JP5137488B2 - レーザ照射装置およびそれを用いたレーザ加工システム - Google Patents

レーザ照射装置およびそれを用いたレーザ加工システム Download PDF

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Publication number
JP5137488B2
JP5137488B2 JP2007193549A JP2007193549A JP5137488B2 JP 5137488 B2 JP5137488 B2 JP 5137488B2 JP 2007193549 A JP2007193549 A JP 2007193549A JP 2007193549 A JP2007193549 A JP 2007193549A JP 5137488 B2 JP5137488 B2 JP 5137488B2
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JP
Japan
Prior art keywords
laser
unit
deflection surface
light
irradiation apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007193549A
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English (en)
Japanese (ja)
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JP2009028742A (ja
JP2009028742A5 (https=
Inventor
潤子 高橋
浩一 ▲高▼橋
達哉 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Priority to JP2007193549A priority Critical patent/JP5137488B2/ja
Priority to TW097127768A priority patent/TW200912375A/zh
Priority to KR1020080071608A priority patent/KR20090012106A/ko
Priority to CN2008101340880A priority patent/CN101354481B/zh
Publication of JP2009028742A publication Critical patent/JP2009028742A/ja
Publication of JP2009028742A5 publication Critical patent/JP2009028742A5/ja
Application granted granted Critical
Publication of JP5137488B2 publication Critical patent/JP5137488B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
JP2007193549A 2007-07-25 2007-07-25 レーザ照射装置およびそれを用いたレーザ加工システム Expired - Fee Related JP5137488B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007193549A JP5137488B2 (ja) 2007-07-25 2007-07-25 レーザ照射装置およびそれを用いたレーザ加工システム
TW097127768A TW200912375A (en) 2007-07-25 2008-07-22 Laser irradiation apparatus and laser processing system using same apparatus
KR1020080071608A KR20090012106A (ko) 2007-07-25 2008-07-23 레이저 조사 장치 및 이것을 사용한 레이저 가공 시스템
CN2008101340880A CN101354481B (zh) 2007-07-25 2008-07-24 激光照射装置及使用其的激光加工系统

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007193549A JP5137488B2 (ja) 2007-07-25 2007-07-25 レーザ照射装置およびそれを用いたレーザ加工システム

Publications (3)

Publication Number Publication Date
JP2009028742A JP2009028742A (ja) 2009-02-12
JP2009028742A5 JP2009028742A5 (https=) 2010-09-02
JP5137488B2 true JP5137488B2 (ja) 2013-02-06

Family

ID=40307363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007193549A Expired - Fee Related JP5137488B2 (ja) 2007-07-25 2007-07-25 レーザ照射装置およびそれを用いたレーザ加工システム

Country Status (4)

