JP2004014869A5 - - Google Patents
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- Publication number
- JP2004014869A5 JP2004014869A5 JP2002167565A JP2002167565A JP2004014869A5 JP 2004014869 A5 JP2004014869 A5 JP 2004014869A5 JP 2002167565 A JP2002167565 A JP 2002167565A JP 2002167565 A JP2002167565 A JP 2002167565A JP 2004014869 A5 JP2004014869 A5 JP 2004014869A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- wafer
- supply nozzle
- cleaning
- developer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 description 152
- 239000000758 substrate Substances 0.000 description 109
- 239000000243 solution Substances 0.000 description 95
- 239000007788 liquid Substances 0.000 description 80
- 235000012431 wafers Nutrition 0.000 description 80
- 238000011161 development Methods 0.000 description 38
- 238000012545 processing Methods 0.000 description 25
- 238000000034 method Methods 0.000 description 18
- 230000007547 defect Effects 0.000 description 17
- 230000000694 effects Effects 0.000 description 15
- 238000005406 washing Methods 0.000 description 14
- 238000002347 injection Methods 0.000 description 9
- 239000007924 injection Substances 0.000 description 9
- 238000012546 transfer Methods 0.000 description 8
- 238000000576 coating method Methods 0.000 description 7
- 238000003672 processing method Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000004090 dissolution Methods 0.000 description 6
- 238000000926 separation method Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000003068 static effect Effects 0.000 description 5
- 238000007599 discharging Methods 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XCWPUUGSGHNIDZ-UHFFFAOYSA-N Oxypertine Chemical compound C1=2C=C(OC)C(OC)=CC=2NC(C)=C1CCN(CC1)CCN1C1=CC=CC=C1 XCWPUUGSGHNIDZ-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 101150038956 cup-4 gene Proteins 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002167565A JP4194302B2 (ja) | 2002-06-07 | 2002-06-07 | 現像装置及び現像処理方法 |
| US10/515,635 US7387455B2 (en) | 2002-06-07 | 2003-05-16 | Substrate processing device, substrate processing method, and developing device |
| KR1020047009165A KR100935286B1 (ko) | 2002-06-07 | 2003-05-16 | 기판처리장치 및 현상장치 |
| KR1020097018280A KR100959740B1 (ko) | 2002-06-07 | 2003-05-16 | 기판처리장치 |
| PCT/JP2003/006149 WO2003105201A1 (ja) | 2002-06-07 | 2003-05-16 | 基板処理装置、基板処理方法及び現像装置 |
| AU2003234811A AU2003234811A1 (en) | 2002-06-07 | 2003-05-16 | Substrate processing device, substrate processing method, and developing device |
| TW092114445A TWI253098B (en) | 2002-06-07 | 2003-05-28 | Substrate processing apparatus, substrate processing method and developing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002167565A JP4194302B2 (ja) | 2002-06-07 | 2002-06-07 | 現像装置及び現像処理方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004014869A JP2004014869A (ja) | 2004-01-15 |
| JP2004014869A5 true JP2004014869A5 (enExample) | 2005-05-26 |
| JP4194302B2 JP4194302B2 (ja) | 2008-12-10 |
Family
ID=30434773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002167565A Expired - Fee Related JP4194302B2 (ja) | 2002-06-07 | 2002-06-07 | 現像装置及び現像処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4194302B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4410076B2 (ja) | 2004-10-07 | 2010-02-03 | 東京エレクトロン株式会社 | 現像処理装置 |
| JP4641964B2 (ja) | 2006-03-30 | 2011-03-02 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
| JP4937772B2 (ja) * | 2007-01-22 | 2012-05-23 | 東京エレクトロン株式会社 | 基板の処理方法 |
| JP5742843B2 (ja) * | 2010-07-09 | 2015-07-01 | 住友ベークライト株式会社 | 硬化膜形成方法 |
-
2002
- 2002-06-07 JP JP2002167565A patent/JP4194302B2/ja not_active Expired - Fee Related
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