JP5074523B2 - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
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- JP5074523B2 JP5074523B2 JP2009547874A JP2009547874A JP5074523B2 JP 5074523 B2 JP5074523 B2 JP 5074523B2 JP 2009547874 A JP2009547874 A JP 2009547874A JP 2009547874 A JP2009547874 A JP 2009547874A JP 5074523 B2 JP5074523 B2 JP 5074523B2
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- 239000004065 semiconductor Substances 0.000 title claims description 56
- 238000004519 manufacturing process Methods 0.000 title claims description 34
- 239000000758 substrate Substances 0.000 claims description 116
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 45
- 229920005591 polysilicon Polymers 0.000 claims description 41
- 239000002184 metal Substances 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 37
- 239000011521 glass Substances 0.000 claims description 30
- 239000001257 hydrogen Substances 0.000 claims description 26
- 229910052739 hydrogen Inorganic materials 0.000 claims description 26
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 11
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 11
- 238000000059 patterning Methods 0.000 claims description 9
- 238000000926 separation method Methods 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 223
- 239000010408 film Substances 0.000 description 148
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 59
- 229910052710 silicon Inorganic materials 0.000 description 59
- 239000010703 silicon Substances 0.000 description 59
- 239000012535 impurity Substances 0.000 description 43
- 230000001681 protective effect Effects 0.000 description 18
- 238000005468 ion implantation Methods 0.000 description 12
- 238000002955 isolation Methods 0.000 description 11
- 229910052581 Si3N4 Inorganic materials 0.000 description 10
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 7
- 229910052796 boron Inorganic materials 0.000 description 7
- 239000004973 liquid crystal related substance Substances 0.000 description 7
- -1 hydrogen ions Chemical class 0.000 description 6
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 description 6
- 239000010409 thin film Substances 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 150000002431 hydrogen Chemical class 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 238000005411 Van der Waals force Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
- H01L27/1266—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
- H01L29/7836—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's with a significant overlap between the lightly doped extension and the gate electrode
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- High Energy & Nuclear Physics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Ceramic Engineering (AREA)