Country Link
JP (1) JP5137488B2 (https=)
KR (1) KR20090012106A (https=)
CN (1) CN101354481B (https=)
TW (1) TW200912375A (https=)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5346690B2 (ja) * 2009-05-26 2013-11-20 オリンパス株式会社 レーザ照射装置
TWI594828B (zh) * 2009-05-28 2017-08-11 伊雷克托科學工業股份有限公司 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
JP5393406B2 (ja) * 2009-11-06 2014-01-22 オリンパス株式会社 パターン投影装置、走査型共焦点顕微鏡、及びパターン照射方法
DE102010020183B4 (de) * 2010-05-11 2013-07-11 Precitec Kg Laserschneidkopf und Verfahren zum Schneiden eines Werkstücks mittels eines Laserschneidkopfes
KR101114738B1 (ko) * 2010-09-27 2012-02-29 주식회사 피케이엘 가변형 어퍼쳐 및 이를 포함하는 스퍼터 장치
JP5644481B2 (ja) * 2010-12-24 2014-12-24 コニカミノルタ株式会社 画像投影装置
JP5678693B2 (ja) * 2011-01-31 2015-03-04 コニカミノルタ株式会社 画像投影装置
TWI669833B (zh) * 2016-04-19 2019-08-21 台達電子工業股份有限公司 螢光劑裝置
US10688527B2 (en) 2011-09-22 2020-06-23 Delta Electronics, Inc. Phosphor device comprising plural phosphor agents for converting waveband light into plural color lights with different wavelength peaks
EP2769799B1 (en) 2011-10-17 2019-04-03 Kabushiki Kaisha Toshiba Laser irradiation device and method for diagnosing integrity of laser irradiation head
KR101299234B1 (ko) * 2011-11-01 2013-08-22 주식회사 이오테크닉스 2빔 가공이 가능한 레이저 가공 장치 및 방법
CN102489876B (zh) * 2011-11-11 2014-06-25 北京中科思远光电科技有限公司 一种采用激光辅助加热的激光退火方法及装置
JP5720586B2 (ja) * 2012-01-19 2015-05-20 コニカミノルタ株式会社 画像投映装置
JP6321932B2 (ja) * 2013-09-24 2018-05-09 株式会社小糸製作所 車両用前照灯
JP6868766B2 (ja) * 2017-03-15 2021-05-12 パナソニックＩｐマネジメント株式会社 レーザ加工システム
WO2019244339A1 (ja) * 2018-06-22 2019-12-26 オリンパス株式会社 照明装置および内視鏡システム
CN111940892B (zh) * 2019-05-14 2023-06-02 雷科股份有限公司 用于切割低介电值材料晶圆的快速切换光路架构
CN113634877A (zh) * 2020-04-27 2021-11-12 大族激光科技产业集团股份有限公司 一种激光加工装置及方法
CN111751806A (zh) * 2020-07-29 2020-10-09 深圳元戎启行科技有限公司 准直装置、激光雷达发射系统和激光雷达收发系统
US12403548B2 (en) * 2020-08-19 2025-09-02 Panasonic Intellectual Property Management Co., Ltd. Laser processing apparatus and laser processing method
JP7730643B2 (ja) * 2020-08-21 2025-08-28 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
JP7609624B2 (ja) * 2020-12-16 2025-01-07 株式会社ダイヘン レーザヘッド
JP7604298B2 (ja) * 2021-03-24 2024-12-23 株式会社ディスコ レーザー加工装置
KR102674642B1 (ko) * 2023-08-31 2024-06-12 주식회사 에이비파트너스 용접 품질 검사장치
CN121491539A (zh) * 2026-01-14 2026-02-10 深圳欧斯普瑞智能科技有限公司 一种带熔池监测的智能激光头

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6171194A (ja) * 1984-09-14 1986-04-12 Mitsubishi Electric Corp レ−ザ加工装置
JPH0483488A (ja) * 1990-07-26 1992-03-17 Toshiba Corp 映像信号伝送システムと映像信号送信装置及び映像信号受信装置
JPH0483488U (https=) * 1990-11-28 1992-07-21
JPH1158052A (ja) * 1997-08-26 1999-03-02 Nippon Steel Corp レーザ加工装置
JP5048899B2 (ja) * 2001-09-28 2012-10-17 オリンパス株式会社 顕微鏡
JP2005203697A (ja) * 2004-01-19 2005-07-28 Fuji Photo Film Co Ltd マルチビーム露光装置
JP4184288B2 (ja) * 2004-01-20 2008-11-19 日立ビアメカニクス株式会社 レーザ加工機
WO2006100780A1 (ja) * 2005-03-24 2006-09-28 Olympus Corporation リペア方法及びその装置
JP5036144B2 (ja) * 2005-06-28 2012-09-26 オリンパス株式会社 レーザ加工装置
JP4429974B2 (ja) * 2005-06-17 2010-03-10 オリンパス株式会社 レーザ加工方法および装置

Also Published As

Publication number Publication date
KR20090012106A (ko) 2009-02-02
CN101354481B (zh) 2012-11-28
TW200912375A (en) 2009-03-16
CN101354481A (zh) 2009-01-28
JP2009028742A (ja) 2009-02-12

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