JP5120407B2 - はんだ付け装置及び蓋体支持密閉構造 - Google Patents

はんだ付け装置及び蓋体支持密閉構造 Download PDF

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Publication number
JP5120407B2
JP5120407B2 JP2010090972A JP2010090972A JP5120407B2 JP 5120407 B2 JP5120407 B2 JP 5120407B2 JP 2010090972 A JP2010090972 A JP 2010090972A JP 2010090972 A JP2010090972 A JP 2010090972A JP 5120407 B2 JP5120407 B2 JP 5120407B2
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Japan
Prior art keywords
lid
unit
groove portion
lid member
portions
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Active
Application number
JP2010090972A
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English (en)
Japanese (ja)
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JP2011218417A (ja
JP2011218417A5 (zh
Inventor
崇 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
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Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Priority to JP2010090972A priority Critical patent/JP5120407B2/ja
Priority to PCT/JP2011/057874 priority patent/WO2011125669A1/ja
Priority to CN201180018272.9A priority patent/CN102835195B/zh
Publication of JP2011218417A publication Critical patent/JP2011218417A/ja
Publication of JP2011218417A5 publication Critical patent/JP2011218417A5/ja
Application granted granted Critical
Publication of JP5120407B2 publication Critical patent/JP5120407B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2010090972A 2010-04-09 2010-04-09 はんだ付け装置及び蓋体支持密閉構造 Active JP5120407B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010090972A JP5120407B2 (ja) 2010-04-09 2010-04-09 はんだ付け装置及び蓋体支持密閉構造
PCT/JP2011/057874 WO2011125669A1 (ja) 2010-04-09 2011-03-29 はんだ付け装置及び蓋体支持密閉構造
CN201180018272.9A CN102835195B (zh) 2010-04-09 2011-03-29 锡焊装置和盖体支承密闭结构

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010090972A JP5120407B2 (ja) 2010-04-09 2010-04-09 はんだ付け装置及び蓋体支持密閉構造

Publications (3)

Publication Number Publication Date
JP2011218417A JP2011218417A (ja) 2011-11-04
JP2011218417A5 JP2011218417A5 (zh) 2012-09-13
JP5120407B2 true JP5120407B2 (ja) 2013-01-16

Family

ID=44762616

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010090972A Active JP5120407B2 (ja) 2010-04-09 2010-04-09 はんだ付け装置及び蓋体支持密閉構造

Country Status (3)

Country Link
JP (1) JP5120407B2 (zh)
CN (1) CN102835195B (zh)
WO (1) WO2011125669A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9161459B2 (en) * 2014-02-25 2015-10-13 Illinois Tool Works Inc. Pre-heater latch and seal mechanism for wave solder machine and related method
KR102582335B1 (ko) * 2023-06-26 2023-09-25 주식회사 엠에프테크 냉각 용접 시스템

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2505358Y2 (ja) * 1989-06-21 1996-07-31 ローム株式会社 電子部品における厚膜形成用マッフル式焼成炉
JPH0380162A (ja) * 1989-08-21 1991-04-04 Ngk Insulators Ltd セラミック部品と金属部品の接合方法
JPH06170523A (ja) * 1992-11-30 1994-06-21 Matsushita Electric Ind Co Ltd リフロー装置
JP3083035B2 (ja) * 1993-12-28 2000-09-04 日本電熱計器株式会社 はんだ付け装置
JP2003040314A (ja) * 2001-08-03 2003-02-13 Nichimo Co Ltd トロ箱
CN201115103Y (zh) * 2007-07-10 2008-09-10 天津津亚电子有限公司 密闭型电动车控制器外壳结构
CN101478193B (zh) * 2009-01-15 2011-04-06 章祖文 自带蒸汽机制冷机的电源冷却构架

Also Published As

Publication number Publication date
WO2011125669A1 (ja) 2011-10-13
JP2011218417A (ja) 2011-11-04
CN102835195A (zh) 2012-12-19
CN102835195B (zh) 2014-01-22

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