- Thin Film Transistor (AREA)
Description
次に、本発明の作用について説明する。
D デバイス部
1 シリコン基板(基体層)
10 LOCOS酸化膜
13 チャネル領域
14 ポリシリコン層
16 ゲート酸化膜
17 ゲート電極(電極)
18 金属膜
19 シリコン層部(電極)
20 金属層部(電極)
22 P型不純物元素
23 P型低濃度不純物領域
29 P型不純物元素
30 P型高濃度不純物領域
31 平坦化膜
32 剥離用物質、水素
33 剥離層
35 コンタクトホール
37 保護絶縁膜
38 ガラス基板(基板)
56 PMOSトランジスタ
図1〜図5は、本発明の参考例1を示している。
次に、上記半導体装置Sの製造方法について説明する。
したがって、この参考例1によると、ゲート電極17をパターン形成する前に、剥離層33を形成するようにしたので、PMOSトランジスタ56を形成する領域において、ゲート電極17自体の形状によるシリコン基板1(基体層1)への水素32の注入深さのばらつきを低減して、シリコン基板1の内部に剥離層33を平坦な層に形成することができる。
図6〜図9は、本発明の参考例2を示している。
したがって、この参考例2によっても、ゲート電極17をパターン形成する前に剥離層33を形成するようにしたので、上記参考例1と同様の効果を得ることができる。そのことに加え、本参考例2では、導電層形成工程において、ポリシリコン層14の表面を平坦化したので、後の剥離層形成工程において、剥離層33を全体に亘って平坦な層に形成することができる。
図10〜図14は、本発明の実施形態1を示している。
したがって、本実施形態1によっても、ゲート電極17をパターン形成する前に剥離層33を形成するようにしたので、上記参考例1と同様の効果を得ることができる。そのことに加え、本実施形態1では、ゲート電極17をシリコン層部19と金属層部20とにより構成してシリサイド化したので、ゲート電極17の抵抗値を低下させることができる。つまり、ゲート電極17の導電性を高めながらも、剥離層33の平坦性を向上させることができる。さらに、水素イオン注入前にシリサイド化のための加熱処理をすることによって、当該加熱処理による剥離層33の機能低下を防止することができる。
図15〜図18は、本発明の実施形態2を示している。
したがって、本実施形態2によっても、ゲート電極17をパターン形成する前に剥離層33を形成するようにしたので、上記参考例1と同様の効果を得ることができる。さらに、ゲート電極17をシリコン層部19及び金属層部20により構成したので、上記実施形態1と同様の効果を得ることもできる。そのことに加え、本実施形態2では、導電層形成工程においてポリシリコン層14の表面を平坦化し、これに積層される金属膜18の表面についても平坦に形成するようにしたので、後の剥離層形成工程において、剥離層33を全体に亘って平坦な層に形成することができる。
上記各参考例及び実施形態では、LOCOS酸化膜10を平坦なシリコン基板1に形成することにより、LOCOS酸化膜10を凸状に形成するようにしたが、図19に示すように、ゲート酸化膜16と略同じ高さに形成してもよい。
Claims (9)
- 基体層に電極を含む素子の少なくとも一部を含むデバイス部を形成するデバイス部形成工程と、
前記基体層に対し、剥離用物質をイオン注入して剥離層を形成する剥離層形成工程と、
前記デバイス部が形成された基体層を基板に貼り付ける貼付工程と、
前記基板に貼り付けられた前記基体層の前記デバイス部が形成されていない一部を、前記剥離層に沿って分離除去する分離工程とを有する半導体装置の製造方法であって、
前記デバイス部形成工程には、前記基体層の表面に絶縁膜を形成する絶縁膜形成工程と、前記絶縁膜の表面に導電層を一様に形成する導電層形成工程と、前記導電層の表面に金属膜を一様に積層する金属膜形成工程と、前記導電層及び前記金属膜をパターニングすることにより前記電極を形成する電極形成工程とが含まれ、
前記剥離層形成工程は、前記導電層形成工程の後であり且つ前記電極形成工程の前に行われる
ことを特徴とする半導体装置の製造方法。 - 請求項1に記載された半導体装置の製造方法において、
前記導電層形成工程では、前記導電層の表面を平坦化する
ことを特徴とする半導体装置の製造方法。 - 請求項1に記載された半導体装置の製造方法において、
前記導電層は、ポリシリコンによって構成されている
ことを特徴とする半導体装置の製造方法。 - 請求項1に記載された半導体装置の製造方法において、
前記導電層は、ポリシリコンによって構成され、前記金属膜形成工程の後にシリサイド化される
ことを特徴とする半導体装置の製造方法。 - 請求項1に記載された半導体装置の製造方法において、
前記剥離用物質は、水素又は不活性元素である
ことを特徴とする半導体装置の製造方法。 - 請求項1に記載された半導体装置の製造方法において、
前記基体層は、単結晶シリコン層である
ことを特徴とする半導体装置の製造方法。 - 請求項1に記載された半導体装置の製造方法において、
前記基板は、ガラス基板である
ことを特徴とする半導体装置の製造方法。 - 請求項1に記載された半導体装置の製造方法において、
前記電極は、MOSトランジスタにおけるゲート電極の少なくとも一部を構成する
ことを特徴とする半導体装置の製造方法。 - 請求項1に記載された半導体装置の製造方法において、
前記貼付工程では、前記基体層の前記基板に貼り付けられる表面を予め平坦化する
ことを特徴とする半導体装置の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009547874A JP5074523B2 (ja) | 2007-12-28 | 2008-11-25 | 半導体装置及びその製造方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007341077 | 2007-12-28 | ||
JP2007341077 | 2007-12-28 | ||
PCT/JP2008/003463 WO2009084149A1 (ja) | 2007-12-28 | 2008-11-25 | 半導体装置及びその製造方法 |
JP2009547874A JP5074523B2 (ja) | 2007-12-28 | 2008-11-25 | 半導体装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
