JP5067249B2 - ペースト組成物およびそれを用いた導電性組成物 - Google Patents

ペースト組成物およびそれを用いた導電性組成物 Download PDF

Info

Publication number
JP5067249B2
JP5067249B2 JP2008108651A JP2008108651A JP5067249B2 JP 5067249 B2 JP5067249 B2 JP 5067249B2 JP 2008108651 A JP2008108651 A JP 2008108651A JP 2008108651 A JP2008108651 A JP 2008108651A JP 5067249 B2 JP5067249 B2 JP 5067249B2
Authority
JP
Japan
Prior art keywords
paste composition
inorganic particles
composition
resin
general formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008108651A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009259674A (ja
JP2009259674A5 (enExample
Inventor
敏央 野中
佳子 龍田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP2008108651A priority Critical patent/JP5067249B2/ja
Publication of JP2009259674A publication Critical patent/JP2009259674A/ja
Publication of JP2009259674A5 publication Critical patent/JP2009259674A5/ja
Application granted granted Critical
Publication of JP5067249B2 publication Critical patent/JP5067249B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Paints Or Removers (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
JP2008108651A 2008-04-18 2008-04-18 ペースト組成物およびそれを用いた導電性組成物 Expired - Fee Related JP5067249B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008108651A JP5067249B2 (ja) 2008-04-18 2008-04-18 ペースト組成物およびそれを用いた導電性組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008108651A JP5067249B2 (ja) 2008-04-18 2008-04-18 ペースト組成物およびそれを用いた導電性組成物

Publications (3)

Publication Number Publication Date
JP2009259674A JP2009259674A (ja) 2009-11-05
JP2009259674A5 JP2009259674A5 (enExample) 2011-05-26
JP5067249B2 true JP5067249B2 (ja) 2012-11-07

Family

ID=41386836

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008108651A Expired - Fee Related JP5067249B2 (ja) 2008-04-18 2008-04-18 ペースト組成物およびそれを用いた導電性組成物

Country Status (1)

Country Link
JP (1) JP5067249B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5533043B2 (ja) * 2010-03-05 2014-06-25 東レ株式会社 感光性導電ペーストおよび導電パターンの製造方法
JPWO2011118171A1 (ja) * 2010-03-26 2013-07-04 住友ベークライト株式会社 感光性樹脂組成物及び受光装置
KR102007129B1 (ko) * 2012-07-20 2019-08-02 도요보 가부시키가이샤 레이저 에칭 가공용 도전성 페이스트, 도전성 박막 및 도전성 적층체

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3321931B2 (ja) * 1993-10-05 2002-09-09 三菱マテリアル株式会社 導電膜形成用組成物
JP3982062B2 (ja) * 1998-06-19 2007-09-26 Jsr株式会社 プラズマディスプレイパネルの製造方法
JP2003110225A (ja) * 2001-09-28 2003-04-11 Toyo Ink Mfg Co Ltd ロータリースクリーン印刷用導電性ペースト、それを用いた導体回路の製造方法、および非接触id
JP2004214067A (ja) * 2003-01-07 2004-07-29 Nippon Shokubai Co Ltd 複合誘電体用樹脂組成物および複合誘電体
JP2006160941A (ja) * 2004-12-09 2006-06-22 Denki Kagaku Kogyo Kk 導電性樹脂組成物と、それを用いてなるシート
JP2007148438A (ja) * 2007-02-22 2007-06-14 Jsr Corp 転写フィルム
US8247338B2 (en) * 2008-01-18 2012-08-21 Toray Industries, Inc High dielectric constant paste composition and dielectric composition using the same

Also Published As

Publication number Publication date
JP2009259674A (ja) 2009-11-05

Similar Documents

Publication Publication Date Title
CN104040640B (zh) 导电浆料和导电图案的制造方法
CN102365690B (zh) 感光性导电糊剂及电极图案
JP5146450B2 (ja) 高誘電率ペースト組成物およびそれを用いた誘電体組成物
TWI472876B (zh) 感光性導電糊
JP5109553B2 (ja) 感光性樹脂組成物およびそれを用いた誘電体組成物、半導体装置
KR20140148400A (ko) 감광성 도전 페이스트 및 도전 패턴의 제조 방법
CN101031845A (zh) 用在光图案化方法中的可水溶液显影的可光成像的组合物前体
JP5067249B2 (ja) ペースト組成物およびそれを用いた導電性組成物
JP5407164B2 (ja) ペースト組成物およびそれを用いた誘電体組成物
KR102786767B1 (ko) 도전 패턴의 제조 방법
JP2015184626A (ja) 感光性樹脂組成物、それからなる感光性樹脂ペーストならびにそれらを硬化させて得られる硬化膜およびそれを有する電極回路
JP2009263404A (ja) ペースト組成物およびそれを用いた樹脂組成物
JP5407163B2 (ja) ペースト組成物およびそれを用いた高熱伝導率樹脂組成物
CN105531626B (zh) 感光性遮光糊剂和接触式传感器用层叠图案的制造方法
JP3473353B2 (ja) 絶縁体ペースト
JP5256921B2 (ja) 絶縁層形成用材料および電子部品。
JP2009263555A (ja) ペースト組成物
JP7711749B2 (ja) 硬化膜付きled実装基板の製造方法
JP4565213B2 (ja) 感光性誘電体形成用組成物、転写フィルム、誘電体および電子部品
JP2020196212A (ja) 積層部材及び導電パターン形成用フィルム
JP2009175399A (ja) 電子放出素子の絶縁層形成用感光性組成物
KR20180121875A (ko) 감광성 도전 페이스트 및 도전 패턴이 있는 기판의 제조 방법
WO2024252967A1 (ja) 感光性導電組成物、それを用いた積層体、感光性導電接着剤、パターン付き基板の製造方法およびディスプレイ基板
JP2021152988A (ja) 導電ペースト、導電パターン形成用フィルム、積層部材及びタッチパネル
JP2020083947A (ja) ペースト、それを用いた硬化膜、焼成体、電子部品とその製造方法および配線つきセラミック積層体

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110408

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110408

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120709

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120717

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120730

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150824

Year of fee payment: 3

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150824

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees