 형성 방법에 관한 것이다.
종래부터, 반도체 소자 등의 층간 절연막으로서 CVD법 등의 진공 공정으로 형성된 실리카(SiO2)막이 통용되어 왔다. 그리고, 최근에는 더욱 균일한 층간 절연막을 형성하는 것을 목적으로 SOG(Spin on Glass)막이라고 하는 테트라알콕시실란의 가수분해 생성물을 주성분으로 하는 도포형 절연막도 사용된 바 있다. 또한, 반도체 소자 등의 고집적화에 따라, 유기 SOG라 하는 폴리오르가노실록산을 주성분으로 하는 저비유전율의 층간 절연막이 개발되고 있다.
특히 반도체 소자 등이 한층 더 고집적화와 다층화를 수반함에 따라, 더욱 낮은 비유전율 (바람직하게는 비유전율 2.5 이하)을 갖는 동시에 기판과의 밀착성이 우수한 층간 절연막 재료가 요구되고 있다.
저비유전율 재료로는, 암모니아의 존재하에 알콕시실란을 축합하여 얻어지는 미립자와 알콕시실란의 염기성 부분 가수분해물과의 혼합물로 이루어지는 조성물(일본 특허공개 평5-263045, 동5-315319)이나, 폴리알콕시실란의 염기성 가수분해물을 암모니아의 존재하에 축합함으로써 얻어진 도포액(일본 특허공개 평11-340219, 동 11-340220)이 제안되어 있지만, 이들 방법으로 얻어지는 재료는 단체(單體)에서 기판과의 밀착성이 저하되거나, 비유전율이 2.5를 초과되는 문제가 있었다.
본 발명은 상기 문제점을 해결하기 위한 막 형성 방법에 관한 것이며, 더욱 상세하게는, 반도체 소자 등의 층간 절연막으로서, CVD법으로 형성되는 막과의 밀착성이 우수한 반도체용 절연막의 형성 방법을 제공하는 것을 목적으로 한다.
본 발명은,
(A) 평균 관성 반경이 10 내지 30 nm인 알콕시실란 화합물의 가수분해 축합물(a)를 가열 경화하여 이루어지는 막, 및
(B) 평균 관성 반경이 10 nm 미만인 알콕시실란 가수분해 축합물 (b)를 가열경화하여 이루어지는 막을 적층하여 형성되며, 상기 알콕시실란 화합물의 가수분해 축합물 (a)와 알콕시실란 가수분해 축합물 (b)와의 평균 관성 반경의 차는 5 nm 이상인 것을 특징으로 하는 적층체; (A) 알콕시실란 가수분해 축합물을 가열 경화하여 얻어지는 비유전율 2.5 이하의 막, 및 (B) 알콕시실란 가수분해 축합물을 가열 경화하여 얻어지는 비유전율 2.5 초과의 막을 적층하여 형성되며, (A)막과 (B)막과 의 비유전율의 차는 O.3 이상인 것을 특징으로 하는 적층체; 이러한 적층체의 제조 방법; 및 이러한 적층체로 이루어지는 절연막; 및 이 절연막을 사용한 반도체용 기판에 관한 것이다.
본 발명에 있어서, 알콕시실란 가수분해 축합물이라 함은 하기 화학식 1로 표시되는 화합물 (이하, "화합물(1)"이라고 함), 하기 화학식 2로 표시되는 화합물 (이하, "화합물(2)"라고 함) 및 하기 화학식 3으로 표시되는 화합물(이하, "화합물(3)"이라고 함)로 이루어지는 군중에서 선택된 알콕시실란 1종 이상을 가수분해 및 축합하여 얻어지는 것이다.
(식 중, R은 수소 원자, 불소 원자 또는 1가의 유기기를, R1은 1가의 유기기를, a는 1 내지 2의 정수를 각각 나타낸다)
(식 중, R2는 1가의 유기기를 나타낸다)
(식 중, R3 내지 R6은 각각 1가의 유기기로서 동일하거나 상이하고, b 및 c는 각각 0 내지 2의 수로서 동일하거나 상이하고, R7은 산소 원자, 페닐렌기 또는 -(CH2)n-으로 표시되는 기(여기에서, n은 1 내지 6의 정수이다)를, d는 0 또는 1을 각각 나타낸다.
본 발명에 있어서, 가수분해물이라 함은 화합물 (1) 내지 (3)에 포함되는 R1O-기, R2O-기, R4O-기 및 R5O-기 전부가 가수분해되어 있을 필요는 없고, 예를 들면, 이들 중 1개만이 가수분해되어 있는 것, 2개 이상이 가수분해되어 있는 것, 또는, 이들의 혼합물일 수도 있다.
또한, 본 발명에 있어서 축합물은 화합물 (1) 내지 (3)의 가수분해물의 실라놀기를 축합하여 Si-0-Si 결합을 형성한 것이지만, 본 발명에서는 실라놀기가 전부 축합되어 있을 필요는 없고, 미량 중에서 일부의 실라놀기가 축합된 것, 축합의 정도가 다른 것들의 혼합물 등을 포함한 개념이다.
알콕시실란 가수분해 축합물은 상기 화합물 (1) 내지 (3)의 군으로부터 선택된 1종 이상의 실란 화합물을 특정 염기성 화합물의 존재하에 가수분해 및 축합하여 얻어진다.
화합물 (1);
상기 화학식 1에 있어서, R 및 R1의 1가의 유기기로는 알킬기, 아릴기, 알릴기, 글리시딜기 등을 들 수 있다. 또한, 화학식 1에 있어서, R은 1가의 유기기, 특히 알킬기 또는 페닐기인 것이 바람직하다.
여기에서, 알킬기로는 메틸기, 에틸기, 프로필기, 부틸기 등을 들 수 있고, 바람직하게는 탄소수가 1 내지 5이고, 쇄형 또는 분지형이고, 또한 수소 원자가 불소 원자 등에 의해 치환될 수도 있다.
화학식 1에 있어서, 아릴기로는 페닐기, 나프틸기, 메틸페닐기, 에틸페닐기, 클로로페닐기, 브로모페닐기, 플루오로페닐기 등을 들 수 있다.
화학식 1로 표시되는 화합물의 구체예로는 트리메톡시실란, 트리에톡시실란, 트리-n-프로폭시실란, 트리-이소-프로폭시실란, 트리-n-부톡시실란, 트리-sec-부톡시실란, 트리-tert-부톡시실란, 트리페녹시실란, 플루오로트리메톡시실란, 플루오로트리에톡시실란, 플루오로트리-n-프로폭시실란, 플루오로트리-이소-프로폭시실란, 플루오로트리-n-부톡시실란, 플루오로트리-sec-부톡시실란, 플루오로트리-tert-부톡시실란, 플루오로트리페녹시실란 등과;
메틸트리메톡시실란, 메틸트리에톡시실란, 메틸트리-n-프로폭시실란, 메틸트리-이소-프로폭시실란, 메틸트리-n-부톡시실란, 메틸트리-sec-부톡시실란, 메틸트리-tert-부톡시실란, 메틸트리페녹시실란, 에틸트리메톡시실란, 에틸트리에톡시실란, 에틸트리-n-프로폭시실란, 에틸트리-이소-프로폭시실란, 에틸트리-n-부톡시실란, 에틸트리-sec-부톡시실란, 에틸트리-tert-부톡시실란, 에틸트리페녹시실란, 비닐트리메톡시실란, 비닐트리에톡시실란, 비닐트리-n-프로폭시실란, 비닐트리-이소-프로폭시실란, 비닐트리-n-부톡시실란, 비닐트리-sec-부톡시실란, 비닐트리-tert-부톡시실란, 비닐트리페녹시실란, n-프로필트리메톡시실란, n-프로필트리에톡시실 란, n-프로필트리-n-프로폭시실란, n-프로필트리-이소-프로폭시실란, n-프로필트리-n-부톡시실란, n-프로필트리-sec-부톡시실란, n-프로필트리-tert-부톡시실란, n-프로필트리페녹시실란, i-프로필트리메톡시실란, i-프로필트리에톡시실란, i-프로필트리-n-프로폭시실란, i-프로필트리-이소-프로폭시실란, i-프로필트리-n-부톡시실란, i-프로필트리-sec-부톡시실란, i-프로필트리-tert-부톡시실란, i-프로필트리페녹시실란, n-부틸트리메톡시실란, n-부틸트리에톡시디런, n-부틸트리-n-프로폭시실란, n-부틸트리-이소-프로폭시실란, n-부틸트리-n-부톡시실란, n-부틸트리-sec-부톡시실란, n-부틸트리-tert-부톡시실란, n-부틸트리페녹시실란, sec-부틸트리메톡시실란, sec-부틸트리에톡시실란, sec-부틸-트리-n-프로폭시실란, sec-부틸-트리-이소-프로폭시실란, sec-부틸-트리-n-부톡시실란, sec-부틸-트리-sec-부톡시실란, sec-부틸-트리-tert-부톡시실란, sec-부틸-트리페녹시실란, t-부틸트리메톡시실란, t-부틸트리에톡시실란, t-부틸트리-n-프로폭시실란, t-부틸트리-이소-프로폭시실란, t-부틸트리-n-부톡시실란, t-부틸트리-sec-부톡시실란, t-부틸트리-tert-부톡시실란, t-부틸트리페녹시실란, 페닐트리메톡시실란, 페닐트리에톡시실란, 페닐트리-n-프로폭시실란, 페닐트리-이소-프로폭시실란, 페닐트리-n-부톡시실란, 페닐트리-sec-부톡시실란, 페닐트리-tert-부톡시실란, 페닐트리페녹시실란, 비닐트리메톡시실란, 비닐트리에톡시실란, γ-아미노프로필트리메톡시실란, γ-아미노프로필트리에톡시실란, γ-글리시독시프로필트리메톡시실란, γ-글리시독시프로필트리에톡시실란, γ-트리플루오로프로필트리메톡시실란, γ-트리플루오로프로필트리에톡시실란 등과;
디메틸디메톡시실란, 디메틸디에톡시실란, 디메틸-디-n-프로폭시실란, 디메틸-디-이소-프로폭시실란, 디메틸-디-n-부톡시실란, 디메틸-디-sec-부톡시실란, 디메틸-디-tert-부톡시실란, 디메틸디페녹시실란, 디에틸디메톡시실란, 디에틸디에톡시실란, 디에틸-디-n-프로폭시실란, 디에틸-디-이소-프로폭시실란, 디에틸-디-n-부톡시실란, 디에틸-디-sec-부톡시실란, 디에틸-디-tert-부톡시실란, 디에틸디페녹시실란, 디-n-프로필디메톡시실란, 디-n-프로필디에톡시실란, 디-n-프로필-디-n-프로폭시실란, 디-n-프로필-디-이소-프로폭시실란, 디-n-프로필-디-n-부톡시실란, 디-n-프로필-디-sec-부톡시실란, 디-n-프로필-디-tert-부톡시실란, 디-n-프로필-디-페녹시실란, 디-이소-프로필디메톡시실란, 디-이소-프로필디에톡시실란, 디-이소-프로필-디-n-프로폭시실란, 디-이소-프로필-디-이소-프로폭시실란, 디-이소-프로필-디-n-부톡시실란, 디-이소-프로필-디-sec-부톡시실란, 디-이소-프로필-디-tert-부톡시실란, 디-이소-프로필-디-페녹시실란, 디-n-부틸디메톡시실란, 디-n-부틸디에톡시실란, 디-n-부틸-디-n-프로폭시실란, 디-n-부틸-디-이소-프로폭시실란, 디-n-부틸-디-n-부톡시실란, 디-n-부틸-디-sec-부톡시실란, 디-n-부틸-디-tert-부톡시실란, 디-n-부틸-디-페녹시실란, 디-sec-부틸디메톡시실란, 디-sec-부틸디에톡시실란, 디-sec-부틸-디-n-프로폭시실란, 디-sec-부틸-디-이소-프로폭시실란, 디-sec-부틸-디-n-부톡시실란, 디-sec-부틸-디-sec-부톡시실란, 디-sec-부틸-디-tert-부톡시실란, 디-sec-부틸-디-페녹시실란, 디-tert-부틸디메톡시실란, 디-tert-부틸디에톡시실란, 디-tert-부틸-디-n-프로폭시실란, 디-tert-부틸-디-이소-프로폭시실란, 디-tert-부틸-디-n-부톡시실란, 디-tert-부틸-디-sec-부톡시실란, 디-tert-부틸-디-tert-부톡시실란, 디-tert-부틸-디-페녹시실란, 디페닐디메톡시실란, 디페닐-디-에톡시실란, 디페닐-디-n-프로폭시실란, 디페닐-디-이소-프로폭시실란, 디페닐-디-n-부톡시실란, 디페닐-디-sec-부톡시실란, 디페닐-디-tert-부톡시실란, 디페닐디페녹시실란, 디비닐트리메톡시실란 등
을 들 수 있다.
