JP5114546B2 - 温度ヒューズ - Google Patents
温度ヒューズ Download PDFInfo
- Publication number
- JP5114546B2 JP5114546B2 JP2010500159A JP2010500159A JP5114546B2 JP 5114546 B2 JP5114546 B2 JP 5114546B2 JP 2010500159 A JP2010500159 A JP 2010500159A JP 2010500159 A JP2010500159 A JP 2010500159A JP 5114546 B2 JP5114546 B2 JP 5114546B2
- Authority
- JP
- Japan
- Prior art keywords
- melting
- melting member
- thermal fuse
- connection
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
- H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
- H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
- H01H2037/762—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit using a spring for opening the circuit when the fusible element melts
- H01H2037/763—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit using a spring for opening the circuit when the fusible element melts the spring being a blade spring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10181—Fuse
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49107—Fuse making
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Fuses (AREA)
Description
Claims (7)
- 線路構造に設けられる温度ヒューズにおいて、
それぞれ接続箇所(9)を備える複数の線路領域(2)と、
前記線路構造の接続箇所(9)に電気的かつ機械的に接続されている溶融部材(3)とを備え、該溶融部材(3)の材料が、所定の溶融温度を有しており、周囲温度が前記溶融温度を超えると溶融して、前記接続箇所(9)において表面張力に基づいて集合し、かつ前記溶融部材(3)により形成される電気的な接続を切断し、
前記接続箇所(9)が互いに、前記溶融部材(3)の溶融した材料が接続箇所(9)において互いに電気的に切断されている間隔を有し、
前記溶融部材(3)が前記接続箇所(9)にはんだ付け、溶接、締付け又は接着されており、
前記溶融部材(3)がフラックス(8)によりコーティングされている、又はフラックスコアが前記溶融部材の材料内に設けられている、又は中間層が前記溶融部材の材料の2つの層間に設けられており、
前記接続箇所(9)が前記線路構造の対応するコンタクトウェブ(2)に配置されており、該コンタクトウェブ(2)がばね部材を有する、かつ/又は該コンタクトウェブ(2)の少なくとも1つが、前記接続箇所(9)により規定される方向に関して湾曲又は屈曲を有し、
電流案内に寄与しない単数又は複数の、前記コンタクトウェブ(2)に接続されるブラインド線路区分(6)が設けられていることを特徴とする、線路構造に設けられる温度ヒューズ。 - 前記ブラインド線路区分(6)が、前記接続箇所(9)により規定される方向に対して交差する方向に配置されている、請求項1記載の温度ヒューズ。
- 前記線路構造が、前記接続箇所(9)により規定される接続方向に関して横方向で延在し、ブラインド線路区分(6)又は線路区分に接続されている単数又は複数の横方向区分(10)を有する、請求項1又は2記載の温度ヒューズ。
- 前記ブラインド線路区分及び前記横方向区分(10)が、前記溶融部材(3)及び前記コンタクトウェブ(2)を包囲している、請求項3記載の温度ヒューズ。
- 前記溶融部材(3)が直方体状に形成されているか、又はU字形又はS字形の区分を有する、請求項1から4までのいずれか1項記載の温度ヒューズ。
- 前記溶融部材(3)が、変形可能な材料から形成されており、該溶融部材を変形させる変形力が、該溶融部材の劣化及び/又は前記接続箇所(9)と前記溶融部材(3)との間の接続の劣化に至らしめる最小力より小さい、請求項1から5までのいずれか1項記載の温度ヒューズ。
- 前記線路構造が打ち抜き格子体内の線路構造である、請求項1から6までのいずれか1項記載の温度ヒューズ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007014338.0 | 2007-03-26 | ||
DE102007014338A DE102007014338A1 (de) | 2007-03-26 | 2007-03-26 | Thermosicherung |
PCT/EP2008/051286 WO2008116685A1 (de) | 2007-03-26 | 2008-02-01 | Thermosicherung |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010522421A JP2010522421A (ja) | 2010-07-01 |
JP5114546B2 true JP5114546B2 (ja) | 2013-01-09 |
Family
ID=39315141
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010500159A Expired - Fee Related JP5114546B2 (ja) | 2007-03-26 | 2008-02-01 | 温度ヒューズ |
Country Status (6)
Country | Link |
---|---|
US (1) | US8633795B2 (ja) |
EP (1) | EP2130210B1 (ja) |
JP (1) | JP5114546B2 (ja) |
CN (1) | CN101647081B (ja) |
DE (1) | DE102007014338A1 (ja) |
WO (1) | WO2008116685A1 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5072796B2 (ja) * | 2008-05-23 | 2012-11-14 | ソニーケミカル&インフォメーションデバイス株式会社 | 保護素子及び二次電池装置 |
JP5130233B2 (ja) * | 2009-01-21 | 2013-01-30 | デクセリアルズ株式会社 | 保護素子 |
JP5301298B2 (ja) * | 2009-01-21 | 2013-09-25 | デクセリアルズ株式会社 | 保護素子 |
JP5130232B2 (ja) | 2009-01-21 | 2013-01-30 | デクセリアルズ株式会社 | 保護素子 |
US9129769B2 (en) * | 2009-09-04 | 2015-09-08 | Cyntec Co., Ltd. | Protective device |
DE102010038401B4 (de) | 2010-07-26 | 2013-11-14 | Vishay Bccomponents Beyschlag Gmbh | Thermosicherung sowie Verwendung einer solchen |
DE202011001820U1 (de) * | 2011-01-21 | 2012-04-27 | Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg | Schutzvorrichtung für die Steuerelektronik einer Kraftfahrzeugkomponente |
KR101495023B1 (ko) * | 2011-01-21 | 2015-02-24 | 브로제 파르초이크타일레 게엠베하 운트 코. 카게, 뷔르츠부르크 | 특히 모터 차량 부품의 제어 전자기기를 위한 보호 장치 |
