JP5111954B2 - 静電チャック及びその製造方法 - Google Patents

静電チャック及びその製造方法 Download PDF

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Publication number
JP5111954B2
JP5111954B2 JP2007165465A JP2007165465A JP5111954B2 JP 5111954 B2 JP5111954 B2 JP 5111954B2 JP 2007165465 A JP2007165465 A JP 2007165465A JP 2007165465 A JP2007165465 A JP 2007165465A JP 5111954 B2 JP5111954 B2 JP 5111954B2
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Japan
Prior art keywords
alumina
flux
paste
ceramic
green sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007165465A
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English (en)
Japanese (ja)
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JP2009004649A5 (cg-RX-API-DMAC7.html
JP2009004649A (ja
Inventor
昌邦 宮澤
崇 大沼
雅史 小野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2007165465A priority Critical patent/JP5111954B2/ja
Priority to US12/142,014 priority patent/US20080315536A1/en
Publication of JP2009004649A publication Critical patent/JP2009004649A/ja
Publication of JP2009004649A5 publication Critical patent/JP2009004649A5/ja
Application granted granted Critical
Publication of JP5111954B2 publication Critical patent/JP5111954B2/ja
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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
JP2007165465A 2007-06-22 2007-06-22 静電チャック及びその製造方法 Active JP5111954B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007165465A JP5111954B2 (ja) 2007-06-22 2007-06-22 静電チャック及びその製造方法
US12/142,014 US20080315536A1 (en) 2007-06-22 2008-06-19 Electrostatic chuck and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007165465A JP5111954B2 (ja) 2007-06-22 2007-06-22 静電チャック及びその製造方法

Publications (3)

Publication Number Publication Date
JP2009004649A JP2009004649A (ja) 2009-01-08
JP2009004649A5 JP2009004649A5 (cg-RX-API-DMAC7.html) 2010-04-30
JP5111954B2 true JP5111954B2 (ja) 2013-01-09

Family

ID=40135695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007165465A Active JP5111954B2 (ja) 2007-06-22 2007-06-22 静電チャック及びその製造方法

Country Status (2)

Country Link
US (1) US20080315536A1 (cg-RX-API-DMAC7.html)
JP (1) JP5111954B2 (cg-RX-API-DMAC7.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5284227B2 (ja) * 2009-09-07 2013-09-11 日本特殊陶業株式会社 静電チャック及び静電チャックの製造方法
SG11201505056WA (en) * 2012-12-28 2015-08-28 Hoya Corp Substrate for mask blank, substrate with multilayer reflective film, reflective mask blank, reflective mask, method of manufacturing for substrate for mask blank, method of manufacturing for substrate with multilayer reflective film, and method of manufacturing semiconductor device
JP5767357B1 (ja) * 2014-03-26 2015-08-19 Hoya株式会社 マスクブランク用基板、マスクブランク及び転写用マスク、並びにそれらの製造方法
JP6583897B1 (ja) 2018-05-25 2019-10-02 ▲らん▼海精研股▲ふん▼有限公司 セラミック製静電チャックの製造方法
JP7010313B2 (ja) * 2020-01-31 2022-01-26 住友大阪セメント株式会社 セラミックス接合体、静電チャック装置、セラミックス接合体の製造方法
CN114695214A (zh) * 2020-12-31 2022-07-01 中国科学院微电子研究所 一种晶圆传送机械臂及其制造方法、晶圆的传送方法
US12500109B2 (en) 2021-10-28 2025-12-16 Entegris, Inc. Electrostatic chuck that includes upper ceramic layer that includes a dielectric layer, and related methods and structures
CN117693809A (zh) * 2022-01-31 2024-03-12 住友大阪水泥股份有限公司 陶瓷接合体、静电卡盘装置及陶瓷接合体的制造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4039338A (en) * 1972-12-29 1977-08-02 International Business Machines Corporation Accelerated sintering for a green ceramic sheet
JP3604888B2 (ja) * 1997-01-30 2004-12-22 日本碍子株式会社 窒化アルミニウム質セラミックス基材の接合体、窒化アルミニウム質セラミックス基材の接合体の製造方法及び接合剤
JPH11168134A (ja) * 1997-12-03 1999-06-22 Shin Etsu Chem Co Ltd 静電吸着装置およびその製造方法
JP2002170870A (ja) * 2000-12-01 2002-06-14 Ibiden Co Ltd 半導体製造・検査装置用セラミック基板および静電チャック
JP3973872B2 (ja) * 2001-10-17 2007-09-12 住友大阪セメント株式会社 電極内蔵型サセプタ及びその製造方法
JP2003152064A (ja) * 2001-11-13 2003-05-23 Sumitomo Osaka Cement Co Ltd 電極内蔵型サセプタ及びその製造方法
TWI228786B (en) * 2002-04-16 2005-03-01 Anelva Corp Electrostatic chucking stage and substrate processing apparatus
JP4476701B2 (ja) * 2004-06-02 2010-06-09 日本碍子株式会社 電極内蔵焼結体の製造方法

Also Published As

Publication number Publication date
US20080315536A1 (en) 2008-12-25
JP2009004649A (ja) 2009-01-08

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