JP5066011B2 - 研磨装置 - Google Patents

研磨装置 Download PDF

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Publication number
JP5066011B2
JP5066011B2 JP2008161254A JP2008161254A JP5066011B2 JP 5066011 B2 JP5066011 B2 JP 5066011B2 JP 2008161254 A JP2008161254 A JP 2008161254A JP 2008161254 A JP2008161254 A JP 2008161254A JP 5066011 B2 JP5066011 B2 JP 5066011B2
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JP
Japan
Prior art keywords
polishing
tape
substrate
back pad
wafer
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JP2008161254A
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English (en)
Japanese (ja)
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JP2009039853A5 (zh
JP2009039853A (ja
Inventor
正也 関
圭瑞 高橋
宏明 草
賢也 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
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Publication date
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Priority to JP2008161254A priority Critical patent/JP5066011B2/ja
Priority to PCT/JP2008/062968 priority patent/WO2009011408A1/ja
Priority to TW97126892A priority patent/TWI433754B/zh
Publication of JP2009039853A publication Critical patent/JP2009039853A/ja
Publication of JP2009039853A5 publication Critical patent/JP2009039853A5/ja
Application granted granted Critical
Publication of JP5066011B2 publication Critical patent/JP5066011B2/ja
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JP2008161254A 2007-07-18 2008-06-20 研磨装置 Active JP5066011B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008161254A JP5066011B2 (ja) 2007-07-18 2008-06-20 研磨装置
PCT/JP2008/062968 WO2009011408A1 (ja) 2007-07-18 2008-07-11 研磨装置
TW97126892A TWI433754B (zh) 2007-07-18 2008-07-16 研磨裝置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007186898 2007-07-18
JP2007186898 2007-07-18
JP2008161254A JP5066011B2 (ja) 2007-07-18 2008-06-20 研磨装置

Publications (3)

Publication Number Publication Date
JP2009039853A JP2009039853A (ja) 2009-02-26
JP2009039853A5 JP2009039853A5 (zh) 2011-01-13
JP5066011B2 true JP5066011B2 (ja) 2012-11-07

Family

ID=40441164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008161254A Active JP5066011B2 (ja) 2007-07-18 2008-06-20 研磨装置

Country Status (2)

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JP (1) JP5066011B2 (zh)
TW (1) TWI433754B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6587135B2 (ja) * 2015-03-31 2019-10-09 日本電気硝子株式会社 板ガラスの研磨加工方法及び研磨加工装置
JP6851068B2 (ja) * 2016-01-12 2021-03-31 中村留精密工業株式会社 研削・研磨複合加工装置及び研磨装置
JP6974067B2 (ja) * 2017-08-17 2021-12-01 株式会社荏原製作所 基板を研磨する方法および装置
CN116141153B (zh) * 2023-04-19 2023-06-27 宜宾职业技术学院 砂带抛光磨削机器人
CN117260517B (zh) * 2023-11-22 2024-01-26 山西阳煤千军汽车部件有限责任公司 一种汽缸盖用表面用抛光装置及其操作方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62172551U (zh) * 1986-04-19 1987-11-02
JPH08118226A (ja) * 1994-10-20 1996-05-14 Shin Etsu Handotai Co Ltd ウェーハのノッチ部研磨装置
JPH0976148A (ja) * 1995-09-12 1997-03-25 Shin Etsu Handotai Co Ltd ウェーハのノッチ部研磨装置
JP2001328051A (ja) * 2000-05-22 2001-11-27 Speedfam Co Ltd 被研磨物のエッジ部の研磨方法及びその研磨装置
JP4090247B2 (ja) * 2002-02-12 2008-05-28 株式会社荏原製作所 基板処理装置
JP4125148B2 (ja) * 2003-02-03 2008-07-30 株式会社荏原製作所 基板処理装置

Also Published As

Publication number Publication date
TW200911453A (en) 2009-03-16
TWI433754B (zh) 2014-04-11
JP2009039853A (ja) 2009-02-26

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