JP5109226B2 - 発光装置 - Google Patents

発光装置 Download PDF

Info

Publication number
JP5109226B2
JP5109226B2 JP2005012810A JP2005012810A JP5109226B2 JP 5109226 B2 JP5109226 B2 JP 5109226B2 JP 2005012810 A JP2005012810 A JP 2005012810A JP 2005012810 A JP2005012810 A JP 2005012810A JP 5109226 B2 JP5109226 B2 JP 5109226B2
Authority
JP
Japan
Prior art keywords
light
light emitting
glass
phosphor
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2005012810A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006202962A5 (enExample
JP2006202962A (ja
Inventor
好伸 末広
誠治 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2005012810A priority Critical patent/JP5109226B2/ja
Priority to US11/334,745 priority patent/US20060171152A1/en
Publication of JP2006202962A publication Critical patent/JP2006202962A/ja
Publication of JP2006202962A5 publication Critical patent/JP2006202962A5/ja
Priority to US12/929,331 priority patent/US8294160B2/en
Application granted granted Critical
Publication of JP5109226B2 publication Critical patent/JP5109226B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Led Device Packages (AREA)
JP2005012810A 2005-01-20 2005-01-20 発光装置 Expired - Lifetime JP5109226B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005012810A JP5109226B2 (ja) 2005-01-20 2005-01-20 発光装置
US11/334,745 US20060171152A1 (en) 2005-01-20 2006-01-19 Light emitting device and method of making the same
US12/929,331 US8294160B2 (en) 2005-01-20 2011-01-14 Light emitting device including a sealing portion, and method of making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005012810A JP5109226B2 (ja) 2005-01-20 2005-01-20 発光装置

Publications (3)

Publication Number Publication Date
JP2006202962A JP2006202962A (ja) 2006-08-03
JP2006202962A5 JP2006202962A5 (enExample) 2007-07-19
JP5109226B2 true JP5109226B2 (ja) 2012-12-26

Family

ID=36960681

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005012810A Expired - Lifetime JP5109226B2 (ja) 2005-01-20 2005-01-20 発光装置

Country Status (1)

