JP5061229B2 - 基板洗浄装置及び基板洗浄方法。 - Google Patents

基板洗浄装置及び基板洗浄方法。 Download PDF

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Publication number
JP5061229B2
JP5061229B2 JP2010233604A JP2010233604A JP5061229B2 JP 5061229 B2 JP5061229 B2 JP 5061229B2 JP 2010233604 A JP2010233604 A JP 2010233604A JP 2010233604 A JP2010233604 A JP 2010233604A JP 5061229 B2 JP5061229 B2 JP 5061229B2
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substrate
cleaning liquid
wafer
cleaning
nozzle
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JP2011014935A5 (enExample
JP2011014935A (ja
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太郎 山本
秀治 京田
川崎  哲
悟 志村
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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JP2010233604A 2010-10-18 2010-10-18 基板洗浄装置及び基板洗浄方法。 Expired - Fee Related JP5061229B2 (ja)

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JP2010233604A JP5061229B2 (ja) 2010-10-18 2010-10-18 基板洗浄装置及び基板洗浄方法。

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JP2010233604A JP5061229B2 (ja) 2010-10-18 2010-10-18 基板洗浄装置及び基板洗浄方法。

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JP2005249613A Division JP4734063B2 (ja) 2005-08-30 2005-08-30 基板洗浄装置及び基板洗浄方法。

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JP2011014935A JP2011014935A (ja) 2011-01-20
JP2011014935A5 JP2011014935A5 (enExample) 2011-12-08
JP5061229B2 true JP5061229B2 (ja) 2012-10-31

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5789400B2 (ja) 2011-04-12 2015-10-07 東京エレクトロン株式会社 液処理方法及び液処理装置
JP6318012B2 (ja) 2014-06-04 2018-04-25 株式会社Screenホールディングス 基板処理方法
JP6575538B2 (ja) * 2017-01-23 2019-09-18 信越半導体株式会社 半導体ウェーハの洗浄方法
JP7329418B2 (ja) * 2019-11-01 2023-08-18 東京エレクトロン株式会社 基板処理方法及び基板処理装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000061363A (ja) * 1998-08-18 2000-02-29 Dainippon Screen Mfg Co Ltd 基板処理装置の処理液吐出ノズル
JP2001334221A (ja) * 2000-05-26 2001-12-04 Dainippon Screen Mfg Co Ltd 基板洗浄装置
JP2002289568A (ja) * 2001-03-23 2002-10-04 Dainippon Screen Mfg Co Ltd 基板洗浄装置およびそれに用いる超音波振動エレメント
JP2003197590A (ja) * 2001-12-21 2003-07-11 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP4197612B2 (ja) * 2002-12-25 2008-12-17 芝浦メカトロニクス株式会社 処理液の供給装置及びスピン処理装置
EP1672682A4 (en) * 2003-10-08 2008-10-15 Zao Nikon Co Ltd SUBSTRATE TRANSPORT DEVICE AND METHOD, EXPOSURE DEVICE AND METHOD AND COMPONENT MANUFACTURING METHOD
JP4101740B2 (ja) * 2003-12-09 2008-06-18 東京エレクトロン株式会社 塗布・現像装置及びレジストパターンの形成方法

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