JP5133963B2 - セラミック基板 - Google Patents

セラミック基板 Download PDF

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Publication number
JP5133963B2
JP5133963B2 JP2009252854A JP2009252854A JP5133963B2 JP 5133963 B2 JP5133963 B2 JP 5133963B2 JP 2009252854 A JP2009252854 A JP 2009252854A JP 2009252854 A JP2009252854 A JP 2009252854A JP 5133963 B2 JP5133963 B2 JP 5133963B2
Authority
JP
Japan
Prior art keywords
layer
silver
nickel
metal
plating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009252854A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010028146A5 (enrdf_load_stackoverflow
JP2010028146A (ja
Inventor
久 若子
誠 永井
敦士 内田
雅仁 森田
賀津雄 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP2009252854A priority Critical patent/JP5133963B2/ja
Publication of JP2010028146A publication Critical patent/JP2010028146A/ja
Publication of JP2010028146A5 publication Critical patent/JP2010028146A5/ja
Application granted granted Critical
Publication of JP5133963B2 publication Critical patent/JP5133963B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector

Landscapes

  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
JP2009252854A 2004-12-03 2009-11-04 セラミック基板 Expired - Fee Related JP5133963B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009252854A JP5133963B2 (ja) 2004-12-03 2009-11-04 セラミック基板

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2004350927 2004-12-03
JP2004350927 2004-12-03
JP2005084449 2005-03-23
JP2005084449 2005-03-23
JP2009252854A JP5133963B2 (ja) 2004-12-03 2009-11-04 セラミック基板

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2005343890A Division JP2006303419A (ja) 2004-12-03 2005-11-29 セラミック基板

Publications (3)

Publication Number Publication Date
JP2010028146A JP2010028146A (ja) 2010-02-04
JP2010028146A5 JP2010028146A5 (enrdf_load_stackoverflow) 2011-03-31
JP5133963B2 true JP5133963B2 (ja) 2013-01-30

Family

ID=41733609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009252854A Expired - Fee Related JP5133963B2 (ja) 2004-12-03 2009-11-04 セラミック基板

Country Status (1)

Country Link
JP (1) JP5133963B2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170011735A (ko) * 2015-07-24 2017-02-02 엘지이노텍 주식회사 발광소자 패키지

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5958342B2 (ja) * 2010-10-27 2016-07-27 旭硝子株式会社 発光素子用基板および発光装置
DE102015208704A1 (de) * 2015-05-11 2016-11-17 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil
CN112159253A (zh) * 2020-09-26 2021-01-01 深圳市海里表面技术处理有限公司 5g通讯用电阻陶瓷镀银工艺及陶瓷片

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04152661A (ja) * 1990-10-17 1992-05-26 Hitachi Cable Ltd Ｉｃ用リードフレーム
JPH06334087A (ja) * 1993-05-21 1994-12-02 Hitachi Cable Ltd 半導体装置用リードフレームの製造方法
JP2003347600A (ja) * 2002-05-28 2003-12-05 Matsushita Electric Works Ltd Ｌｅｄ実装基板
JP2004228549A (ja) * 2002-11-25 2004-08-12 Kyocera Corp 発光素子収納用パッケージおよび発光装置
JP3940124B2 (ja) * 2003-01-16 2007-07-04 松下電器産業株式会社 装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170011735A (ko) * 2015-07-24 2017-02-02 엘지이노텍 주식회사 발광소자 패키지
KR102413301B1 (ko) * 2015-07-24 2022-06-27 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 패키지

Also Published As

Publication number Publication date
JP2010028146A (ja) 2010-02-04

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