JP5064604B1 - 基板エッチング装置 - Google Patents
基板エッチング装置 Download PDFInfo
- Publication number
- JP5064604B1 JP5064604B1 JP2012096811A JP2012096811A JP5064604B1 JP 5064604 B1 JP5064604 B1 JP 5064604B1 JP 2012096811 A JP2012096811 A JP 2012096811A JP 2012096811 A JP2012096811 A JP 2012096811A JP 5064604 B1 JP5064604 B1 JP 5064604B1
- Authority
- JP
- Japan
- Prior art keywords
- etching
- substrate
- frame
- nozzle
- injection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133302—Rigid substrates, e.g. inorganic substrates
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Weting (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
- Surface Treatment Of Glass (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020120011490A KR101151296B1 (ko) | 2012-02-03 | 2012-02-03 | 기판 에칭 장치 |
KR10-2012-0011490 | 2012-02-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5064604B1 true JP5064604B1 (ja) | 2012-10-31 |
JP2013162119A JP2013162119A (ja) | 2013-08-19 |
Family
ID=46688532
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012096811A Expired - Fee Related JP5064604B1 (ja) | 2012-02-03 | 2012-04-20 | 基板エッチング装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5064604B1 (zh) |
KR (1) | KR101151296B1 (zh) |
CN (1) | CN103241956B (zh) |
TW (1) | TWI489574B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110078381A (zh) * | 2019-05-05 | 2019-08-02 | 蚌埠市羚旺新工艺材料研发科技有限公司 | 一种喷淋式玻璃基板减薄线 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101491069B1 (ko) * | 2013-07-12 | 2015-02-10 | 주식회사 위스코하이텍 | 기판연마장치 |
CN104888996B (zh) * | 2015-06-29 | 2017-08-11 | 深圳市华星光电技术有限公司 | 喷淋组件以及具有该喷淋组件的湿刻设备 |
CN115094420B (zh) * | 2022-07-12 | 2023-09-26 | 深圳市杰昌实业有限公司 | 一种金属表面化学刻蚀处理装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20080088949A (ko) * | 2007-03-30 | 2008-10-06 | 김용노 | 유리기판 에칭장치 |
JP2009161429A (ja) * | 2008-01-09 | 2009-07-23 | Econy Co Ltd | 硝子基板のエッチング装置と前記エッチング装置によって製造された硝子薄板 |
JP2009249276A (ja) * | 2008-04-10 | 2009-10-29 | M M Tech Co Ltd | 下向き式基板薄型化装置及びこれを用いた薄型化システム |
KR101108974B1 (ko) * | 2009-09-29 | 2012-01-31 | 주식회사 이코니 | 잔류 에칭액 제거 기능을 구비한 유리기판 에칭장치 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070105699A (ko) * | 2006-04-27 | 2007-10-31 | 삼성전자주식회사 | 기판 식각 장치 및 이를 이용한 기판 식각 방법 |
KR101300524B1 (ko) * | 2006-09-19 | 2013-09-02 | (주)에스티아이 | 식각장치 및 식각방법 |
KR101007306B1 (ko) * | 2010-02-23 | 2011-01-13 | 주식회사 엠엠테크 | 상부 하향 분사식 기판 에칭 장치 |
-
2012
- 2012-02-03 KR KR1020120011490A patent/KR101151296B1/ko not_active IP Right Cessation
- 2012-04-20 JP JP2012096811A patent/JP5064604B1/ja not_active Expired - Fee Related
- 2012-04-30 TW TW101115399A patent/TWI489574B/zh not_active IP Right Cessation
- 2012-05-02 CN CN201210137087.8A patent/CN103241956B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20080088949A (ko) * | 2007-03-30 | 2008-10-06 | 김용노 | 유리기판 에칭장치 |
JP2009161429A (ja) * | 2008-01-09 | 2009-07-23 | Econy Co Ltd | 硝子基板のエッチング装置と前記エッチング装置によって製造された硝子薄板 |
JP2009249276A (ja) * | 2008-04-10 | 2009-10-29 | M M Tech Co Ltd | 下向き式基板薄型化装置及びこれを用いた薄型化システム |
KR101108974B1 (ko) * | 2009-09-29 | 2012-01-31 | 주식회사 이코니 | 잔류 에칭액 제거 기능을 구비한 유리기판 에칭장치 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110078381A (zh) * | 2019-05-05 | 2019-08-02 | 蚌埠市羚旺新工艺材料研发科技有限公司 | 一种喷淋式玻璃基板减薄线 |
CN110078381B (zh) * | 2019-05-05 | 2023-06-09 | 蚌埠市羚旺新工艺材料研发科技有限公司 | 一种喷淋式玻璃基板减薄线 |
Also Published As
Publication number | Publication date |
---|---|
TWI489574B (zh) | 2015-06-21 |
KR101151296B1 (ko) | 2012-06-08 |
CN103241956B (zh) | 2014-10-08 |
CN103241956A (zh) | 2013-08-14 |
JP2013162119A (ja) | 2013-08-19 |
TW201334096A (zh) | 2013-08-16 |
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