화합물 (1)로서 바람직한 화합물은, 메틸트리메톡시실란, 메틸트리에톡시실란, 메틸트리-n-프로폭시실란, 메틸트리-이소-프로폭시실란, 에틸트리메톡시실란, 에틸트리에톡시실란, 비닐트리메톡시실란, 비닐트리에톡시실란, 페닐트리메톡시실란, 페닐트리에톡시실란, 디메틸디메톡시실란, 디메틸디에톡시실란, 디에틸디메톡시실란, 디에틸디에톡시실란, 디페닐디메톡시실란, 디페닐디에톡시실란 등이다.
이들은, 1종 또는 2종 이상을 동시에 사용할 수도 있다.
화합물 (2);
상기 화학식 2에 있어서, R2로 표시되는 1가의 유기기로는 상기 화학식 1과 동일한 유기기를 들 수 있다.
화학식 2로 표시되는 화합물의 구체예로는, 테트라메톡시실란, 테트라에톡시실란, 테트라-n-프로폭시실란, 테트라-이소-프로폭시실란, 테트라-n-부톡시실란, 테트라-sec-부톡시실란, 테트라-tert-부톡시실란, 테트라페녹시실란 등을 들 수 있다.
화합물 (3);
상기 화학식 3에 있어서, R3 내지 R6으로 표시되는 1가의 유기기로는 상기의 화학식 1과 동일한 유기기를 들 수 있다.
화학식 3에서, R7이 산소 원자인 화합물로는, 헥사메톡시디실록산, 헥사에톡시디실록산, 헥사페녹시디실록산, 1,1,1,3,3-펜타메톡시-3-메틸디실록산, 1,1,1,3,3-펜타에톡시-3-메틸디실록산, 1,1,1,3,3-펜타페녹시-3-메틸디실록산, 1,1,1,3,3-펜타메톡시-3-에틸디실록산, 1,1,1,3,3-펜타에톡시-3-에틸디실록산, 1,1,1,3,3-펜타페녹시-3-에틸디실록산, 1,1,1,3,3-펜타메톡시-3-페닐디실록산, 1,1,1,3,3-펜타에톡시-3-페닐디실록산, 1,1,1,3,3-펜타페녹시-3-페닐디실록산, 1,1,3,3-테트라메톡시-1,3-디메틸디실록산, 1,1,3,3-테트라에톡시-1,3-디메틸디실록산, 1,1,3,3-테트라페녹시-1,3-디메틸디실록산, 1,1,3,3-테트라메톡시-1,3-디에틸디실록산, 1,1,3,3-테트라에톡시-1,3-디에틸디실록산, 1,1,3,3-테트라페녹시-1,3-디에틸디실록산, 1,1,3,3-테트라메톡시-1,3-디페닐디실록산, 1,1,3,3-테트라에톡시-1,3-디페닐디실록산, 1,1,3,3-테트라페녹시-1,3-디페닐디실록산, 1,1,3-트리메톡시-1,3,3-트리메틸디실록산, 1,1,3-트리에톡시-1,3,3-트리메틸디실록산, 1,1,3-트리페녹시-1,3,3-트리메틸디실록산, 1,1,3-트리메톡시-1,3,3-트리에틸디실록산, 1,1,3-트리에톡시-1,3,3-트리에틸디실록산, 1,1,3-트리페녹시-1,3,3-트리에틸디실록산, 1,1,3-트리메톡시-1,3,3-트리페닐디실록산, 1,1,3-트리에톡시-1,3,3-트리페닐디실록산, 1,1,3-트리페녹시-1,3,3-트리페닐디실록산, 1,3-디메톡시-1,1,3,3-테트라메틸디실록산, 1,3-디에톡시-1,1,3,3-테트라메틸디실록산, 1,3-디페 녹시-1,1,3,3-테트라메틸디실록산, 1,3-디메톡시-1,1,3,3-테트라에틸디실록산, 1,3-디에톡시-1,1,3,3-테트라에틸디실록산, 1,3-디페녹시-1,1,3,3-테트라에틸디실록산, 1,3-디메톡시-1,1,3,3-테트라페닐디실록산, 1,3-디에톡시-1,1,3,3-테트라페닐디실록산, 1,3-디페녹시-1,1,3,3-테트라페닐디실록산 등을 들 수 있다.
이들 중에서, 헥사메톡시디실록산, 헥사에톡시디실록산, 1,1,3,3-테트라메톡시-1,3-디메틸디실록산, 1,1,3,3-테트라에톡시-1,3-디메틸디실록산, 1,1,3,3-테트라메톡시-1,3-디페닐디실록산, 1,3-디메톡시-1,1,3,3-테트라메틸디실록산, 1,3-디에톡시-1,1,3,3-테트라메틸디실록산, 1,3-디메톡시-1,1,3,3-테트라페닐디실록산, 1,3-디에톡시-1,1,3,3-테트라페닐디실록산 등을 바람직한 예로 들 수 있다.
또한, 화학식 3에 있어서, d가 0인 화합물로는 헥사메톡시디실란, 헥사에톡시디실란, 헥사페녹시디실란, 1,1,1,2,2-펜타메톡시-2-메틸디실란, 1,1,1,2,2-펜타에톡시-2-메틸디실란, 1,1,1,2,2-펜타페녹시-2-메틸디실란, 1,1,1,2,2-펜타메톡시-2-에틸디실란, 1,1,1,2,2-펜타에톡시-2-에틸디실란, 1,1,1,2,2-펜타페녹시-2-에틸디실란, 1,1,1,2,2-펜타메톡시-2-페닐디실란, 1,1,1,2,2-펜타에톡시-2-페닐디실란, 1,1,1,2,2-펜타페녹시-2-페닐디실란, 1,1,2,2-테트라메톡시-1,2-디메틸디실란, 1,1,2,2-테트라에톡시-1,2-디메틸디실란, 1,1,2,2-테트라페녹시-1,2-디메틸디실란, 1,1,2,2-테트라메톡시-1,2-디에틸디실란, 1,1,2,2-테트라에톡시-1,2-디에틸디실란, 1,1,2,2-테트라페녹시-1,2-디에틸디실란, 1,1,2,2-테트라메톡시-1,2-디페닐디실란, 1,1,2,2-테트라에톡시-1,2-디페닐디실란, 1,1,2,2-테트라페녹시-1,2-디페닐디실란, 1,1,2-트리메톡시-1,2,2-트리메틸디실란, 1,1,2-트리에톡시-1,2,2-트리메틸디실란, 1,1,2-트리페녹시-1,2,2-트리메틸디실란, 1,1,2-트리메톡시-1,2,2-트리에틸디실란, 1,1,2-트리에톡시-1,2,2-트리에틸디실란, 1,1,2-트리페녹시-1,2,2-트리에틸디실란, 1,1,2-트리메톡시-1,2,2-트리페닐디실란, 1,1,2-트리에톡시-1,2,2-트리페닐디실란, 1,1,2-트리페녹시-1,2,2-트리페닐디실란, 1,2-디메톡시-1,1,2,2-테트라메틸디실란, 1,2-디에톡시-1,1,2,2-테트라메틸디실란, 1,2-디페녹시-1,1,2,2-테트라메틸디실란, 1,2-디메톡시-1,1,2,2-테트라에틸디실란, 1,2-디에톡시-1,1,2,2-테트라에틸디실란, 1,2-디페녹시-1,1,2,2-테트라에틸디실란, 1,2-디메톡시-1,1,2,2-테트라페닐디실란, 1,2-디에톡시-1,1,2,2-테트라페닐디실란, 1,2-디페녹시-1,1,2,2-테트라페닐디실란등을 들 수 있다.
이들 중에서, 헥사메톡시디실란, 헥사에톡시디실란, 1,1,2,2-테트라메톡시-1,2-디메틸디실란, 1,1,2,2-테트라에톡시-1,2-디메틸디실란, 1,1,2,2-테트라메톡시-1,2-디페닐디실란, 1,2-디메톡시-1,1,2,2-테트라메틸디실란, 1,2-디에톡시-1,1,2,2-테트라메틸디실란, 1,2-디메톡시-1,1,2,2-테트라페닐디실란, 1,2-디에톡시-1,1,2,2-테트라페닐디실란 등을 바람직한 예로 들 수 있다.
