JP5159985B2 - 発光素子実装用基体および発光装置 - Google Patents
発光素子実装用基体および発光装置 Download PDFInfo
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- JP5159985B2 JP5159985B2 JP2012521411A JP2012521411A JP5159985B2 JP 5159985 B2 JP5159985 B2 JP 5159985B2 JP 2012521411 A JP2012521411 A JP 2012521411A JP 2012521411 A JP2012521411 A JP 2012521411A JP 5159985 B2 JP5159985 B2 JP 5159985B2
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- emitting element
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- light emitting
- light
- base body
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
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- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
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- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01—ELECTRIC ELEMENTS
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Description
(第1の実施形態)
図1は、第1の実施形態の発光素子実装用基体を示す断面図である。
(第2の実施形態)
図2は第2の実施形態の発光素子実装用基体の構成を示し、セラミック焼結体からなる基体本体の第1の主面上に、発光素子と電気的に接続されていない反射層が設けられている例の断面図である。
(第3の実施形態)
図3は第3の実施形態の発光素子実装用基体の構成を示し、基体本体の第1の主面上に、実装部を取り囲むように配置されたセラミック焼結体の内周面に、銀を含有する反射層が設けられている例の断面図である。
2:金属部
2a,2b:第1の電極,2c,2d:反射層
4:領域
4a:第1の領域,4b:第2の領域,4c:界面、
5:実装部
6a,6b:第2の電極
11:反射部材
20:基体本体
30:発光装置
31:発光素子
t:厚み
Claims (9)
- 発光素子を実装するための発光素子実装用基体であって、マグネシウムを含有するセラミック焼結体からなる基体本体と、主成分としての銀と、副成分としてのマグネシウムおよびビスマスとを含有する金属部とを有し、前記基体本体の前記金属部に対し接合部を介して対向する部位に、銀,マグネシウムおよびビスマスを含有する領域が存在することを特徴とする発光素子実装用基体。
- 前記金属部が、前記発光素子と電気的に接続される第1の電極および前記第1の電極と電気的に接続されていない反射層の少なくとも一方を含むことを特徴とする請求項1に記載の発光素子実装用基体。
- 前記基体本体が、表面に発光素子を実装するための実装部が設けられる実装用部材と、前記実装部を取り囲むように配置された反射部材とを有し、該反射部材は、内周面に銀を含有する前記金属部が前記接合部を介して接合されており、前記金属部に対し前記接合部を介して対向する部位に、銀を含有する領域を有することを特徴とする請求項1または請求項2に記載の発光素子実装用基体。
- 前記領域は、前記金属部側の第1の領域と、該第1の領域に隣接する第2の領域とを有し、前記第1の領域は前記第2の領域よりマグネシウムを多く含むとともに、前記第2の領域は前記第1の領域よりビスマスを多く含むことを特徴とする請求項1乃至請求項3のいずれかに記載の発光素子実装用基体。
- 前記金属部は、マグネシウムおよびビスマスの合計の含有量が0.5質量%以上、3.0質量%以下であることを特徴とする請求項1乃至請求項4のいずれかに記載の発光素子実装用基体。
- 前記基体本体は、主成分として酸化アルミニウム(Al2O3)を94質量%以上、97質量%以下の量で含有するとともに、副成分として酸化珪素(SiO2)および酸化マグネシウム(MgO)を含有することを特徴とする請求項1乃至請求項5のいずれかに記載の発光素子実装用基体。
- 前記基体本体の発光素子が実装される表面側における酸化アルミニウム粒子の平均結晶粒径が2.0μm以下であることを特徴とする請求項6に記載の発光素子実装用基体。
- 前記基体本体が、前記実装部側の表面側において、前記酸化アルミニウムの結晶粒子間に形成される粒界相を有しており、該粒界相の平均幅が2nm以下であることを特徴とする請求項6または請求項7に記載の発光素子実装用基体。
- 請求項1乃至8のいずれかに記載の発光素子実装用基体に発光素子が実装されてなることを特徴とする発光装置。
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US9036359B2 (en) * | 2010-10-15 | 2015-05-19 | Leonovo Innovations Limited (Hong Kong) | Component built-in module, electronic device including same, and method for manufacturing component built-in module |
EP2645435B1 (en) * | 2010-11-25 | 2017-08-09 | Kyocera Corporation | Substrate for mounting light-emitting element, and light-emitting device |
JP2013239540A (ja) * | 2012-05-14 | 2013-11-28 | Shin Etsu Chem Co Ltd | 光半導体装置用基板とその製造方法、及び光半導体装置とその製造方法 |
CN104205372B (zh) * | 2012-05-31 | 2018-03-02 | 松下知识产权经营株式会社 | Led模块、照明装置和灯 |
US9680075B2 (en) * | 2012-08-31 | 2017-06-13 | Panasonic Intellectual Property Management Co., Ltd. | Light-emitting device |
US9799812B2 (en) | 2014-05-09 | 2017-10-24 | Kyocera Corporation | Light emitting element mounting substrate and light emitting device |
DE102015112967A1 (de) * | 2015-08-06 | 2017-02-09 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement |
JP6509066B2 (ja) * | 2015-08-07 | 2019-05-08 | 共立エレックス株式会社 | セラミックス反射板製造方法 |
EP3913591A1 (en) | 2016-01-29 | 2021-11-24 | KiwiSecurity Software GmbH | Methods and apparatus for using video analytics to detect regions for privacy protection within images from moving cameras |
EP3869638B1 (en) | 2017-03-03 | 2024-06-19 | Nichia Corporation | Optical component |
KR20210157935A (ko) * | 2020-06-22 | 2021-12-30 | 삼성디스플레이 주식회사 | 광학 검사 장치 |
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WO2012070648A1 (ja) | 2012-05-31 |
JPWO2012070648A1 (ja) | 2014-05-19 |
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