JP5166903B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP5166903B2
JP5166903B2 JP2008029141A JP2008029141A JP5166903B2 JP 5166903 B2 JP5166903 B2 JP 5166903B2 JP 2008029141 A JP2008029141 A JP 2008029141A JP 2008029141 A JP2008029141 A JP 2008029141A JP 5166903 B2 JP5166903 B2 JP 5166903B2
Authority
JP
Japan
Prior art keywords
pads
chip
semiconductor chip
memory
plan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008029141A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009188328A5 (https=
JP2009188328A (ja
Inventor
稔 篠原
道昭 杉山
尊臣 西
正昭 小山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Priority to JP2008029141A priority Critical patent/JP5166903B2/ja
Publication of JP2009188328A publication Critical patent/JP2009188328A/ja
Publication of JP2009188328A5 publication Critical patent/JP2009188328A5/ja
Application granted granted Critical
Publication of JP5166903B2 publication Critical patent/JP5166903B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Semiconductor Memories (AREA)
  • Credit Cards Or The Like (AREA)
JP2008029141A 2008-02-08 2008-02-08 半導体装置 Expired - Fee Related JP5166903B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008029141A JP5166903B2 (ja) 2008-02-08 2008-02-08 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008029141A JP5166903B2 (ja) 2008-02-08 2008-02-08 半導体装置

Publications (3)

Publication Number Publication Date
JP2009188328A JP2009188328A (ja) 2009-08-20
JP2009188328A5 JP2009188328A5 (https=) 2011-03-24
JP5166903B2 true JP5166903B2 (ja) 2013-03-21

Family

ID=41071248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008029141A Expired - Fee Related JP5166903B2 (ja) 2008-02-08 2008-02-08 半導体装置

Country Status (1)

Country Link
JP (1) JP5166903B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101665302B1 (ko) * 2010-05-20 2016-10-24 에베 그룹 에. 탈너 게엠베하 칩 스택 제조 방법, 및 본 방법을 실시하기 위한 캐리어
US9121900B2 (en) * 2011-12-02 2015-09-01 Sandisk Technologies Inc. Systems and methods for sensing signals communicated with a host device or on an interface of plug-in card when there is lack of access to sensing points
JP6122290B2 (ja) 2011-12-22 2017-04-26 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 再配線層を有する半導体パッケージ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217354A (ja) * 2001-01-15 2002-08-02 Shinko Electric Ind Co Ltd 半導体装置
JP4703300B2 (ja) * 2005-07-20 2011-06-15 富士通セミコンダクター株式会社 中継基板及び当該中継基板を備えた半導体装置
JP2007096071A (ja) * 2005-09-29 2007-04-12 Toshiba Corp 半導体メモリカード
JP4726640B2 (ja) * 2006-01-20 2011-07-20 ルネサスエレクトロニクス株式会社 半導体装置
JP4900661B2 (ja) * 2006-02-22 2012-03-21 ルネサスエレクトロニクス株式会社 不揮発性記憶装置

Also Published As

Publication number Publication date
JP2009188328A (ja) 2009-08-20

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