또한, 화학식 3에 있어서, R7이 -(CH2)n-으로 표시되는 기의 화합물로는, 비스(트리메톡시실릴)메탄, 비스(트리에톡시실릴)메탄, 비스(트리-n-프로폭시실릴)메탄, 비스(트리-i-프로폭시실릴)메탄, 비스(트리-n-부톡시실릴)메탄, 비스(트리-sec-부톡시실릴)메탄, 비스(트리-t-부톡시실릴)메탄, 1,2-비스(트리메톡시실릴)에탄, 1,2-비스(트리에톡시실릴)에탄, 1,2-비스(트리-n-프로폭시실릴)에탄, 1,2-비스(트리-i-프로폭시실릴)에탄, 1,2-비스(트리-n-부톡시실릴)에탄, 1,2-비스(트리-sec-부톡시실릴)에탄, 1,2-비스(트리-t-부톡시실릴)에탄, 1-(디메톡시메틸실릴)-1-(트리메톡시실릴)메탄, 1-(디에톡시메틸실릴)-1-(트리에톡시실릴)메탄, 1-(디-n-프로폭시메틸실릴)-1-(트리-n-프로폭시실릴)메탄, 1-(디-i-프로폭시메틸실릴)-1-(트리-i-프로폭시실릴)메탄, 1-(디-n-부톡시메틸실릴)-1-(트리-n-부톡시실릴)메탄, 1-(디-sec-부톡시메틸실릴)-1-(트리-sec-부톡시실릴)메탄, 1-(디-t-부톡시메틸실릴)-1-(트리-t-부톡시실릴)메탄, 1-(디메톡시메틸실릴)-2-(트리메톡시실릴)에탄, 1-(디에톡시메틸실릴)-2-(트리에톡시실릴)에탄, 1-(디-n-프로폭시메틸실릴)-2-(트리-n-프로폭시실릴)에탄, 1-(디-i-프로폭시메틸실릴)-2-(트리-i-프로폭시실릴)에탄, 1-(디-n-부톡시메틸실릴)-2-(트리-n-부톡시실릴)에탄, 1-(디-sec-부톡시메틸실릴)-2-(트리-sec-부톡시실릴)에탄, 1-(디-t-부톡시메틸실릴)-2-(트리-t-부톡시실릴)에탄, 비스(디메톡시메틸실릴)메탄, 비스(디에톡시메틸실릴)메탄, 비스(디-n-프로폭시메틸실릴)메탄, 비스(디-i-프로폭시메틸실릴)메탄, 비스(디-n-부톡시메틸실릴)메탄, 비스(디-sec-부톡시메틸실릴)메탄, 비스(디-t-부톡시메틸실릴)메탄, 1,2-비스(디메톡시메틸실릴)에탄, 1,2-비스(디에톡시메틸실릴)에탄, 1,2-비스(디-n-프로폭시메틸실릴)에탄, 1,2-비스(디-i-프로폭시메틸실릴)에탄, 1,2-비스(디-n-부톡시메틸실릴)에탄, 1,2-비스(디-sec-부톡시메틸실릴)에탄, 1,2-비스(디-t-부톡시메틸실릴)에탄, 1,2-비스(트리메톡시실릴)벤젠, 1,2-비스(트리에톡시실릴)벤젠, 1,2-비스(트리-n-프로폭시실릴)벤젠, 1,2-비스(트리-i-프로폭시실릴)벤젠, 1,2-비스(트리-n-부톡시실릴)벤젠, 1,2-비스(트리-sec-부톡시실릴)벤젠, 1,2-비스(트리-t-부톡시실릴)벤젠, 1,3-비스(트리메톡시실릴)벤젠, 1,3-비스(트리에톡시실릴)벤젠, 1,3-비스(트리-n-프로폭시실릴)벤젠, 1,3-비스(트리-i-프로폭시실릴)벤젠, 1,3-비스(트리-n-부톡시실릴)벤젠, 1,3-비스(트리-sec-부톡시실릴)벤젠, 1,3-비스(트리-t-부톡시실릴)벤젠, 1,4-비스(트리메톡시실릴)벤젠, 1,4-비스(트리에톡시실릴)벤젠, 1,4-비스(트리-n-프로폭시실릴)벤젠, 1,4-비스(트리-i-프로폭시실릴)벤젠, 1,4-비스(트리-n-부톡시실릴)벤젠, 1,4-비스(트리-sec-부톡시실릴)벤젠, 1,4-비스(트리-t-부톡시실릴)벤젠 등을 들 수 있다.
이들 중에서, 비스(트리메톡시실릴)메탄, 비스(트리에톡시실릴)메탄, 1,2-비스(트리메톡시실릴)에탄, 1,2-비스(트리에톡시실릴)에탄, 1-(디메톡시메틸실릴)-1-(트리메톡시실릴)메탄, 1-(디에톡시메틸실릴)-1-(트리에톡시실릴)메탄, 1-(디메톡시메틸실릴)-2-(트리메톡시실릴)에탄, 1-(디에톡시메틸실릴)-2-(트리에톡시실릴)에탄, 비스(디메톡시메틸실릴)메탄, 비스(디에톡시메틸실릴)메탄, 1,2-비스(디메톡시메틸실릴)에탄, 1,2-비스(디에톡시메틸실릴)에탄, 1,2-비스(트리메톡시실릴)벤젠, 1,2-비스(트리에톡시실릴)벤젠, 1,3-비스(트리메톡시실릴)벤젠, 1,3-비스(트리에톡시실릴)벤젠, 1,4-비스(트리메톡시실릴)벤젠, 1,4-비스(트리에톡시실릴)벤젠 등을 바람직한 예로 들 수 있다.
본 발명에 있어서, 알콕시실란 가수분해 축합물을 구성하는 화합물 (1) 내지 (3)으로는 상기 화합물 (1), (2) 및 (3)의 1종 또는 2종 이상을 사용할 수 있다.
또한, 상기 알콕시실란 가수분해 축합물을 구성하는 화합물 (1) 내지 (3)의 군으로부터 선택된 1종 이상의 실란 화합물을 가수분해 및 축합시킬 때에 알콕시실란가수분해 축합물 1 몰 당 0.5 내지 150 몰의 물을 사용하는 것이 바람직하고, 1 내지 100 몰의 물을 첨가하는 것이 특히 바람직하다. 첨가하는 물의 양이 1 몰 이하이면 막의 내균열성이 저하되는 경우가 있고, 150 몰을 초과하면 가수분해 및 축합 반응 중의 중합체가 석출되거나 겔화되는 경우가 있다.
본 발명의 알콕시실란 가수분해 축합물을 제조함에 있어서, 상기 화합물 (1) 내지 (3)의 군으로부터 선택된 1종 이상의 실란 화합물을 가수분해 및 축합시킬 때에 알칼리 촉매, 산촉매, 금속킬레이트 화합물을 사용한다.
알칼리 촉매로는 예를 들면, 수산화나트륨, 수산화칼륨, 수산화리튬, 피리딘, 피롤, 피페라진, 피롤리딘, 피페리딘, 피콜린, 모노에탄올아민, 디에탄올아민, 디메틸모노에탄올아민, 모노메틸디에탄올아민, 트리에탄올아민, 디아자비시클로옥탄, 디아자비시클로노난, 디아자비시클로운데센, 테트라메틸암모늄히드록시드, 테트라에틸암모늄히드록시드, 테트라프로필암모늄히드록시드, 테트라부틸암모늄히드록시드, 암모니아, 메틸아민, 에틸아민, 프로필아민, 부틸아민, 펜틸아민, 헥실아민, 펜틸아민, 옥틸아민, 노닐아민, 데실아민, N,N-디메틸아민, N,N-디에틸아민, N,N-디프로필아민, N,N-디부틸아민, 트리메틸아민, 트리에틸아민, 트리프로필아민, 트리부틸아민, 시클로헥실아민, 트리메틸이미딘, 1-아미노-3-메틸부탄, 디메틸글리신, 3-아미노-3-메틸아민 등을 들 수 있고, 아민 또는 아민염이 바람직하고, 유기 아민 또는 유기 아민염이 특히 바람직하고, 알킬아민, 테트라알킬암모늄히드록시드가 가장 바람직하다.
이러한 알칼리 촉매는 1종 또는 2종 이상을 동시에 사용할 수도 있다.
금속킬레이트 화합물로는 예를 들면, 트리에톡시ㆍ모노(아세틸아세토네이트)티탄, 트리-n-프로폭시ㆍ모노(아세틸아세토네이트)티탄, 트리-i-프로폭시ㆍ모노(아세틸아세토네이트)티탄, 트리-n-부톡시ㆍ모노(아세틸아세토네이트)티탄, 트리-sec-부톡시ㆍ모노(아세틸아세토네이트)티탄, 트리-t-부톡시ㆍ모노(아세틸아세토네이토)티탄, 디에톡시ㆍ비스(아세틸아세토네이트)티탄, 디-n-프로폭시ㆍ비스(아세틸아세토네이트)티탄, 디-i-프로폭시ㆍ비스(아세틸아세토네이트)티탄, 디-n-부톡시ㆍ비스(아세틸아세토네이트)티탄, 디-sec-부톡시ㆍ비스(아세틸아세토네이트)티탄, 디-t-부톡시ㆍ비스(아세틸아세토네이트)티탄, 모노에톡시ㆍ트리스(아세틸아세토네이트)티탄, 모노-n-프로폭시ㆍ트리스(아세틸아세토네이트)티탄, 모노-i-프로폭시ㆍ트리스(아세틸아세토네이트)티탄, 모노-n-부톡시ㆍ트리스(아세틸아세토네이트)티탄, 모노-sec-부톡시ㆍ트리스(아세틸아세토네이트)티탄, 모노-t-부톡시ㆍ트리스(아세틸아세토네이트)티탄, 테트라키스(아세틸아세토네이트)티탄, 트리에톡시ㆍ모노(에틸아세토아세테이트)티탄, 트리-n-프로폭시ㆍ모노(에틸아세토아세테이트)티탄, 트리-i-프로폭시ㆍ모노(에틸아세토아세테이트)티탄, 트리-n-부톡시ㆍ모노(에틸아세토아세테이트)티탄, 트리-sec-부톡시ㆍ모노(에틸아세토아세테이트)티탄, 트리-t-부톡시ㆍ모노(에틸아세토아세테이트)티탄, 디에톡시ㆍ비스(에틸아세토아세테이트)티탄, 디-n-프로폭시ㆍ비스(에틸아세토아세테이트)티탄, 디-i-프로폭시ㆍ비스(에틸아세토아세테이트)티탄, 디-n-부톡시ㆍ비스(에틸아세토아세테이트)티탄, 디-sec-부톡시ㆍ비스(에틸아세토아세테이트)티탄, 디-t-부톡시 ㆍ비스(에틸아세토아세테이트)티탄, 모노에톡시ㆍ트리스(에틸아세토아세테이트)티탄, 모노-n-프로폭시ㆍ트리스(에틸아세토아세테이트)티탄, 모노-i-프로폭시ㆍ트리스(에틸아세토아세테이트)티탄, 모노-n-부톡시ㆍ트리스(에틸아세토아세테이트)티탄, 모노-sec-부톡시ㆍ트리스(에틸아세토아세테이트)티탄, 모노-t-부톡시ㆍ트리스(에틸아세토아세테이트)티탄, 테트라키스(에틸아세토아세테이트)티탄, 모노(아세틸아세토네이트)트리스(에틸아세토아세테이트)티탄, 비스(아세틸아세토네이트)비스(에틸아세토아세테이트)티탄, 트리스(아세틸아세토네이트)모노(에틸아세토아세테이트)티탄 등의 티탄킬레이트 화합물;
