JP5085681B2 - 圧電振動片、圧電デバイスおよび圧電振動片の製造方法 - Google Patents

圧電振動片、圧電デバイスおよび圧電振動片の製造方法 Download PDF

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Publication number
JP5085681B2
JP5085681B2 JP2010079997A JP2010079997A JP5085681B2 JP 5085681 B2 JP5085681 B2 JP 5085681B2 JP 2010079997 A JP2010079997 A JP 2010079997A JP 2010079997 A JP2010079997 A JP 2010079997A JP 5085681 B2 JP5085681 B2 JP 5085681B2
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JP
Japan
Prior art keywords
vibrating piece
piezoelectric
support arm
thickness
piezoelectric vibrating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010079997A
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English (en)
Japanese (ja)
Other versions
JP2011211672A (ja
JP2011211672A5 (enExample
Inventor
宏樹 岩井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
Original Assignee
Nihon Dempa Kogyo Co Ltd
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Filing date
Publication date
Application filed by Nihon Dempa Kogyo Co Ltd filed Critical Nihon Dempa Kogyo Co Ltd
Priority to JP2010079997A priority Critical patent/JP5085681B2/ja
Priority to US13/069,691 priority patent/US8729780B2/en
Publication of JP2011211672A publication Critical patent/JP2011211672A/ja
Publication of JP2011211672A5 publication Critical patent/JP2011211672A5/ja
Application granted granted Critical
Publication of JP5085681B2 publication Critical patent/JP5085681B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/21—Crystal tuning forks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02086—Means for compensation or elimination of undesirable effects
    • H03H9/02118—Means for compensation or elimination of undesirable effects of lateral leakage between adjacent resonators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0504—Holders or supports for bulk acoustic wave devices
    • H03H9/0514—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps
    • H03H9/0519—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps for cantilever
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/21—Crystal tuning forks
    • H03H9/215—Crystal tuning forks consisting of quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2010079997A 2010-03-31 2010-03-31 圧電振動片、圧電デバイスおよび圧電振動片の製造方法 Expired - Fee Related JP5085681B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010079997A JP5085681B2 (ja) 2010-03-31 2010-03-31 圧電振動片、圧電デバイスおよび圧電振動片の製造方法
US13/069,691 US8729780B2 (en) 2010-03-31 2011-03-23 Piezoelectric vibrating pieces and corresponding devices exhibiting reduced vibration leakage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010079997A JP5085681B2 (ja) 2010-03-31 2010-03-31 圧電振動片、圧電デバイスおよび圧電振動片の製造方法

Publications (3)

Publication Number Publication Date
JP2011211672A JP2011211672A (ja) 2011-10-20
JP2011211672A5 JP2011211672A5 (enExample) 2012-03-08
JP5085681B2 true JP5085681B2 (ja) 2012-11-28

Family

ID=44708794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010079997A Expired - Fee Related JP5085681B2 (ja) 2010-03-31 2010-03-31 圧電振動片、圧電デバイスおよび圧電振動片の製造方法

Country Status (2)

Country Link
US (1) US8729780B2 (enExample)
JP (1) JP5085681B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6055294B2 (ja) * 2012-11-28 2016-12-27 京セラクリスタルデバイス株式会社 圧電素子の製造方法
JP6168801B2 (ja) * 2013-03-13 2017-07-26 エスアイアイ・クリスタルテクノロジー株式会社 圧電振動片、圧電振動子、発振器、電子機器、および電波時計
JP2014179797A (ja) * 2013-03-14 2014-09-25 Sii Crystal Technology Inc 圧電振動片、圧電振動片の実装方法、圧電振動子、発振器、電子機器、および電波時計
JP6107332B2 (ja) * 2013-03-29 2017-04-05 セイコーエプソン株式会社 振動子、発振器、電子機器および移動体
JP6346423B2 (ja) * 2013-09-25 2018-06-20 エスアイアイ・クリスタルテクノロジー株式会社 圧電振動子
JP6163404B2 (ja) * 2013-10-09 2017-07-12 京セラ株式会社 圧電素子の製造方法
JP2015097366A (ja) * 2013-11-16 2015-05-21 セイコーエプソン株式会社 振動素子、振動子、発振器、電子機器および移動体
JP6592248B2 (ja) * 2015-01-30 2019-10-16 シチズン時計株式会社 振動子ユニット
CN115940876A (zh) * 2022-10-11 2023-04-07 泰晶科技股份有限公司 一种微型石英音叉晶片

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3951058B2 (ja) * 2003-08-19 2007-08-01 セイコーエプソン株式会社 音叉型圧電振動片
JP5045054B2 (ja) 2006-10-11 2012-10-10 セイコーエプソン株式会社 圧電デバイス
JP5015678B2 (ja) * 2007-07-02 2012-08-29 日本電波工業株式会社 圧電デバイス及び圧電振動片
JP5216288B2 (ja) * 2007-09-25 2013-06-19 日本電波工業株式会社 圧電振動片の製造方法、圧電デバイスの製造方法
JP4629094B2 (ja) * 2007-12-28 2011-02-09 日本電波工業株式会社 圧電振動片、圧電デバイス及びそれらの製造方法
JP5130952B2 (ja) * 2008-02-26 2013-01-30 株式会社大真空 圧電振動デバイスおよび圧電振動デバイスの製造方法
JP4594412B2 (ja) * 2008-05-22 2010-12-08 日本電波工業株式会社 圧電振動片および圧電デバイス
JP2010004456A (ja) * 2008-06-23 2010-01-07 Nippon Dempa Kogyo Co Ltd 圧電振動片および圧電デバイス
JP5146222B2 (ja) * 2008-09-22 2013-02-20 株式会社大真空 圧電振動デバイス
JP4885206B2 (ja) * 2008-12-22 2012-02-29 日本電波工業株式会社 音叉型圧電振動片および圧電デバイス
US8692632B2 (en) * 2010-03-17 2014-04-08 Seiko Epson Corporation Resonator element, resonator, oscillator, and electronic device

Also Published As

Publication number Publication date
JP2011211672A (ja) 2011-10-20
US20110241495A1 (en) 2011-10-06
US8729780B2 (en) 2014-05-20

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