JP5134194B2 - 部品内蔵デバイス及び製造方法 - Google Patents

部品内蔵デバイス及び製造方法 Download PDF

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Publication number
JP5134194B2
JP5134194B2 JP2005208501A JP2005208501A JP5134194B2 JP 5134194 B2 JP5134194 B2 JP 5134194B2 JP 2005208501 A JP2005208501 A JP 2005208501A JP 2005208501 A JP2005208501 A JP 2005208501A JP 5134194 B2 JP5134194 B2 JP 5134194B2
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Japan
Prior art keywords
hole
component
chip
substrate
built
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005208501A
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English (en)
Japanese (ja)
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JP2007027472A (ja
JP2007027472A5 (enrdf_load_stackoverflow
Inventor
唯知 須賀
勝秀 塚本
明人 吉井
昌広 北村
博 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Namics Corp
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Namics Corp filed Critical Namics Corp
Priority to JP2005208501A priority Critical patent/JP5134194B2/ja
Publication of JP2007027472A publication Critical patent/JP2007027472A/ja
Publication of JP2007027472A5 publication Critical patent/JP2007027472A5/ja
Application granted granted Critical
Publication of JP5134194B2 publication Critical patent/JP5134194B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/25—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of a plurality of high density interconnect connectors
    • H01L2224/251—Disposition
    • H01L2224/2518—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2005208501A 2005-07-19 2005-07-19 部品内蔵デバイス及び製造方法 Expired - Fee Related JP5134194B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005208501A JP5134194B2 (ja) 2005-07-19 2005-07-19 部品内蔵デバイス及び製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005208501A JP5134194B2 (ja) 2005-07-19 2005-07-19 部品内蔵デバイス及び製造方法

Publications (3)

Publication Number Publication Date
JP2007027472A JP2007027472A (ja) 2007-02-01
JP2007027472A5 JP2007027472A5 (enrdf_load_stackoverflow) 2008-09-04
JP5134194B2 true JP5134194B2 (ja) 2013-01-30

Family

ID=37787835

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005208501A Expired - Fee Related JP5134194B2 (ja) 2005-07-19 2005-07-19 部品内蔵デバイス及び製造方法

Country Status (1)

Country Link
JP (1) JP5134194B2 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010101163A1 (ja) * 2009-03-04 2010-09-10 日本電気株式会社 機能素子内蔵基板及びそれを用いた電子デバイス
JP5581830B2 (ja) * 2010-06-11 2014-09-03 富士通株式会社 部品内蔵基板の製造方法及び部品内蔵基板
JP2013038230A (ja) * 2011-08-08 2013-02-21 Fujikura Ltd 部品内蔵基板およびその製造方法
CN117652015A (zh) * 2021-05-30 2024-03-05 邦德泰克株式会社 半导体基板接合体及其制造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4547728B2 (ja) * 1999-03-29 2010-09-22 ソニー株式会社 半導体装置及びその製造方法
JP3813402B2 (ja) * 2000-01-31 2006-08-23 新光電気工業株式会社 半導体装置の製造方法
JP4401070B2 (ja) * 2002-02-05 2010-01-20 ソニー株式会社 半導体装置内蔵多層配線基板及びその製造方法
US6790775B2 (en) * 2002-10-31 2004-09-14 Hewlett-Packard Development Company, L.P. Method of forming a through-substrate interconnect
JP2004172412A (ja) * 2002-11-20 2004-06-17 Kyocera Corp コンデンサ素子およびコンデンサ素子内蔵多層配線基板
JP3956851B2 (ja) * 2003-01-21 2007-08-08 凸版印刷株式会社 受動素子内蔵基板及びその製造方法
JP3740469B2 (ja) * 2003-01-31 2006-02-01 株式会社東芝 半導体装置および半導体装置の製造方法
JP4634045B2 (ja) * 2003-07-31 2011-02-16 富士通株式会社 半導体装置の製造方法、貫通電極の形成方法、半導体装置、複合半導体装置、及び実装構造体

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Publication number Publication date
JP2007027472A (ja) 2007-02-01

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