트리에톡시ㆍ모노(아세틸아세토네이트)지르코늄, 트리-n-프로폭시ㆍ모노(아세틸아세토네이트)지르코늄, 트리-i-프로폭시ㆍ모노(아세틸아세토네이트)지르코늄, 트리-n-부톡시ㆍ모노(아세틸아세토네이트)지르코늄, 트리-sec-부톡시ㆍ모노(아세틸아세토네이트)지르코늄, 트리-t-부톡시ㆍ모노(아세틸아세토네이트)지르코늄, 디에톡시ㆍ비스(아세틸아세토네이트)지르코늄, 디-n-프로폭시ㆍ비스(아세틸아세토네이트)지르코늄, 디-i-프로폭시ㆍ비스(아세틸아세토네이트)지르코늄, 디-n-부톡시ㆍ비스(아세틸아세토네이트)지르코늄, 디-sec-부톡시ㆍ비스(아세틸아세토네이트)지르코늄, 디-t-부톡시ㆍ비스(아세틸아세토네이트)지르코늄, 모노에톡시ㆍ트리스(아세틸아세토네이트)지르코늄, 모노-n-프로폭시ㆍ트리스(아세틸아세토네이트)지르코늄, 모노-i-프로폭시ㆍ트리스(아세틸아세토네이토)지르코늄, 모노-n-부톡시ㆍ트리스(아세틸아세토네이트)지르코늄, 모노-sec-부톡시ㆍ트리스(아세틸아세토네이트)지르코늄, 모노-t-부톡시ㆍ트리스(아세틸아세토네이토)지르코늄, 테트라키스(아세틸아세 토네이트)지르코늄, 트리에톡시ㆍ모노(에틸아세토아세테이트)지르코늄, 트리-n-프로폭시ㆍ모노(에틸아세토아세테이트)지르코늄, 트리-i-프로폭시ㆍ모노(에틸아세토아세테이트)지르코늄, 트리-n-부톡시ㆍ모노(에틸아세토아세테이트)지르코늄, 트리-sec-부톡시ㆍ모노(에틸아세토아세테이트)지르코늄, 트리-t-부톡시ㆍ모노(에틸아세토아세테이트)지르코늄, 디에톡시ㆍ비스(에틸아세토아세테이트)지르코늄, 디-n-프로폭시ㆍ비스(에틸아세토아세테이트)지르코늄, 디-i-프로폭시ㆍ비스(에틸아세토아세테이트)지르코늄, 디-n-부톡시ㆍ비스(에틸아세토아세테이트)지르코늄, 디-sec-부톡시ㆍ비스(에틸아세토아세테이트)지르코늄, 디-t-부톡시ㆍ비스(에틸아세토아세테이트)지르코늄, 모노에톡시ㆍ트리스(에틸아세토아세테이트)지르코늄, 모노-n-프로폭시ㆍ트리스(에틸아세토아세테이트)지르코늄, 모노-i-프로폭시ㆍ트리스(에틸아세토아세테이트)지르코늄, 모노-n-부톡시ㆍ트리스(에틸아세토아세테이트)지르코늄, 모노-sec-부톡시ㆍ트리스(에틸아세토아세테이트)지르코늄, 모노-t-부톡시ㆍ트리스(에틸아세토아세테이트)지르코늄, 테트라키스(에틸아세토아세테이트)지르코늄, 모노(아세틸아세토네이트)트리스(에틸아세토아세테이트)지르코늄, 비스(아세틸아세토네이트)비스(에틸아세토아세테이트)지르코늄, 트리스(아세틸아세토네이트)모노(에틸아세토아세테이트)지르코늄 등의 지르코늄킬레이트 화합물;
트리스(아세틸아세토네이트)알루미늄, 트리스(에틸아세토아세테이트)알루미늄 등의 알루미늄킬레이트 화합물
등을 들 수 있고, 바람직하게는 티탄 또는 알루미늄의 킬레이트 화합물, 특히 바람직하게는 티탄 킬레이트 화합물을 들 수 있다.
이러한 금속 킬레이트 화합물은, 1종 또는 2종 이상을 동시에 사용할 수도 있다.
산촉매로는 예를 들면, 염산, 질산, 황산, 플루오르화수소산, 인산, 붕산, 옥살산 등의 무기산;
아세트산, 프로피온산, 부탄산, 펜탄산, 헥산산, 헵탄산, 옥탄산, 노난산, 데칸산, 옥살산, 말레산, 메틸말론산, 아디프산, 세바신산, 갈산, 부티르산, 멜리트산, 아라키돈산, 시키미산, 2-에틸헥산산, 올레인산, 스테아린산, 리놀레산, 리놀레인산, 살리실산, 벤조산, p-아미노벤조산, p-톨루엔술폰산, 벤젠술폰산, 모노클로로아세트산, 디클로로아세트산, 트리클로로아세트산, 트리플루오로아세트산, 포름산, 말론산, 술폰산, 프탈산, 푸마르산, 시트르산, 타르타르산, 숙신산, 푸마르산, 이타콘산, 메사콘산, 시트라콘산, 말산, 글루타르산의 가수분해물, 말레산 무수물의 가수분해물, 무수프탈산의 가수분해물 등의 유기산을 들 수 있고, 유기 카르복실산을 더욱 바람직한 예로 들 수 있다.
이러한 산촉매는, 1종 또는 2종 이상을 동시에 사용할 수도 있다.
상기 촉매의 사용량은, 화합물 (1) 내지 (3) 중의 R1O-기, R2O-기, R4O-기 및 R5O-기로 표시되는 기의 총량 1 몰에 대하여 통상, O.0O001 내지 10 몰, 바람직하게는 0.00005 내지 5 몰이다. 촉매의 사용량이 상기 범위내이면, 반응 중의 중합체의 석출이나 겔화의 우려가 적다. 또한, 본 발명에 있어서, 화합물 (1) 내지 (3)을 가수분해할 때의 온도는 통상적으로 0 내지 100 ℃, 바람직하게는 15 내지 80 ℃ 이다.
또, 화합물 (1) 내지 (3)을 완전 가수분해 축합물로 환산했을 때에, 화합물 (2)는 화합물 (1) 내지 (3)의 총량 중, 5 내지 75 중량%, 바람직하게는 10 내지 70 중량%, 더욱 바람직하게는 15 내지 70 중량%이다. 또한, 화합물 (1) 및(또는) (3)은 화합물 (1) 내지 (3)의 총량 중, 95 내지 25 중량%, 바람직하게는 90 내지 30 중량%, 더욱 바람직하게는 85 내지 30 중량%이다. 화합물 (2)가 화합물 (1) 내지 (3)의 총량 중 5 내지 75 중량%인 것이 얻어지는 막의 탄성율이 높고, 또한 저유전성에 특히 우수하다.
여기에서, 본 발명에 있어서, 완전 가수분해 축합물이라 함은 화합물 (1) 내지 (3) 중의 R1O-기, R2O-기, R4O-기 및 R5O-기가 1OO % 가수분해되어 SiOH기가 되고, 더욱 완전하게 축합하여 실록산 구조가 된 것을 의미한다.
또한, 알콕시실란 가수분해 축합물로는 얻어지는 조성물의 저장 안정성이 더욱 우수하기 때문에, 화합물 (1) 및 화합물 (2)의 가수분해 축합물인 것이 바람직하다.
본 발명에서는 기판상에, (B) 평균 관성 반경 10 nm 미만의 알콕시실란 가수분해 축합물로 이루어지는 막 (도포막 B)을 형성하고, 계속해서 (A) 평균 관성 반경 10 내지 30 nm의 알콕시실란 가수분해 축합물로 이루어지는 막 (도포막 A)을 형성한 후에 가열하는 방법 (방법 1), 및 (B) 알콕시실란 가수분해 축합물을 가열 경화하여 얻어진 비유전율이 2.5를 초과하는 막 (경화막 B)을 형성하고, 계속해서 (A)알콕시실란 수분해 축합물을 가열 경화하여 얻어지는 비유전율이 2.5 미만인 막 (경화막 A)을 형성하는 방법 (방법 2)에 의해 적층체를 형성할 수 있다.
본 발명에서는 우선 상기 알콕시실란 가수분해 축합물을 통상, 유기 용매에 용해 또는 분산하여, 필요에 따라서 그 밖의 첨가제를 첨가하여 이루어지는 전체 고형분 농도 1 내지 30 중량%의 막형성 조성물을 기판에 도포하여 건조함으로써 도포막 A를 형성하고, 계속해서 동일하게 하여 도포막 B를 형성한다.
이 유기 용매로는 알코올계 용매, 케톤계 용매, 아미드계 용매, 에스테르계 용매 및 비양성자계 용매의 군으로부터 선택된 1종 이상을 들 수 있다.
여기에서, 알코올계 용매로는 메탄올, 에탄올, n-프로판올, i-프로판올, n-부탄올, i-부탄올, sec-부탄올, t-부탄올, n-펜탄올, i-펜탄올, 2-메틸부탄올, sec-펜탄올, t-펜탄올, 3-메톡시부탄올, n-헥산올, 2-메틸펜탄올, sec-헥산올, 2-에틸부탄올, sec-헵탄올, 헵탄올-3, n-옥탄올, 2-에틸헥산올, sec-옥탄올, n-노닐알코올, 2,6-디메틸헵탄올-4, n-데칸올, sec-운데실알코올, 트리메틸노닐알코올, sec-테트라데실알코올, sec-헵타데실알코올, 페놀, 시클로 헥산올, 메틸시클로헥산올, 3,3,5-트리메틸시클로헥산올, 벤질알코올, 디아세톤알코올 등의 모노알코올계 용매와;
에틸렌 글리콜, 1,2-프로필렌글리콜, 1,3-부틸렌글리콜, 펜탄디올-2,4,2-메틸펜탄디올-2,4,헥산디올-2,5, 헵탄디올-2,4,2-에틸헥산디올-1,3, 디에틸렌글리콜, 디프로필렌글리콜, 트리에틸렌글리콜, 트리프로필렌글리콜 등의 다가 알코올계 용매와;
에틸렌글리콜 모노메틸에테르, 에틸렌글리콜 모노에틸에테르, 에틸렌글리콜 모노프로필에테르, 에틸렌글리콜 모노부틸에테르, 에틸렌글리콜 모노헥실에테르, 에틸렌글리콜 모노페닐에테르, 에틸렌글리콜 모노-2-에틸부틸에테르, 디에틸렌글리콜 모노메틸에테르, 디에틸렌글리콜 모노에틸에테르, 디에틸렌글리콜 모노프로필에테르, 디에틸렌글리콜 모노부틸에테르, 디에틸렌글리콜 모노헥실에테르, 프로필렌글리콜 모노메틸에테르, 프로필렌글리콜 모노에틸에테르, 프로필렌글리콜 모노프로필에테르, 프로필렌글리콜 모노부틸에테르, 디프로필렌글리콜 모노메틸에테르, 디프로필렌글리콜 모노에틸에테르, 디프로필렌글리콜 모노프로필에테르 등의 다가 알코올 부분 에테르계 용매 등을 들 수 있다.
이러한 알코올계 용매는 1종 또는 2종 이상을 동시에 사용할 수도 있다.
