JP5173699B2 - 有機ｅｌデバイス製造装置 - Google Patents

有機ｅｌデバイス製造装置 Download PDF

Info

Publication number
JP5173699B2
JP5173699B2 JP2008246499A JP2008246499A JP5173699B2 JP 5173699 B2 JP5173699 B2 JP 5173699B2 JP 2008246499 A JP2008246499 A JP 2008246499A JP 2008246499 A JP2008246499 A JP 2008246499A JP 5173699 B2 JP5173699 B2 JP 5173699B2
Authority
JP
Japan
Prior art keywords
substrate
processing
chamber
unit
organic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008246499A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010077487A (ja
Inventor
雅 若林
信広 韮沢
賢治 弓場
行雄 落合
幹夫 浅田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Technologies Corp filed Critical Hitachi High Technologies Corp
Priority to JP2008246499A priority Critical patent/JP5173699B2/ja
Priority to TW102102345A priority patent/TW201330162A/zh
Priority to TW098126365A priority patent/TW201023291A/zh
Priority to KR1020090074026A priority patent/KR101119748B1/ko
Priority to CN200910165275XA priority patent/CN101685848B/zh
Priority to CN2012101858909A priority patent/CN102709491A/zh
Publication of JP2010077487A publication Critical patent/JP2010077487A/ja
Priority to KR1020110058475A priority patent/KR101090590B1/ko
Application granted granted Critical
Publication of JP5173699B2 publication Critical patent/JP5173699B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Robotics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
JP2008246499A 2008-09-25 2008-09-25 有機ｅｌデバイス製造装置 Expired - Fee Related JP5173699B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2008246499A JP5173699B2 (ja) 2008-09-25 2008-09-25 有機ｅｌデバイス製造装置
TW102102345A TW201330162A (zh) 2008-09-25 2009-08-05 有機電激發光裝置之製造裝置及角度修正機構
TW098126365A TW201023291A (en) 2008-09-25 2009-08-05 Organic EL device manufacturing apparatus and method, film-forming apparatus and method
KR1020090074026A KR101119748B1 (ko) 2008-09-25 2009-08-12 유기 ｅｌ 디바이스 제조 장치 및 유기 ｅｌ 디바이스 제조 방법 및 성막 장치 및 성막 방법
CN200910165275XA CN101685848B (zh) 2008-09-25 2009-08-17 有机el器件制造装置及其制造方法以及成膜装置及成膜方法
CN2012101858909A CN102709491A (zh) 2008-09-25 2009-08-17 有机el器件制造装置
KR1020110058475A KR101090590B1 (ko) 2008-09-25 2011-06-16 유기 ｅｌ 디바이스 제조 장치 및 성막 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008246499A JP5173699B2 (ja) 2008-09-25 2008-09-25 有機ｅｌデバイス製造装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012284367A Division JP2013110114A (ja) 2012-12-27 2012-12-27 有機ｅｌデバイス製造装置及び角度補正機構

Publications (2)

Publication Number Publication Date
JP2010077487A JP2010077487A (ja) 2010-04-08
JP5173699B2 true JP5173699B2 (ja) 2013-04-03

Family

ID=42048896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008246499A Expired - Fee Related JP5173699B2 (ja) 2008-09-25 2008-09-25 有機ｅｌデバイス製造装置

Country Status (4)

Country Link
JP (1) JP5173699B2 (zh)
KR (2) KR101119748B1 (zh)
CN (2) CN101685848B (zh)
TW (2) TW201023291A (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140040312A (ko) * 2012-09-24 2014-04-03 주식회사 원익아이피에스 기판 처리장치
US8692806B2 (en) 2001-11-02 2014-04-08 Neonode Inc. On a substrate formed or resting display arrangement
US9710144B2 (en) 2012-11-27 2017-07-18 Neonode Inc. User interface for curved input device
US9778794B2 (en) 2001-11-02 2017-10-03 Neonode Inc. Light-based touch screen
US10007422B2 (en) 2009-02-15 2018-06-26 Neonode Inc. Light-based controls in a toroidal steering wheel

