JP2010028146A5 - - Google Patents
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- Publication number
- JP2010028146A5 JP2010028146A5 JP2009252854A JP2009252854A JP2010028146A5 JP 2010028146 A5 JP2010028146 A5 JP 2010028146A5 JP 2009252854 A JP2009252854 A JP 2009252854A JP 2009252854 A JP2009252854 A JP 2009252854A JP 2010028146 A5 JP2010028146 A5 JP 2010028146A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- silver
- nickel
- ceramic substrate
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 22
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 11
- 229910052759 nickel Inorganic materials 0.000 claims 11
- 229910052709 silver Inorganic materials 0.000 claims 11
- 239000004332 silver Substances 0.000 claims 11
- 239000000758 substrate Substances 0.000 claims 11
- 239000000919 ceramic Substances 0.000 claims 10
- 229910052751 metal Inorganic materials 0.000 claims 10
- 239000002184 metal Substances 0.000 claims 10
- 238000000034 method Methods 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009252854A JP5133963B2 (ja) | 2004-12-03 | 2009-11-04 | セラミック基板 |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004350927 | 2004-12-03 | ||
JP2004350927 | 2004-12-03 | ||
JP2005084449 | 2005-03-23 | ||
JP2005084449 | 2005-03-23 | ||
JP2009252854A JP5133963B2 (ja) | 2004-12-03 | 2009-11-04 | セラミック基板 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005343890A Division JP2006303419A (ja) | 2004-12-03 | 2005-11-29 | セラミック基板 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010028146A JP2010028146A (ja) | 2010-02-04 |
JP2010028146A5 true JP2010028146A5 (enrdf_load_stackoverflow) | 2011-03-31 |
JP5133963B2 JP5133963B2 (ja) | 2013-01-30 |
Family
ID=41733609
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009252854A Expired - Fee Related JP5133963B2 (ja) | 2004-12-03 | 2009-11-04 | セラミック基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5133963B2 (enrdf_load_stackoverflow) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5958342B2 (ja) * | 2010-10-27 | 2016-07-27 | 旭硝子株式会社 | 発光素子用基板および発光装置 |
DE102015208704A1 (de) * | 2015-05-11 | 2016-11-17 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil |
KR102413301B1 (ko) * | 2015-07-24 | 2022-06-27 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광소자 패키지 |
CN112159253A (zh) * | 2020-09-26 | 2021-01-01 | 深圳市海里表面技术处理有限公司 | 5g通讯用电阻陶瓷镀银工艺及陶瓷片 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04152661A (ja) * | 1990-10-17 | 1992-05-26 | Hitachi Cable Ltd | Ic用リードフレーム |
JPH06334087A (ja) * | 1993-05-21 | 1994-12-02 | Hitachi Cable Ltd | 半導体装置用リードフレームの製造方法 |
JP2003347600A (ja) * | 2002-05-28 | 2003-12-05 | Matsushita Electric Works Ltd | Led実装基板 |
JP2004228549A (ja) * | 2002-11-25 | 2004-08-12 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP3940124B2 (ja) * | 2003-01-16 | 2007-07-04 | 松下電器産業株式会社 | 装置 |
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2009
- 2009-11-04 JP JP2009252854A patent/JP5133963B2/ja not_active Expired - Fee Related