케톤계 용매로는 아세톤, 메틸에틸케톤, 메틸-n-프로필케톤, 메틸-n-부틸케톤, 디에틸케톤, 메틸-i-부틸케톤, 메틸-n-펜틸케톤, 에틸-n-부틸케톤, 메틸-n-헥실케톤, 디-i-부틸케톤, 트리메틸노나논, 시클로헥사논, 2-헥사논, 메틸시클로헥사논, 2,4-펜탄디온, 아세토닐아세톤, 아세토페논, 펜촌(fenchone) 등 외에, 아세틸아세톤, 2,4-헥산디온, 2,4-헵탄디온, 3,5-헵탄디온, 2,4-옥탄디온, 3,5-옥탄디온, 2,4-노난디온, 3,5-노난디온, 5-메틸-2,4-헥산디온, 2,2,6,6-테트라메틸-3,5-헵탄디온, 1,1,1,5,5,5-헥사플루오로-2,4-헵탄디온 등의 β-디케톤류 등을 들 수 있다.
이러한 케톤계 용매는 1종 또는 2종 이상을 동시에 사용할 수도 있다.
아미드계 용매로는 포름아미드, N-메틸포름아미드, N,N-디메틸포름아미드, N-에틸포름아미드, N,N-디에틸포름아미드, 아세트아미드, N-메틸아세트아미드, N,N-디메틸아세트아미드, N-에틸아세트아미드, N,N-디에틸아세트아미드, N-메틸프로피온아미드, N-메틸피롤리돈, N-포르밀모르폴린, N-포르밀피페리딘, N-포르밀피롤리딘, N-아세틸모르폴린, N-아세틸피페리딘, N-아세틸피롤리딘 등을 들 수 있다.
이들 아미드계 용매는 1종 또는 2종 이상을 동시에 사용할 수도 있다.
에스테르계 용매로는 디에틸카르보네이트, 탄산에틸렌, 탄산프로필렌, 탄산디에틸, 아세트산메틸, 아세트산에틸, γ-부티로락톤, γ-발레롤락톤, 아세트산n-프로필, 아세트산i-프로필, 아세트산n-부틸, 아세트산i-부틸, 아세트산sec-부틸, 아세트산n-펜틸, 아세트산sec-펜틸, 아세트산3-메톡시부틸, 아세트산메틸펜틸, 아세트산2-에틸부틸, 아세트산2-에틸헥실, 아세트산벤질, 아세트산시클로헥실, 아세트산메틸시클로헥실, 아세트산n-노닐, 아세토아세트산메틸, 아세토아세트산에틸, 아세트산에틸렌글리콜 모노메틸에테르, 아세트산에틸렌글리콜 모노에틸에테르, 아세트산디에틸렌글리콜 모노메틸에테르, 아세트산디에틸렌글리콜 모노에틸에테르, 아세트산디에틸렌글리콜 모노-n-부틸에테르, 아세트산프로필렌글리콜 모노메틸에테르, 아세트산프로필렌글리콜 모노에틸에테르, 아세트산프로필렌글리콜 모노프로필에테르, 아세트산프로필렌글리콜 모노부틸에테르, 아세트산디프로필렌글리콜 모노메틸에테르, 아세트산디프로필렌글리콜 모노에틸에테르, 디아세트산글리콜, 아세트산메톡시트리글리콜, 프로피온산에틸, 프로피온산 n-부틸, 프로피온산 i-아밀, 옥살산디에틸, 옥살산디-n-부틸, 락트산메틸, 락트산에틸, 락트산 n-부틸, 락트산 n-아밀, 말론산디에틸, 프탈산디메틸, 프탈산디에틸 등을 들 수 있다.
이들 에스테르계 용매는, 1종 또는 2종 이상을 동시에 사용할 수도 있다.
비양성자계 용매로는 아세토니트릴, 디메틸술폭시드, N,N,N',N'-테트라에틸술파미드, 헥사메틸인산트리아미드, N-메틸모르폴론, N-메틸피롤, N-에틸피롤, N-메틸-△3-피롤린, N-메틸피페리딘, N-에틸피페리딘, N,N-디메틸피페라진, N-메틸이미다졸, N-메틸-4-피페리돈, N-메틸-2-피페리돈, N-메틸-2-피롤리돈, 1,3-디메틸-2-이미다졸리디논, 1,3-디메틸테트라히드로-2(1H)-피리미디논 등을 들 수 있다.
이러한 유기 용매 중에서, 특히 하기 화학식 4로 표시되는 유기 용매가 더욱 바람직하다.
(식 중, R8 및 R9는 각각 독립적으로 수소 원자, 탄소수 1 내지 4의 알킬기 또는 CH3CO-로부터 선택되는 1가의 유기기를 나타내며, e는 1 내지 2의 정수를 나타낸다)
이상의 유기용매는 1종 또는 2종 이상을 혼합하여 사용할 수 있다. 본 발명에 사용하는 막형성용 조성물은 알콕시실란 가수분해 축합물을 구성하는 화합물 (1) 내지 (3)을 가수분해 및(또는) 축합할 때에 동일한 용매를 사용할 수 있다.
구체적으로는 화합물 (1) 내지 (3)을 용해시킨 용매 중에 물 또는 용매로 희석한 물을 단속적 또는 연속적으로 첨가한다. 이 때, 특정 염기성 화합물은 용매중에 미리 첨가할 수도 있고, 물 첨가시에 수중에 용해 또는 분산시킬 수도 있다. 이 때의 반응 온도는 통상, 0 내지 100 ℃, 바람직하게는 15 내지 90 ℃ 이다.
그 밖의 첨가제
본 발명에 사용하는 막형성용 조성물에는 또한 콜로이드형 실리카, 유기 중합체, 계면활성제, 실란 커플링제, 라디칼 발생제 등의 성분을 첨가할 수도 있다.
콜로이드형 실리카라 함은 예를 들면, 고순도의 무수규산을 상기 친수성 유기 용매에 분산한 분산액이고, 통상, 평균 입경이 5 내지 30 nm, 바람직하게는 10 내지 20 nm이고, 고형분 농도는 10 내지 40 중량% 정도이다. 이러한 콜로이드형 실리카로는 예를 들면, 닛산 가가꾸 고교(주)제 메탄올실리카졸 및 이소프로판올실리카졸; 쇼쿠바이 화학 공업(주)제 오스칼 등을 들 수 있다.
유기 중합체로는 예를 들면, 당쇄 구조를 갖는 화합물, 비닐아미드계 중합체, (메타)아크릴계 중합체, 방향족 비닐 화합물, 덴드리머, 폴리이미드, 폴리아미드산, 폴리아릴렌, 폴리아미드, 폴리퀴녹살린, 폴리옥사디아졸, 불소계 중합체, 폴리알킬렌옥시드 구조를 갖는 화합물 등을 들 수 있다.
폴리알킬렌옥시드 구조를 갖는 화합물로는 폴리메틸렌옥시드 구조, 폴리에틸렌옥시드 구조, 폴리프로필렌옥시드 구조, 폴리테트라메틸렌옥시드 구조, 폴리부틸렌옥시드 구조 등을 들 수 있다. 구체적으로는, 폴리옥시메틸렌알킬에테르, 폴리옥시에틸렌알킬에테르, 폴리옥시에틸렌알킬페닐에테르, 폴리옥시에틸렌스텔롤에테르, 폴리옥시에틸렌라놀린 유도체, 알킬페놀포르말린 축합물의 산화에틸렌 유도체, 폴리옥시에틸렌폴리옥시프로필렌 블록 공중합체, 폴리옥시에틸렌폴리옥시프로필렌알킬에테르 등의 에테르형 화합물, 폴리옥시에틸렌글리세린 지방산 에스테르, 폴리 옥시에틸렌소르비탄 지방산 에스테르, 폴리옥시에틸렌소르비톨 지방산 에스테르, 폴리옥시에틸렌 지방산 알칸올아미드황산염 등의 에테르에스테르형 화합물, 폴리에틸렌글리콜 지방산 에스테르, 에틸렌 글리콜 지방산 에스테르, 지방산 모노글리세라이드, 폴리글리세린 지방산 에스테르, 소르비탄 지방산 에스테르, 프로필렌글리콜 지방산 에스테르, 자당 지방산 에스테르 등의 에테르에스테르형 화합물 등을 들 수 있다.
폴리옥시에틸렌폴리옥시프로필렌 블록 공중합체로는 하기와 같은 블럭 구조를 갖는 화합물을 들 수 있다.
-(X)j-(Y)k-
-(X)j-(Y)k-(X)1-
(식 중, X는 -CH2CH2O-로 표시되는 기를, Y는-CH2CH(CH3)O-로 표시되는 기를 각각 나타내며, j는 1 내지 90, k는 10 내지 99, 1은 0 내지 90의 수를 나타낸다)
이들 중에서 폴리옥시에틸렌알킬에테르, 폴리옥시에틸렌폴리옥시프로필렌 블록 공중합체, 폴리옥시에틸렌폴리옥시프로필렌알킬에테르, 폴리옥시에틸렌글리세린 지방산에스테르, 폴리옥시에틸렌소르비탄 지방산에스테르, 폴리옥시에틸렌소르비톨 지방산에스테르 등의 에테르형 화합물을 더욱 바람직한 예로 들 수 있다.
이들은 1종 또는 2종 이상을 동시에 사용할 수도 있다.
계면활성제로는 예를 들면, 비이온계 계면활성제, 음이온계 계면활성제, 양이온계 계면활성제, 양성 계면활성제 등을 들 수 있고, 추가로 불소계 계면활성제, 실리콘계 계면활성제, 폴리알킬렌옥시드계 계면활성제, 폴리(메타)아크릴레이트계 계면활성제 등을 들 수 있고, 바람직하게는 불소계 계면활성제, 실리콘계 계면활성제를 들 수 있다.
불소계 계면활성제로는 예를 들면 1,1,2,2-테트라플루오로옥틸(1,1,2,2-테트라플루오로프로필)에테르, 1,1,2,2-테트라플루오로옥틸헥실에테르, 옥타에틸렌글리콜디(1,1,2,2-테트라플루오로부틸)에테르, 헥사에틸렌 글리콜(1,1,2,2,3,3-헥사플루오로펜틸)에테르, 옥타프로필렌글리콜디(1,1,2,2-테트라플루오로부틸)에테르, 헥사프로필렌글리콜디(1,1,2,2,3,3-헥사플루오로펜틸)에테르, 퍼플루오로도데실술폰산나트륨, 1,1,2,2,8,8,9,9,10,10-데카플루오로도데칸, 1,1,2,2,3,3-헥사플루오로데칸, N-[3-(퍼플루오로옥탄술폰아미드)프로필]-N,N'-디메틸-N-카르복시메틸렌암모늄베타인, 퍼플루오로알킬술폰아미드프로필트리메틸암모늄염, 퍼플루오로알킬-N-에틸술포닐글리신염, 인산비스(N-퍼플루오로옥틸술포닐-N-에틸아미노에틸), 모노퍼플루오로알킬에틸인산에스테르 등의 말단, 주쇄 및 측쇄 중 적어도 어느 한 부위에 플루오로알킬 또는 플루오로알킬렌기를 갖는 화합물로 이루어지는 불소계 계면활성제를 들 수 있다.