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101321690B1 (ko) * 2010-04-28 2013-10-23 가부시키가이샤 알박 진공 처리 장치, 기판과 얼라인먼트 마스크의 이동 방법 및 위치 맞춤 방법 그리고 성막 방법
JP5492027B2 (ja) * 2010-08-31 2014-05-14 株式会社日立ハイテクノロジーズ 有機ｅｌデバイス製造装置及び製造方法
JP2013172015A (ja) * 2012-02-21 2013-09-02 Hitachi High-Technologies Corp 成膜装置、及び成膜装置用基板搬送機構
KR101346071B1 (ko) * 2012-03-27 2013-12-31 에스엔유 프리시젼 주식회사 유기물 증착 시스템
JP2014070241A (ja) * 2012-09-28 2014-04-21 Hitachi High-Technologies Corp 蒸着装置および蒸着方法
KR101990555B1 (ko) 2012-12-24 2019-06-19 삼성디스플레이 주식회사 박막봉지 제조장치 및 박막봉지 제조방법
JP2013110114A (ja) * 2012-12-27 2013-06-06 Hitachi High-Technologies Corp 有機ｅｌデバイス製造装置及び角度補正機構
KR20160087953A (ko) * 2015-01-14 2016-07-25 에스엔유 프리시젼 주식회사 유기발광소자 제조용 클러스터 타입 증착장치
JP7202168B2 (ja) * 2018-12-13 2023-01-11 キヤノントッキ株式会社 成膜装置、有機ｅｌパネルの製造システム、及び成膜方法
WO2021013358A1 (en) * 2019-07-25 2021-01-28 Applied Materials, Inc. System and method to evaporate an oled layer stack in a vertical orientation

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW504941B (en) * 1999-07-23 2002-10-01 Semiconductor Energy Lab Method of fabricating an EL display device, and apparatus for forming a thin film
JP4078813B2 (ja) * 2001-06-12 2008-04-23 ソニー株式会社 成膜装置および成膜方法
JP3811943B2 (ja) * 2001-07-06 2006-08-23 日本精機株式会社 有機ｅｌパネルの製造方法。
JP4027072B2 (ja) * 2001-10-18 2007-12-26 松下電器産業株式会社 減圧プラズマ処理装置及びその方法
TWI277363B (en) * 2002-08-30 2007-03-21 Semiconductor Energy Lab Fabrication system, light-emitting device and fabricating method of organic compound-containing layer
JP2004241319A (ja) * 2003-02-07 2004-08-26 Sony Corp 成膜装置
US7211461B2 (en) * 2003-02-14 2007-05-01 Semiconductor Energy Laboratory Co., Ltd. Manufacturing apparatus
JP2004288463A (ja) * 2003-03-20 2004-10-14 Semiconductor Energy Lab Co Ltd 製造装置
JP4493955B2 (ja) * 2003-09-01 2010-06-30 東京エレクトロン株式会社 基板処理装置及び搬送ケース
JP4538650B2 (ja) * 2004-06-18 2010-09-08 京セラ株式会社 蒸着装置
JP4503384B2 (ja) * 2004-07-28 2010-07-14 大日本スクリーン製造株式会社 基板処理装置
KR100656182B1 (ko) * 2004-08-16 2006-12-12 두산디앤디 주식회사 유기박막 소자의 양산 제작용 선형의 증착 공정 장치와 기판 이송 장치
JP2006228598A (ja) * 2005-02-18 2006-08-31 Nippon Seiki Co Ltd 有機ｅｌパネルの製造方法
EP1715078A1 (de) * 2005-04-20 2006-10-25 Applied Films GmbH & Co. KG Kontinuierliche OLED-Beschichtungsanlage
KR100727849B1 (ko) * 2005-10-27 2007-06-14 세메스 주식회사 병렬 인라인 증착 시스템
KR100780042B1 (ko) * 2006-03-06 2007-11-27 (주) 디오브이 유기전계 발광 디스플레이 소자 증착장치
JP5036290B2 (ja) * 2006-12-12 2012-09-26 東京エレクトロン株式会社 基板処理装置および基板搬送方法、ならびにコンピュータプログラム