Country Link
JP (1) JP5109226B2 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101623422B1 (ko) 2007-06-27 2016-05-23 더 리전츠 오브 더 유니버시티 오브 캘리포니아 고 효율 백색 발광 다이오드들을 위한 광학 설계들
JP2009105379A (ja) * 2007-10-05 2009-05-14 Panasonic Electric Works Co Ltd 発光装置
DE102008021436A1 (de) * 2008-04-29 2010-05-20 Schott Ag Optik-Konverter-System für (W)LEDs
JP5084693B2 (ja) * 2008-10-21 2012-11-28 電気化学工業株式会社 発光装置および発光素子搭載用基板
JP5467963B2 (ja) * 2009-09-29 2014-04-09 株式会社住田光学ガラス 発光装置の製造方法
US8545083B2 (en) 2009-12-22 2013-10-01 Sumita Optical Glass, Inc. Light-emitting device, light source and method of manufacturing the same
JP5330306B2 (ja) * 2010-03-30 2013-10-30 豊田合成株式会社 発光装置
JP2011155187A (ja) * 2010-01-28 2011-08-11 Konica Minolta Opto Inc 発光ダイオードユニットの製造方法
KR101683889B1 (ko) * 2010-03-30 2016-12-20 엘지이노텍 주식회사 발광장치 및 그 제조방법
WO2013041979A1 (en) * 2011-09-20 2013-03-28 Koninklijke Philips Electronics N.V. A light emitting module, a lamp, a luminaire and a display device
JP2013135084A (ja) * 2011-12-26 2013-07-08 Nitto Denko Corp 発光ダイオード装置の製造方法
JP2013175527A (ja) * 2012-02-24 2013-09-05 Citizen Holdings Co Ltd 半導体発光装置
WO2014038122A1 (en) * 2012-09-05 2014-03-13 Sharp Kabushiki Kaisha Method of illuminating a display
CN105392746A (zh) * 2013-07-19 2016-03-09 中央硝子株式会社 荧光体分散玻璃和其制造方法
TWI517450B (zh) * 2013-10-21 2016-01-11 隆達電子股份有限公司 發光二極體封裝體
JP6570305B2 (ja) * 2015-05-12 2019-09-04 三菱電機株式会社 表示装置
JP6906914B2 (ja) * 2016-08-31 2021-07-21 エルジー ディスプレイ カンパニー リミテッド 波長選択素子、光源装置及び表示装置
CN115411023B (zh) * 2022-08-22 2023-09-19 深圳市未林森科技有限公司 一种误差小的cob光源颜色均匀控制工艺方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62153178A (ja) * 1985-12-27 1987-07-08 株式会社ノリタケカンパニーリミテド グレ−ズドセラミツク基板
US5813753A (en) * 1997-05-27 1998-09-29 Philips Electronics North America Corporation UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light
US5959316A (en) * 1998-09-01 1999-09-28 Hewlett-Packard Company Multiple encapsulation of phosphor-LED devices
JP2003197977A (ja) * 2001-12-27 2003-07-11 Okaya Electric Ind Co Ltd 発光ダイオードの製造方法
JP2003324215A (ja) * 2002-04-30 2003-11-14 Toyoda Gosei Co Ltd 発光ダイオードランプ
JP2004207367A (ja) * 2002-12-24 2004-07-22 Toyoda Gosei Co Ltd 発光ダイオード及び発光ダイオード配列板
WO2004082036A1 (ja) * 2003-03-10 2004-09-23 Toyoda Gosei Co., Ltd. 固体素子デバイスおよびその製造方法
JP2004273798A (ja) * 2003-03-10 2004-09-30 Toyoda Gosei Co Ltd 発光デバイス
JP2004296999A (ja) * 2003-03-28 2004-10-21 Okaya Electric Ind Co Ltd 発光ダイオード
JP4259198B2 (ja) * 2003-06-18 2009-04-30 豊田合成株式会社 発光装置用波長変換部の製造方法及び発光装置の製造方法

Also Published As

Publication number Publication date
JP2006202962A (ja) 2006-08-03

Similar Documents

Publication Publication Date Title
US12080695B2 (en) Method for manufacturing light emitting devices
US8294160B2 (en) Light emitting device including a sealing portion, and method of making the same
JP5109226B2 (ja) 発光装置
JP4881358B2 (ja) 発光装置
CN100544042C (zh) 发光光源及其制造方法以及发光装置
JP5311582B2 (ja) Ｌｅｄ素子並びにこのｌｅｄ素子を用いたバックライト装置及びディスプレー装置
CN101312185B (zh) 发光装置及其制造方法
JP6079209B2 (ja) 発光装置およびその製造方法
JP5084324B2 (ja) 発光装置および照明装置
CN102456820B (zh) 用于安装发光元件的基板、发光器件及其制造方法
JP2007242856A (ja) チップ型半導体発光素子
JP2011096739A (ja) 発光装置
JP4417906B2 (ja) 発光装置及びその製造方法
CN109427756B (zh) 发光装置
CN102969434A (zh) Led组件
JP2007235104A (ja) 発光装置の製造方法および発光装置
JP4986282B2 (ja) 発光装置
US10193032B2 (en) Method for manufacturing light emitting device
JP2008140934A (ja) 発光ダイオード装置及び照明装置
JP2007116116A (ja) 発光装置
JP6036103B2 (ja) 発光装置及びその製造方法
JP2010225607A (ja) 発光装置
JP5320374B2 (ja) 発光装置の製造方法
JP2024061410A (ja) 発光装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070606

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070627

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100202

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101102

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101224

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110419

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110620

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111213

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120207

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120911

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120924

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20151019

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 5109226

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

EXPY Cancellation because of completion of term