또한, 시판품으로는 메가팩 F142D, 동 F172, 동 F173, 동 F183 (이상, 다이닛본 잉크 가가꾸 고교(주)제조), 에프톱 EF 301, 동 303, 동 352(신아끼다 화성(주)제조), 플로라이드 FC-430, 동 FC-431(스미또모 쓰리엠(주) 제조), 아사히가드 AG710, 서프론 S-382, 동 SC-101, 동 SC-102, 동 SC-103, 동 SC-104, 동 SC-105, 동 SC-106(아사히 글라스(주) 제조), BM-1000, BM-1100(유쇼(주)제조), NBX-15(( 주)네오스) 등의 명칭으로 시판되고 있는 불소계 계면활성제를 들 수 있다. 이들 중에서도, 상기 메가팩 F172, BM-1000, BM-1100, NBX-15가 특히 바람직하다.
실리콘계 계면활성제로는 예를 들면, SH7PA, SH21PA, SH30PA, ST94PA (모두 도레이ㆍ다우 코닝ㆍ실리콘(주) 제조) 등을 사용할 수 있다. 이들 중에서도, 상기 SH28PA, SH30PA가 특히 바람직하다.
계면활성제의 사용량은 알콕시실란 가수분해 축합물 (완전 가수분해 축합물)에 대하여 통상 O.0001 내지 10 중량부이다.
이들은 1종 또는 2종 이상을 동시에 사용할 수도 있다.
실란 커플링제로는 예를 들면, 3-글리시딜옥시프로필트리메톡시실란, 3-아미노글리시딜옥시프로필트리에톡시실란, 3-메타크릴옥시프로필트리메톡시실란, 3-글리시딜옥시프로필메틸디메톡시실란, 1-메타크릴옥시프로필메틸디메톡시실란, 3-아미노프로필트리메톡시실란, 3-아미노프로필트리에톡시실란, 2-아미노프로필트리메톡시실란, 2-아미노프로필트리에톡시실란, N-(2-아미노에틸)-3-아미노프로필트리메톡시실란, N-(2-아미노에틸)-3-아미노프로필메틸디메톡시실란, 3-우레이도프로필트리메톡시실란, 3-우레이도프로필트리에톡시실란, N-에톡시카르보닐-3-아미노프로필트리메톡시실란, N-에톡시카르보닐-3-아미노프로필트리에톡시실란, N-트리에톡시실릴프로필트리에틸렌트리아민, N-트리에톡시실릴프로필트리에틸렌트리아민, 10-트리메톡시실릴-1,4,7-트리아자데칸, 10-트리에톡시실릴-1,4,7-트리아자데칸, 9-트리메톡시실릴-3,6-디아자노닐아세테이트, 9-트리에톡시실릴-3,6-디아자노닐아세테이트, N-벤질-3-아미노프로필트리메톡시실란, N-벤질-3-아미노프로필트리에톡시실란, N- 페닐-3-아미노프로필트리메톡시실란, N-페닐-3-아미노프로필트리에톡시실란, N-비스(옥시에틸렌)-3-아미노프로필트리메톡시실란, N-비스(옥시에틸렌)-3-아미노프로필트리에톡시실란 등을 들 수 있다.
이들은 1종 또는 2종 이상을 동시에 사용할 수도 있다.
라디칼 발생제로는 예를 들면, 이소부티릴퍼옥시드, α,α'비스(네오데카노일퍼옥시)디이소프로필벤젠, 쿠밀퍼옥시네오데카노에이트, 디-n프로필퍼옥시디카르보네이트, 디이소프로필퍼옥시디카르보네이트, 1,1,3,3-테트라메틸부틸퍼옥시네오데카노에이트, 비스(4-t-부틸시클로헥실)퍼옥시디카르보네이트, 1-시클로헥실-1-메틸에틸퍼옥시네오데카노에이트, 디-2-에톡시에틸퍼옥시디카르보네이트, 디(2-에틸헥실퍼옥시)디카르보네이트, t-헥실퍼옥시네오데카노에이트, 디메톡시부틸퍼옥시디카르보네이트, 디(3-메틸-3-메톡시부틸퍼옥시)디카르보네이트, t-부틸퍼옥시네오데카노에이트, 2,4-디클로로벤조일퍼옥시드, t-헥실퍼옥시피발레이트, t-부틸퍼옥시피발레이트, 3,5,5-트리메틸헥사노일퍼옥시드, 옥타노일퍼옥시드, 라우로일퍼옥시드, 스테알로일퍼옥시드, 1,1,3,3-테트라메틸부틸퍼옥시2-에틸헥사노에이트, 숙시닉퍼옥시드, 2,5-디메틸-2,5-디(2-에틸헥사노일퍼옥시)헥산, 1-시클로헥실-1-메틸에틸퍼옥시2-에틸헥사노에이트, t-헥실퍼옥시2-에틸헥사노에이트, t-부틸퍼옥시2-에틸헥사노에이트, m-톨루오일앤드벤조일퍼옥시드, 벤조일퍼옥시드, t-부틸퍼옥시이소부틸레이트, 디-t-부틸퍼옥시-2-메틸시클로헥산, 1,1-비스(t-헥실퍼옥시)-3,3,5-트리메틸시클로헥산, 1,1-비스(t-헥실퍼옥시)시클로헥산, 1,1-비스(t-부틸퍼옥시)-3,3,5-트리메틸시클로헥산, 1,1-비스(t-부틸퍼옥시)시클로헥산, 2,2-비스(4,4-디-t-부틸퍼옥시시클로헥실)프로판, 1,1-비스(t-부틸퍼옥시)시클로데칸, t-헥실퍼옥시이소프로필모노카르보네이트, t-부틸퍼옥시말레산, t-부틸퍼옥시-3,3,5-트리메틸헥사노에이트, t-부틸퍼옥시라우레이트, 2,5-디메틸-2,5-디(m-톨루오일퍼옥시)헥산, t-부틸퍼옥시이소프로필모노카르보네이트, t-부틸퍼옥시2-에틸헥실모노카르보네이트, t-헥실퍼옥시벤조에이트, 2,5-디메틸-2,5-디(벤조일퍼옥시)헥산, t-부틸퍼옥시아세테이트, 2,2-비스(t-부틸퍼옥시)부탄, t-부틸퍼옥시벤조에이트, n-부틸-4,4-비스(t-부틸퍼옥시)발레레이트, 디-t-부틸퍼옥시이소프탈레이트, α,α'비스(t-부틸퍼옥시)디이소프로필벤젠, 디쿠밀퍼옥시드, 2,5-디메틸-2,5-디(t-부틸퍼옥시)헥산, t-부틸쿠밀퍼옥시드, 디-t-부틸퍼옥시드, p-멘탄히드로퍼옥시드, 2,5-디메틸-2,5-디(t-부틸퍼옥시)헥신-3, 디이소프로필벤젠히드로퍼옥시드, t-부틸트리메틸실릴퍼옥시드, 1,1,3,3-테트라메틸부틸히드로퍼옥시드, 쿠멘히드로퍼옥시드, t-헥실히드로퍼옥시드, t-부틸히드로퍼옥시드, 2,3-디메틸-2,3-디페닐부탄 등을 들 수 있다.
라디칼 발생제의 배합량은, 중합체 100 중량부에 대하여 0.1 내지 10 중량부가 바람직하다.
이들은 1종 또는 2종 이상을 동시에 사용할 수도 있다.
본 발명에 있어서, 방법 1에 있어서는 평균 관성 반경 10 내지 30 nm의 알콕시실란 가수분해 축합물, 방법 2에 있어서는 비유전율 2.5 미만의 막을 얻기 위한 알콕시실란 가수분해 축합물을 합성할 때의 촉매가 알칼리 촉매인 것이 바람직하다.
막을 적층할 때에는 CVD막과 접하는 막이, 방법 1에 있어서는 도포막 B가, 방법2에 있어서는 경화막 B가, CVD막과 막과의 밀착성의 관점에서 각각 바람직하다.
또한, 방법 1에 있어서 도포막 A의 막 두께에 대하여 도포막 B의 막 두께는 1/2 내지 1/20이 바람직하고, 방법 2에 있어서는 경화막 A에 대하여 경화막 B의 막 두께는 1/2 내지 1/20이 바람직하다.
방법 1에 있어서 도포막 B의 막 두께가 도포막 A의 막 두께의 1/2을 초과하는 경우, 절연막의 실효 유전율이 증가하고, 1/20 미만이면 CVD막과의 밀착성 개량 효과가 적다.
본 발명의 CVD막은 Si를 함유하고 또한, O, C, N, H의 군으로부터 선택되는 1종 이상의 원소를 더욱 함유하는 막이다. 이러한 막으로는 예를 들면, 테트라메톡시실란, 테트라에톡시실란, 메틸트리메톡시실란, 메틸트리에톡시실란, 디메틸디메톡시실란, 디메틸디에톡시실란, 실란, 테트라메틸실란, 트리메틸실란, 디메틸실란, 메틸실란, 에틸실란, 페닐실란, 디페닐실란, 디실라노메탄, 비스(메틸실라노)메탄, 1,2-디실라노에탄, 1,2-비스(메틸실라노)에탄, 2,2-디실라노프로판, 1,3,5-트리실라노-2,4,6-트리메틸렌, 1,3-디메틸디실록산, 1,1,3,3-테트라메틸디실록산, 트리메틸실록산, 1,3-비스(실라노메틸렌)디실록산, 비스(1-메틸디실록사닐)메탄, 2,2-비스(1-메틸디실록사닐)프로판, 2,4,6,8-테트라메틸시클로테트라실록산, 옥타메틸시클로테트라실록산, 2,4,6-트리실란테트라히드로피란, 2,5-디실란테트라히드로푸란, 및 이들의 유도체를 사용하고, 산소, 일산화탄소, 이산화탄소, 질소, 아르 곤, 암모니아, N2O 등의 존재하에 플라즈마 중합된 막을 사용할 수 있다.
기판에 막형성용 조성물을 도포할 때에는, 스핀코팅, 침지법, 롤코팅법, 스프레이법 등의 도장 수단이 사용된다.
이 때의 막 두께는 건조막 두께로서, 1회 도장으로 두께 0.02 내지 2.5 ㎛ 정도, 2회 도장으로는 두께 0.04 내지 5.0 ㎛ 정도의 막을 형성할 수 있다. 그 후, 상온에서 건조하거나, 또는 80 내지 600 ℃ 정도의 온도에서 통상, 5 내지 240분 정도 가열하여 건조함으로써, 유리질 또는 거대 고분자의 절연막을 형성할 수 있다.
이 때의 가열 방법으로는 핫 플레이트, 오븐, 퍼니스 등을 사용할 수 있고, 가열 분위기로는 대기하, 질소분위기, 아르곤분위기, 진공하, 산소 농도를 조절시킨 감압하 등에서 행할 수 있다.
또한, 전자선이나 자외선을 조사함으로써 막을 형성시킬 수 있다.
