JP5135192B2 - 光受信モジュール及び光受信モジュールの製造方法 - Google Patents
光受信モジュール及び光受信モジュールの製造方法 Download PDFInfo
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- JP5135192B2 JP5135192B2 JP2008315422A JP2008315422A JP5135192B2 JP 5135192 B2 JP5135192 B2 JP 5135192B2 JP 2008315422 A JP2008315422 A JP 2008315422A JP 2008315422 A JP2008315422 A JP 2008315422A JP 5135192 B2 JP5135192 B2 JP 5135192B2
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- JP
- Japan
- Prior art keywords
- light receiving
- receiving element
- light
- optical
- optical fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000003287 optical effect Effects 0.000 title claims description 96
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000013307 optical fiber Substances 0.000 claims description 59
- 238000000034 method Methods 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- NCGICGYLBXGBGN-UHFFFAOYSA-N 3-morpholin-4-yl-1-oxa-3-azonia-2-azanidacyclopent-3-en-5-imine;hydrochloride Chemical compound Cl.[N-]1OC(=N)C=[N+]1N1CCOCC1 NCGICGYLBXGBGN-UHFFFAOYSA-N 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
- G02B6/4203—Optical features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Light Receiving Elements (AREA)
- Optical Couplings Of Light Guides (AREA)
- Die Bonding (AREA)
Description
Claims (4)
- 接続される光ファイバを通って入射する光を受け付ける光受信モジュールであって、
受光素子と、前記受光素子を支持する支持部材と、を備え、
前記受光素子が、前記光ファイバの光軸上の位置からずらして、前記支持部材の支持面に配置されており、
前記入射する光を受光する前記受光素子の受光面が、前記入射する光に対して直交方向とならないように配置されており、
前記光ファイバの光軸と前記支持部材の前記支持面との交点が含まれる、前記支持部材の前記支持面に垂直な平面であって、前記入射する光と前記受光素子の前記受光面が交差する光線交点から当該平面に下ろした垂線が前記光ファイバの光軸と交差する平面であるずれ垂直平面が、前記受光素子の前記支持面側の面に含まれる複数の辺のうち、前記交点に最も近い辺と平行とならないように前記受光素子が配置されている、
ことを特徴とする光受信モジュール。 - 請求項1に記載の光受信モジュールであって、
前記受光素子の前記支持面の面に含まれるすべての辺の方向が、前記ずれ垂直平面と平行とならないように前記受光素子が配置されている、
ことを特徴とする光受信モジュール。 - 請求項1又は2に記載の光受信モジュールであって、
前記受光素子の前記受光面が、前記支持部材の前記支持面に対して、前記光ファイバの光軸に向かう方向に傾斜している、
ことを特徴とする光受信モジュール。 - 受光素子と、前記受光素子を支持する支持部材と、を備える、接続される光ファイバを通って入射する光を受け付ける光受信モジュールの製造方法であって、
前記光ファイバの光軸上の位置からずらして、前記支持部材の支持面に、前記入射する光を受光する前記受光素子の受光面が、前記入射する光に対して直交方向とならず、かつ、前記光ファイバの光軸と前記支持部材の前記支持面との交点が含まれる、前記支持部材の前記支持面に垂直な平面であって、前記入射する光と前記受光素子の前記受光面が交差する光線交点から当該平面に下ろした垂線が前記光ファイバの光軸と交差する平面であるずれ垂直平面が、前記受光素子の前記支持面側の面に含まれる複数の辺のうち、前記交点に最も近い辺と平行とならないように前記受光素子を配置する工程、
を含むことを特徴とする光受信モジュールの製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008315422A JP5135192B2 (ja) | 2008-12-11 | 2008-12-11 | 光受信モジュール及び光受信モジュールの製造方法 |
US12/622,965 US8378289B2 (en) | 2008-12-11 | 2009-11-20 | Optical receiver module and manufacturing method with a shifted and angled light receiving element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008315422A JP5135192B2 (ja) | 2008-12-11 | 2008-12-11 | 光受信モジュール及び光受信モジュールの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010141089A JP2010141089A (ja) | 2010-06-24 |
JP5135192B2 true JP5135192B2 (ja) | 2013-01-30 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008315422A Active JP5135192B2 (ja) | 2008-12-11 | 2008-12-11 | 光受信モジュール及び光受信モジュールの製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8378289B2 (ja) |
JP (1) | JP5135192B2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5654312B2 (ja) * | 2010-10-13 | 2015-01-14 | 日本オクラロ株式会社 | 受光モジュール |
JP5818673B2 (ja) | 2011-12-21 | 2015-11-18 | 日本オクラロ株式会社 | 光モジュール |
JP2014175605A (ja) * | 2013-03-12 | 2014-09-22 | Seiko Instruments Inc | 受光センサ及び受光センサの製造方法 |
US9754617B2 (en) | 2015-02-23 | 2017-09-05 | Seagate Technology Llc | Laser diode unit with enhanced thermal conduction to slider |
JPWO2017115412A1 (ja) * | 2015-12-28 | 2018-10-25 | オリンパス株式会社 | 光伝送モジュールおよび内視鏡 |
JP6586656B2 (ja) * | 2016-08-05 | 2019-10-09 | サンテック株式会社 | 検出装置 |
CN109725391B (zh) * | 2017-10-27 | 2022-03-01 | 住友电工光电子器件创新株式会社 | 接收器光学组件及其组装方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2765321B2 (ja) | 1991-11-29 | 1998-06-11 | 日本電気株式会社 | 半導体受光素子 |
JPH0894887A (ja) | 1994-09-22 | 1996-04-12 | Japan Aviation Electron Ind Ltd | 光結合部品およびその製造方法 |
JPH08186321A (ja) | 1994-12-28 | 1996-07-16 | Canon Inc | 半導体レーザ装置 |
JPH10307236A (ja) * | 1997-05-09 | 1998-11-17 | Mitsubishi Electric Corp | 光半導体モジュール |
JP2001021775A (ja) * | 1999-07-09 | 2001-01-26 | Sumitomo Electric Ind Ltd | 光学装置 |
JP2003209268A (ja) | 2002-01-11 | 2003-07-25 | Mitsubishi Electric Corp | 光モジュール |
US6850674B2 (en) * | 2002-05-09 | 2005-02-01 | Sumitomo Electric Industries, Ltd. | Optical device |
JP2005072130A (ja) | 2003-08-21 | 2005-03-17 | Mitsubishi Electric Corp | 半導体レーザ装置 |
JP2006154534A (ja) * | 2004-11-30 | 2006-06-15 | Oki Electric Ind Co Ltd | 光モジュールの製造方法,および,光モジュール |
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2008
- 2008-12-11 JP JP2008315422A patent/JP5135192B2/ja active Active
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2009
- 2009-11-20 US US12/622,965 patent/US8378289B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20100148041A1 (en) | 2010-06-17 |
US8378289B2 (en) | 2013-02-19 |
JP2010141089A (ja) | 2010-06-24 |
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