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8692806B2 (en) 2001-11-02 2014-04-08 Neonode Inc. On a substrate formed or resting display arrangement
US9778794B2 (en) 2001-11-02 2017-10-03 Neonode Inc. Light-based touch screen
US10007422B2 (en) 2009-02-15 2018-06-26 Neonode Inc. Light-based controls in a toroidal steering wheel
KR20140040312A (ko) * 2012-09-24 2014-04-03 주식회사 원익아이피에스 기판 처리장치
US9710144B2 (en) 2012-11-27 2017-07-18 Neonode Inc. User interface for curved input device
US10254943B2 (en) 2012-11-27 2019-04-09 Neonode Inc. Autonomous drive user interface

Also Published As

Publication number Publication date
CN101685848B (zh) 2012-07-18
KR20110081129A (ko) 2011-07-13
KR20100035099A (ko) 2010-04-02
JP2010077487A (ja) 2010-04-08
TW201023291A (en) 2010-06-16
CN102709491A (zh) 2012-10-03
TW201330162A (zh) 2013-07-16
KR101119748B1 (ko) 2012-03-23
KR101090590B1 (ko) 2011-12-08
CN101685848A (zh) 2010-03-31

Similar Documents

Publication Publication Date Title
JP5173699B2 (ja) 有機ｅｌデバイス製造装置
KR101708420B1 (ko) 기판 증착 시스템 및 이를 이용한 증착 방법
JP4934619B2 (ja) 有機ｅｌ製造装置及び有機ｅｌ製造方法
TWI232242B (en) Substrate processing apparatus and processing method
KR101092163B1 (ko) 유기 ｅｌ 디바이스 제조 장치 및 유기 ｅｌ 디바이스 제조 방법 및 성막 장치 및 성막 방법
JP7190997B2 (ja) 吸着及びアライメント方法、吸着システム、成膜方法、成膜装置及び電子デバイスの製造方法
JP6379318B1 (ja) 成膜装置及び成膜方法並びに太陽電池の製造方法
KR101760667B1 (ko) 고생산성 박막증착이 가능한 원자층 증착 시스템
JP4768001B2 (ja) 有機ｅｌデバイス製造装置及び同製造方法並びに成膜装置及び成膜方法
JP7024044B2 (ja) 成膜装置、これを用いた成膜方法及び電子デバイスの製造方法
JP7148587B2 (ja) 成膜装置、および電子デバイスの製造方法
KR101409808B1 (ko) 기판처리시스템
JP5277015B2 (ja) 有機ｅｌデバイス製造装置及び成膜装置並びにシャドウマスク交換装置
JP5260212B2 (ja) 成膜装置
WO2009130790A1 (ja) トレイ搬送式インライン成膜装置
JP7069280B2 (ja) 成膜装置、成膜方法及び電子デバイスの製造方法
JP2013110114A (ja) 有機ｅｌデバイス製造装置及び角度補正機構
JP5358697B2 (ja) 成膜装置
JP2020070490A (ja) 吸着及びアライメント方法、吸着システム、成膜方法、成膜装置及び電子デバイスの製造方法
KR101225212B1 (ko) Ｏｌｅｄ제조장치 및 방법
KR101175988B1 (ko) 기판처리장치 및 방법
JP4951712B2 (ja) 有機ｅｌデバイス製造装置及び同製造方法並びに成膜装置及び成膜方法
JP2023103008A (ja) 成膜装置、成膜方法及び電子デバイスの製造方法
JP2023038028A (ja) 成膜装置、基板搬送装置、基板搬送方法及び電子デバイスの製造方法
JP5705933B2 (ja) 成膜装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110126

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120618

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120626

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120824

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20121204

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20121227

LAPS Cancellation because of no payment of annual fees