또한, 상기 막의 경화 속도를 제어하기 위해, 필요에 따라서, 단계적으로 가열하거나, 질소, 공기, 산소, 감압 등의 분위기를 선택할 수 있다.
이와 같이 하여 얻어지는 층간 절연막은 CVD막과의 밀착성이 우수하기 때문에 LSI, 시스템 LSI, DRAM, SDRAM, RDRAM, D-RDRAM 등의 반도체 소자용 층간 절연막이나 에칭 스토퍼막, 반도체 소자의 표면 코팅막 등의 보호막, 다층 레지스트를 사용한 반도체 제조 공정의 중간층, 다층 배선 기판의 층간 절연막, 액정 표시 소자용의 보호막이나 절연막, 전장발광 표시 소자용 보호막이나 절연막 등의 용도에 유용하다.
<실시예>
이하, 본 발명을 실시예를 들어 더욱 구체적으로 설명한다. 단, 이하의 기재는 본 발명의 형태예를 개괄적으로 나타내는 것이고, 특별한 이유 없이 이러한 기재에 의해 본 발명이 한정되는 것은 아니다.
또한, 실시예 및 비교예 중의 부 및 %는 특기하지 않는 한, 각각 중량부 및 중량%를 나타낸다.
또한, 각종 평가는 다음과 같이하여 행하였다.
관성 반경
하기 조건에 의한 겔 투과크로마토그래피(GPC)(굴절율, 점도, 광산란 측정)법에 의해 측정하였다.
시료 용액: 알콕시실란 가수분해 축합물을 고형분 농도가 0.25 %가 되도록 10 mM의 LiBr을 포함하는 메탄올로 희석하여, GPC(굴절율, 점도, 광산란 측정)용 시료 용액으로 하였다.
장치: 도소(주) 제조, GPC 시스템 모델 GPC-8020
도소(주) 제조, 컬럼 Alpha 5000/3000
비스코텍사 제조, 점도 검출기 및 광산란 검출기
모델 T-60 듀얼미터
캐리어 용액: 10 mM의 LiBr을 포함하는 메탄올
캐리어 송액 속도: 1 ml/분
컬럼 온도: 40 ℃
막의 비유전율
8 인치 실리콘 웨이퍼 상에 스핀코팅법을 사용하여 조성물 시료를 도포하고, 핫 플레이트상에서 80 ℃에서 1 분간, 질소 분위기 200 ℃에서 1 분간 기판을 건조하였다. 또한, 이 기판을 400 ℃의 질소 분위기의 핫 플레이트에서 18분 동안 소성하였다. 얻어진 막에 대하여, 증착법에 의해 알루미늄 전극 패턴을 형성시키고 비유전율 측정용 샘플을 제조하였다. 상기 샘플을 주파수 100 kHz의 주파수로 요코가와ㆍ휴렛팩커드(주)제 HP 16451B 전극 및 HP 4284A 플래시죤 LCR 미터를 사용하여 CV법에 의해 해당 막의 비유전율을 측정하였다.
적층막의 밀착성
적층막의 밀착성은 기판의 최상층에 에폭시 수지를 사용하여 스터드(stud) 핀 10개를 고정하여 150 ℃에서 1 시간 건조시켰다. 이 스터드핀을 세바스찬법을 이용하여 방출 시험을 행하고 이하의 기준으로 밀착성을 평가하였다.
○: 스터드핀 10개 모두 CVD막과 막의 계면에서 박리 없음
×: CVD막과 막의 계면에서 박리 발생
<합성예 1>
석영으로 제조된 분리 플라스크에, 증류 에탄올 570 g, 이온 교환수 160 g과 10 % 수산화테트라메틸암모늄 수용액 30 g을 넣고 균일하게 교반하였다. 이 용액에 메틸트리메톡시실란 136 g과 테트라에톡시실란 209 g의 혼합물을 첨가하였다. 용액을 60 ℃로 유지한 채로, 5 시간 반응을 행하였다. 이 용액에 프로필렌글리콜 모노프로필에테르 300 g을 첨가한 후, 50 ℃에서 증발기를 사용하여 용액을 10 %(완전 가수분해 축합물 환산)가 될 때까지 농축하고, 그 후 아세트산의 10 % 프로필렌글리콜 모노프로필에테르 용액 1O g을 첨가하여, 반응액 ①을 얻었다.
이와 같이 하여 얻어진 축합물 등의 관성 반경은 17.8 nm이고, 비유전율은 2.23이었다.
<합성예 2>
석영으로 제조된 분리 플라스크에, 증류 에탄올 570 g, 이온 교환수 160 g과 10 % 수산화테트라메틸암모늄 수용액 10Og을 넣어 균일하게 교반하였다. 이 용액에 메틸트리메톡시실란 136 g과 테트라에톡시실란 209 g의 혼합물을 첨가하였다. 용액을 60 ℃로 유지한 채로, 5 시간 반응을 행하였다. 이 용액에 프로필렌글리콜 모노프로필에테르 300 g를 첨가한 후, 50 ℃에서 증발기를 사용하여 용액을 10 %(완전 가수분해 축합물 환산)가 될 때까지 농축하고, 그 후, 아세트산의 10 % 프로필렌글리콜 모노프로필에테르 용액 1O g을 첨가하여, 반응액 ②를 얻었다.
이와 같이 하여 얻어진 축합물 등의 관성 반경은 5.7 nm이고, 비유전율은 2.67이었다.
<합성예 3>
석영으로 제조된 분리 플라스크에, 메틸트리메톡시실란 154.24 g, 테트라메톡시실란 288.83 g과 증류 프로필렌글리콜 모노에틸에테르 250 g을 용해시켜 말레산 10 g을 용해한 이온 교환수 297 g를 1 시간 동안 이 용액에 적하하였다. 이 용액을 50 ℃에서 3 시간 반응시킴으로써 반응액 ③을 얻었다.
이와 같이 하여 얻어진 축합물 등의 관성 반경은, 0.2 nm이고, 비유전율은 2.88이었다.
<합성예 4>
석영으로 제조된 분리 플라스크 중에서, 메틸트리메톡시실란 276.01 g, 테트라메톡시실란 86.14 g 및 테트라키스(아세틸아세토네이트)티탄 0.0092 g을 프로필렌글리콜 모노에틸에테르 101 g에 용해시킨 후, 쓰리원 모터로 교반시켜, 용액 온도를 55 ℃로 안정시켰다. 이어서, 이온 교환수 225.52 g과 프로필렌글리콜 모노에틸에테르 263.00 g의 혼합 용액을 1 시간 동안 용액에 첨가하였다. 그 후, 55 ℃에서 4 시간 반응시킨 후, 아세틸아세톤 48.12 g을 첨가하여, 30 분간 더욱 반응시켜, 반응액을 실온까지 냉각하였다. 50 ℃에서 반응액으로부터 메탄올과 물을 포함하는 용액을 227 g 증발기로 제거하여, 반응액 ④를 얻었다.
이와 같이 하여 얻어진 축합물 등의 관성 반경은 0.3 nm이고, 비유전율은 2.85이었다.
<합성예 5>
석영으로 제조된 분리 플라스크에, 증류 에탄올 570 g, 이온 교환수 160 g과 10 % 수산화테트라메틸암모늄 수용액 30 g을 넣어 균일하게 교반하였다. 이 용액에 메틸트리메톡시실란 136 g과 테트라에톡시실란 209 g의 혼합물을 첨가하였다. 용액을 58 ℃로 유지한 채로, 4 시간 반응을 행하였다. 이 용액에 프로필렌글리콜 모노프로필에테르 300 g을 첨가한 후, 50 ℃의 증발기를 사용하여 용액을 10 %(완전 가수분해 축합물 환산)가 될 때까지 농축하고, 그 후, 아세트산의 10 % 프로필 렌글리콜 모노프로필에테르 용액 1O g을 첨가하여, 반응액 ⑤를 얻었다.
이와 같이 하여 얻어진 축합물 등의 관성 반경은 15.8 nm이고, 비유전율은 2.32이었다.
<실시예 1>
8 인치 실리콘 웨이퍼 상에 어플라이드 머티리얼(Applied Material) 제조 프로듀서(Producer) S를 사용하여, 테트라에톡시실란의 CVD막을 1000 Å 형성하였다. 이 막의 원소 조성은 Si(32 원자%), O(64 원자%), H(4 원자%)이었다.
이 막위에 반응액 ②를 5O0 Å 도포한 후, 8O ℃에서 1 분간, 200 ℃에서 1분간 기판을 건조하였다. 또한, 이 기판 위에 반응액 ①을 50O0 Å 도포한 후, 80 ℃에서 1 분간, 200 ℃에서 1 분간 기판을 건조하였다. 이 기판을 400 ℃의 질소분위기의 핫 플레이트에서 18 분간 더욱 소성하였다.
이 적층막의 밀착성을 평가하였더니 CVD막과 막의 계면에서의 박리는 인정되지 않았다.
<실시예 2>
8 인치 실리콘 웨이퍼상에 어플라이드 머티리얼 제조 프로듀서 S를 사용하여, 테트라메틸실란의 CVD막을 1000 Å 형성하였다. 이 막의 원소 조성은 Si(26 원자%), O(3 원자%), C(26 원자%), H(45 원자%)이었다.
이 막 위에 반응액 ③을 500 Å 도포한 후, 80 ℃에서 1 분간, 200 ℃에서 1 분간 기판을 건조하였다. 또한, 이 기판 위에 반응액 ①을 4000 Å 도포한 후, 80 ℃에서 1 분간, 200 ℃에서 1 분간 기판을 건조하였다. 이 기판을 400 ℃의 질소 분위기의 핫 플레이트에서 18 분간 더욱 소성하였다.
이 적층막의 밀착성을 평가하였더니 CVD막과 막의 계면에서의 박리는 인정되지 않았다.
<실시예 3>
8 인치 실리콘 웨이퍼 상에 네벨루스(Nevellus) 제조 세퀄 익스프레스(Sequel Express)를 이용하여, 트리메틸실란의 CVD막을 1000 Å 형성하였다. 이 막의 원소 조성은 Si(25 원자%), O(4 원자%), C(21 원자%), N(14 원자%), H(36 원자%)이었다.
이 막 위에, 반응액 ④를 500 Å 도포한 후, 80 ℃에서 1 분간, 200 ℃에서 1 분간 기판을 건조하였다. 또한, 이 기판 위에 반응액 ①을 4000 Å 도포한 후, 80 ℃에서 1 분간, 200 ℃에서 1 분간 기판을 건조하였다. 이 기판을 400 ℃의 질소 분위기의 핫 플레이트에서 18 분간 더욱 소성하였다.
이 적층막의 밀착성을 평가하였더니 CVD막과 막의 계면에서의 박리는 인정되지 않았다.
<실시예 4>
8 인치 실리콘 웨이퍼 상에 네벨루스 제조 세퀄 익스프레스를 사용하여, 실란과 암모니아의 CVD막을 1000 Å 형성하였다. 이 막의 원소 조성은 Si(50 원자%), O(4 원자%), C(3 원자%), N(40 원자%), H(4 원자%)이었다.
