JP5066011B2 - 研磨装置 - Google Patents
研磨装置 Download PDFInfo
- Publication number
- JP5066011B2 JP5066011B2 JP2008161254A JP2008161254A JP5066011B2 JP 5066011 B2 JP5066011 B2 JP 5066011B2 JP 2008161254 A JP2008161254 A JP 2008161254A JP 2008161254 A JP2008161254 A JP 2008161254A JP 5066011 B2 JP5066011 B2 JP 5066011B2
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- JP
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- Prior art keywords
- polishing
- tape
- substrate
- back pad
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008161254A JP5066011B2 (ja) | 2007-07-18 | 2008-06-20 | 研磨装置 |
PCT/JP2008/062968 WO2009011408A1 (ja) | 2007-07-18 | 2008-07-11 | 研磨装置 |
TW97126892A TWI433754B (zh) | 2007-07-18 | 2008-07-16 | 研磨裝置 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007186898 | 2007-07-18 | ||
JP2007186898 | 2007-07-18 | ||
JP2008161254A JP5066011B2 (ja) | 2007-07-18 | 2008-06-20 | 研磨装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009039853A JP2009039853A (ja) | 2009-02-26 |
JP2009039853A5 JP2009039853A5 (zh) | 2011-01-13 |
JP5066011B2 true JP5066011B2 (ja) | 2012-11-07 |
Family
ID=40441164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008161254A Active JP5066011B2 (ja) | 2007-07-18 | 2008-06-20 | 研磨装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5066011B2 (zh) |
TW (1) | TWI433754B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6587135B2 (ja) * | 2015-03-31 | 2019-10-09 | 日本電気硝子株式会社 | 板ガラスの研磨加工方法及び研磨加工装置 |
JP6851068B2 (ja) * | 2016-01-12 | 2021-03-31 | 中村留精密工業株式会社 | 研削・研磨複合加工装置及び研磨装置 |
JP6974067B2 (ja) * | 2017-08-17 | 2021-12-01 | 株式会社荏原製作所 | 基板を研磨する方法および装置 |
CN116141153B (zh) * | 2023-04-19 | 2023-06-27 | 宜宾职业技术学院 | 砂带抛光磨削机器人 |
CN117260517B (zh) * | 2023-11-22 | 2024-01-26 | 山西阳煤千军汽车部件有限责任公司 | 一种汽缸盖用表面用抛光装置及其操作方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62172551U (zh) * | 1986-04-19 | 1987-11-02 | ||
JPH08118226A (ja) * | 1994-10-20 | 1996-05-14 | Shin Etsu Handotai Co Ltd | ウェーハのノッチ部研磨装置 |
JPH0976148A (ja) * | 1995-09-12 | 1997-03-25 | Shin Etsu Handotai Co Ltd | ウェーハのノッチ部研磨装置 |
JP2001328051A (ja) * | 2000-05-22 | 2001-11-27 | Speedfam Co Ltd | 被研磨物のエッジ部の研磨方法及びその研磨装置 |
JP4090247B2 (ja) * | 2002-02-12 | 2008-05-28 | 株式会社荏原製作所 | 基板処理装置 |
JP4125148B2 (ja) * | 2003-02-03 | 2008-07-30 | 株式会社荏原製作所 | 基板処理装置 |
-
2008
- 2008-06-20 JP JP2008161254A patent/JP5066011B2/ja active Active
- 2008-07-16 TW TW97126892A patent/TWI433754B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW200911453A (en) | 2009-03-16 |
TWI433754B (zh) | 2014-04-11 |
JP2009039853A (ja) | 2009-02-26 |
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