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JPWO2009084149A1 JPWO2009084149A1 (ja) | 2011-05-12 |
JP5074523B2 true JP5074523B2 (ja) | 2012-11-14 |
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JP2009547874A Expired - Fee Related JP5074523B2 (ja) | 2007-12-28 | 2008-11-25 | 半導体装置及びその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20100283104A1 (ja) |
EP (1) | EP2226835A1 (ja) |
JP (1) | JP5074523B2 (ja) |
CN (1) | CN101884096B (ja) |
WO (1) | WO2009084149A1 (ja) |
Families Citing this family (2)
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CN206516630U (zh) * | 2015-01-09 | 2017-09-22 | 硅源公司 | 三维集成电路 |
TWI730053B (zh) * | 2016-02-16 | 2021-06-11 | 瑞士商G射線瑞士公司 | 用於電荷傳輸通過接合界面的結構、系統及方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10223495A (ja) * | 1997-02-04 | 1998-08-21 | Nippon Telegr & Teleph Corp <Ntt> | 柔軟な構造を有する半導体装置とその製造方法 |
JP2001237403A (ja) * | 2000-02-21 | 2001-08-31 | Rohm Co Ltd | 半導体装置の製法および超薄型半導体装置 |
JP2004165600A (ja) * | 2002-09-25 | 2004-06-10 | Sharp Corp | 単結晶Si基板、半導体装置およびその製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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FR2681472B1 (fr) * | 1991-09-18 | 1993-10-29 | Commissariat Energie Atomique | Procede de fabrication de films minces de materiau semiconducteur. |
US6191007B1 (en) * | 1997-04-28 | 2001-02-20 | Denso Corporation | Method for manufacturing a semiconductor substrate |
US7508034B2 (en) * | 2002-09-25 | 2009-03-24 | Sharp Kabushiki Kaisha | Single-crystal silicon substrate, SOI substrate, semiconductor device, display device, and manufacturing method of semiconductor device |
JP4651924B2 (ja) * | 2003-09-18 | 2011-03-16 | シャープ株式会社 | 薄膜半導体装置および薄膜半導体装置の製造方法 |
JP4175650B2 (ja) * | 2004-08-26 | 2008-11-05 | シャープ株式会社 | 半導体装置の製造方法 |
-
2008
- 2008-11-25 WO PCT/JP2008/003463 patent/WO2009084149A1/ja active Application Filing
- 2008-11-25 EP EP08867770A patent/EP2226835A1/en not_active Withdrawn
- 2008-11-25 US US12/746,317 patent/US20100283104A1/en not_active Abandoned
- 2008-11-25 JP JP2009547874A patent/JP5074523B2/ja not_active Expired - Fee Related
- 2008-11-25 CN CN2008801190805A patent/CN101884096B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10223495A (ja) * | 1997-02-04 | 1998-08-21 | Nippon Telegr & Teleph Corp <Ntt> | 柔軟な構造を有する半導体装置とその製造方法 |
JP2001237403A (ja) * | 2000-02-21 | 2001-08-31 | Rohm Co Ltd | 半導体装置の製法および超薄型半導体装置 |
JP2004165600A (ja) * | 2002-09-25 | 2004-06-10 | Sharp Corp | 単結晶Si基板、半導体装置およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20100283104A1 (en) | 2010-11-11 |
JPWO2009084149A1 (ja) | 2011-05-12 |
EP2226835A1 (en) | 2010-09-08 |
CN101884096A (zh) | 2010-11-10 |
WO2009084149A1 (ja) | 2009-07-09 |
CN101884096B (zh) | 2012-06-20 |
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