이 막 위에, 반응액 ②를 500 Å 도포한 후, 8O ℃에서 1 분간, 20O ℃에서 1 분간 기판을 건조하였다. 또한, 이 기판 위에 반응액 ①을 4000 Å 도포한 후, 80 ℃에서 1 분간, 200 ℃에서 1 분간 기판을 건조하였다. 또한 이 기판을 400 ℃의 질소 분위기의 핫 플레이트에서 18 분간 더욱 소성하였다.
이 적층막의 밀착성을 평가하였더니 CVD막과 막의 계면에서의 박리는 인정되지 않았다.
<실시예 5>
실시예 2에 있어서, 얻어진 기판 위에 반응액 ③을 500 Å 도포한 후, 80 ℃에서 1 분간, 200 ℃에서 1 분간 기판을 건조하여, 이 기판을 400 ℃의 질소 분위기의 핫 플레이트에서 18 분간 더욱 소성하였다. 이 기판에 어플라이드 머티리얼 제조 프로듀서 S를 사용하여, 테트라에톡시실란의 CVD막을 1000 Å 형성하였다. 이 막의 원소 조성은 Si(32 원자%), O(64 원자%), H(4 원자%)이었다.
이 적층막의 밀착성을 평가하였더니 CVD막과 막의 계면에서의 박리는 인정되지 않았다.
<실시예 6>
실시예 3에서 얻어진 기판 위에, 반응액 ④를 500 Å 도포한 후, 80 ℃에서 1 분간, 200 ℃에서 1 분간 기판을 건조하여, 이 기판을 400 ℃의 질소 분위기의 핫 플레이트에서 18 분간 소성하였다. 이 기판에 네벨루스 제조 세퀄 익스프레스를 사용하여, 트리메틸실란의 CVD막을 1000 Å 형성하였다. 이 막의 원소 조성은 Si(25 원자%), 0(4 원자%), C(21 원자%), N(14 원자%), H(36 원자%)이었다.
이 적층막의 밀착성을 평가하였더니 CVD막과 막의 계면에서의 박리는 인정되지 않았다.
<비교예 1>
8 인치 실리콘 웨이퍼 상에 어플라이드 머티리얼 제조 프로듀서 S를 사용하여, 테트라에톡시실란의 CVD막을 1000 Å 형성하였다. 이 막의 원소 조성은 Si(32 원자%), O(64 원자%), H(4 원자%)이었다.
이 막 위에 반응액 ①을 5000 Å 도포한 후, 80 ℃에서 1 분간, 200 ℃에서 1 분간 기판을 건조하였다. 이 기판을 400 ℃의 질소 분위기의 핫 플레이트에서 18 분간 더욱 소성하였다.
이 적층막의 밀착성을 평가하였더니 스터드핀 7개에서 CVD막과 막의 계면에서의 박리가 인정되었다.
<비교예 2>
8 인치 실리콘 웨이퍼 상에 어플라이드 머티리얼 제조 프로듀서 S를 사용하여, 테트라에톡시실란의 CVD막을 1000 Å 형성하였다. 이 막의 원소 조성은 Si(32 원자%), O(64 원자%), H(4 원자%)이었다.
이 막 위에, 반응액 ⑤을 50O Å 도포한 후, 8O ℃에서 1 분간, 200 ℃에서 1 분간 기판을 건조하였다. 또한, 이 기판 위에 반응액 ①을 5000 Å 도포한 후, 80 ℃에서 1 분간, 200 ℃에서 1 분간 기판을 건조하였다. 이 기판을 400 ℃의 질소 분위기의 핫 플레이트에서 18 분간 더욱 소성하였다.
이 적층막의 밀착성을 평가하였더니 스터드핀의 5개에서 CVD막과 막의 계면에서의 박리가 인정되었다.
<비교예 3>
8 인치 실리콘 웨이퍼 상에 어플라이드 머티리얼 제조 프로듀서 S를 사용하여, 테트라에톡시실란의 CVD막을 1000 Å 형성하였다. 이 막의 원소 조성은 Si(32 원자%), O(64 원자%), H(4 원자%)이었다.
이 막 위에, 반응액 ①을 50O0 Å 도포한 후, 8O ℃에서 1 분간, 2O0 ℃에서 1 분간 기판을 건조하였다. 이 기판을 400 ℃의 질소 분위기의 핫 플레이트에서 18 분간 더욱 소성하였다. 이 막 위에 어플라이드 머티리얼 제조 프로듀서 S를 사용하여, 테트라에톡시실란의 CVD막을 1000 Å 형성하였다. 이 막의 원소 조성은 Si(32 원자%), O(64 원자%), H(4 원자%)이었다.
이 적층막의 밀착성을 평가하였더니 스터드핀의 3개에서 하층 CVD막과 막의 계면에서의 박리와, 5개에서 막과 상층 CVD막의 계면에서의 박리가 인정되었다.
본 발명에 의하면, 관성 반경차가 5 nm 이상인 2종 이상의 알콕시실란 화합물 가수분해 축합물, 또는 비유전율차가 0.3 이상인 2종 이상의 알콕시실란가수분해물 축합물을 기판에 도포 소성하여 적층하는 것을 특징으로 하는 막 형성 방법을 적용함으로써 CVD막과의 밀착성이 우수한 층간 절연막 (반도체용 기판)을 제공하는 것이 가능하다.
Claims (8)
- (A) 평균 관성(慣性) 반경이 10 내지 30 nm인 알콕시실란 화합물의 가수분해 축합물 (a)를 가열경화하여 이루어지는 막, 및 (B) 평균 관성 반경이 10 nm 미만인 알콕시실란 가수분해 축합물 (b)를 가열 경화하여 이루어지는 막을 적층하여 형성되며,상기 알콕시실란 화합물의 가수분해 축합물 (a)와 알콕시실란 가수분해 축합물 (b)와의 평균 관성 반경의 차는 5 nm 이상인 것을 특징으로 하는 적층체.
- (A) 알콕시실란 가수분해 축합물을 가열 경화하여 얻어지는 비유전율 2.5 이하의 막, 및 (B) 알콕시실란 가수분해 축합물을 가열 경화하여 얻어지는 비유전율 2.5 초과의 막을 적층하여 형성되며, 상기 (A)막과 상기 (B)막과의 비유전율의 차는 0.3 이상인 것을 특징으로 하는 적층체.
- 제1항 또는 제2항에 있어서, 알콕시실란 가수분해 축합물이, 하기 화학식 1로 표시되는 화합물, 하기 화학식 2로 표시되는 화합물 및 하기 화학식 3으로 표시되는 화합물의 군으로부터 선택된 1종 이상의 실란 화합물을 가수분해 및 축합한 것을 특징으로 하는 적층체.<화학식 1>RaSi(OR1)4-a식 중, R은 수소 원자, 불소 원자 또는 1가의 유기기를, R1은 1가의 유기기를, a는 1 내지 2의 정수를 각각 나타낸다.<화학식 2>Si(OR2)4식 중, R2는 1가의 유기기를 나타낸다.<화학식 3>R3 b(R4O)3-bSi-(R7)d-Si(OR5) 3-cR6 c식 중, R3 내지 R6은 각각 1가의 유기기로서 동일하거나 상이하고, b 및 c는 각각 0 내지 2의 수로서 동일하거나 상이하고, R7은 산소 원자, 페닐렌기 또는-(CH2)n-으로 표시되는 기(여기에서, n은 1 내지 6의 정수임)를, d는 0 또는 1을 각각 나타낸다.
- 기판에 (B) 알콕시실란 화합물을 가수분해 및 축합하여 얻어지는 평균 관성 반경 1O nm 미만의 화합물 및 유기 용매를 포함하는 도포액을 도포하여 건조하고, 계속해서 (A) 알콕시실란 화합물을 가수분해 및 축합하여 얻어지는 평균 관성 반경 10 내지 30 nm의 화합물 및 유기 용매를 포함하는 도포액을 도포한 후, 가열하는 것을 특징으로 하는 적층체의 형성 방법.
- 제4항에 있어서, 기판이 Si를 함유하는 동시에 O, C, N, H의 군으로부터 선택되는 1종 이상의 원소를 더욱 함유하는 것을 특징으로 하는 적층체의 형성 방법.
- 제4항에 있어서, Si를 함유하는 동시에 O, C, N, H의 군으로부터 선택되는 1종 이상의 원소를 함유하는 막을 추가로 적층하는 것을 특징으로 하는 적층체의 형성 방법.
- 제1항에 기재된 적층체로 이루어지는 절연막.
- 제7항에 기재된 절연막을 사용한 반도체용 기판.
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US20050196535A1 (en) * | 2004-03-02 | 2005-09-08 | Weigel Scott J. | Solvents and methods using same for removing silicon-containing residues from a substrate |
US20050196974A1 (en) * | 2004-03-02 | 2005-09-08 | Weigel Scott J. | Compositions for preparing low dielectric materials containing solvents |
EP1615260A3 (en) * | 2004-07-09 | 2009-09-16 | JSR Corporation | Organic silicon-oxide-based film, composition and method for forming the same, and semiconductor device |
JP4756128B2 (ja) * | 2004-10-20 | 2011-08-24 | 日揮触媒化成株式会社 | 半導体加工用保護膜形成用塗布液、その調製方法およびこれより得られる半導体加工用保護膜 |
US7265063B2 (en) | 2004-10-22 | 2007-09-04 | Hewlett-Packard Development Company, L.P. | Method of forming a component having dielectric sub-layers |
KR101709596B1 (ko) * | 2010-10-01 | 2017-02-23 | 후지필름 가부시키가이샤 | 간극 매입용 조성물, 그것을 사용한 간극 매입 방법 및 반도체 소자의 제조 방법 |
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001115028A (ja) * | 1999-08-12 | 2001-04-24 | Jsr Corp | 膜形成用組成物、膜の形成方法およびシリカ系膜 |
KR20010077882A (ko) * | 1999-09-29 | 2001-08-20 | 마쯔모또 에이찌 | 막 형성용 조성물, 막의 형성 방법 및 절연막 |
Family Cites Families (7)
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US6770975B2 (en) * | 1999-06-09 | 2004-08-03 | Alliedsignal Inc. | Integrated circuits with multiple low dielectric-constant inter-metal dielectrics |
JP4195773B2 (ja) | 2000-04-10 | 2008-12-10 | Jsr株式会社 | 層間絶縁膜形成用組成物、層間絶縁膜の形成方法およびシリカ系層間絶縁膜 |
US6413647B1 (en) * | 2000-02-28 | 2002-07-02 | Jsr Corporation | Composition for film formation, method of film formation, and silica-based film |
EP1160848B1 (en) * | 2000-05-22 | 2011-10-05 | JSR Corporation | Composition for silica-based film formation |
EP1226604B1 (en) * | 2000-06-30 | 2007-02-28 | Tokyo Electron Limited | Fabrication process of a semiconductor device |
KR20040005920A (ko) * | 2001-04-16 | 2004-01-16 | 허니웰 인터내셔날 인코포레이티드 | 적층 구조물 및 이의 제조 방법 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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