US8971006B2 (en) | 2011-02-04 | 2015-03-03 | Denso Corporation | Electronic control device including interrupt wire |
CN108713236B (zh) * | 2016-02-24 | 2021-07-23 | 利萨·德雷克塞迈尔有限责任公司 | 电保险设备 |
CN107785731B (zh) * | 2016-08-26 | 2019-05-17 | 绿色点子公司 | 导电弹片固定件及插头、插座 |
EP3551132A1 (en) | 2016-12-08 | 2019-10-16 | Lintec Of America, Inc. | Improvements in artificial muscle actuators |
US10141149B2 (en) * | 2017-01-30 | 2018-11-27 | Continental Automotive Systems, Inc. | Thin film fuse |
US11688577B2 (en) * | 2017-06-30 | 2023-06-27 | Xiamen Set Electronics Co., Ltd | High-voltage direct-current thermal fuse |
CN206976273U (zh) * | 2017-06-30 | 2018-02-06 | 厦门赛尔特电子有限公司 | 一种高压直流热熔断器 |
US11087943B2 (en) * | 2019-09-06 | 2021-08-10 | Eaton Intelligent Power Limited | Fabrication of printed fuse |
EP3989256A1 (en) * | 2020-10-21 | 2022-04-27 | SolarEdge Technologies Ltd. | Thermal fuse |
Family Cites Families (33)
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US2762889A (en) * | 1955-05-23 | 1956-09-11 | Lyle G Walier | Thermal switch |
US3354282A (en) * | 1966-05-25 | 1967-11-21 | Gen Electric Canada | Thermal fuse with capillary action |
US3377448A (en) * | 1966-08-22 | 1968-04-09 | Littelfuse Inc | Thermal responsive miniature fuse |
JPS5443554A (en) * | 1977-09-12 | 1979-04-06 | Nifco Inc | Temperature fuse |
JPS57186954A (en) | 1981-05-09 | 1982-11-17 | Mitsubishi Electric Corp | Monitor for synchronous brushless machine |
JPS57186954U (ja) * | 1981-05-23 | 1982-11-27 | ||
JPS58338U (ja) * | 1981-06-25 | 1983-01-05 | 日本電気ホームエレクトロニクス株式会社 | 温度ヒユ−ズ |
JPH01176620A (ja) * | 1987-12-29 | 1989-07-13 | Nec Kansai Ltd | 温度ヒューズの製造方法 |
JPH07109745B2 (ja) * | 1989-04-28 | 1995-11-22 | 内橋エステック株式会社 | 合金型温度ヒューズの復帰方法 |
JPH0795418B2 (ja) * | 1989-07-10 | 1995-10-11 | 内橋エステック株式会社 | 平型温度ヒューズ |
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DE19615643A1 (de) * | 1996-04-21 | 1997-10-23 | Doergens Becker Gisela | Überspannungsschutzeinrichtung |
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JPH1167190A (ja) * | 1997-08-27 | 1999-03-09 | Japan Storage Battery Co Ltd | 温度ヒューズ及びそれを備えたリチウム二次電池 |
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JP3778268B2 (ja) * | 2001-03-21 | 2006-05-24 | オムロン株式会社 | 過電流遮断構造の製造方法 |
JP3990169B2 (ja) * | 2002-03-06 | 2007-10-10 | 内橋エステック株式会社 | 合金型温度ヒュ−ズ |
JP4269264B2 (ja) * | 2002-07-22 | 2009-05-27 | 内橋エステック株式会社 | 薄型温度ヒューズ |
JP2004152518A (ja) | 2002-10-29 | 2004-05-27 | Matsushita Electric Ind Co Ltd | 回路保護素子およびその製造方法 |
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JP4204852B2 (ja) * | 2002-11-26 | 2009-01-07 | 内橋エステック株式会社 | 合金型温度ヒューズ及び温度ヒューズエレメント用材料 |
JP4064217B2 (ja) * | 2002-11-26 | 2008-03-19 | 内橋エステック株式会社 | 合金型温度ヒューズ及び温度ヒューズエレメント用材料 |
JP4230251B2 (ja) * | 2003-03-04 | 2009-02-25 | 内橋エステック株式会社 | 合金型温度ヒューズ及び温度ヒューズエレメント用材料 |
DE102008040345A1 (de) * | 2008-07-11 | 2010-01-14 | Robert Bosch Gmbh | Thermosicherung |
-
2007
- 2007-03-26 DE DE102007014338A patent/DE102007014338A1/de not_active Withdrawn
-
2008
- 2008-02-01 WO PCT/EP2008/051286 patent/WO2008116685A1/de active Application Filing
- 2008-02-01 EP EP08708592.4A patent/EP2130210B1/de not_active Not-in-force
- 2008-02-01 CN CN200880010017.8A patent/CN101647081B/zh not_active Expired - Fee Related
- 2008-02-01 US US12/593,124 patent/US8633795B2/en not_active Expired - Fee Related
- 2008-02-01 JP JP2010500159A patent/JP5114546B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20100109833A1 (en) | 2010-05-06 |
DE102007014338A1 (de) | 2008-10-02 |
CN101647081B (zh) | 2013-06-19 |
EP2130210B1 (de) | 2016-09-28 |
EP2130210A1 (de) | 2009-12-09 |
US8633795B2 (en) | 2014-01-21 |
JP2010522421A (ja) | 2010-07-01 |
CN101647081A (zh) | 2010-02-10 |
WO2008116685A1 (de) | 2008-10-02 |
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