JP5043226B1 - 光硬化型導電性インク用組成物 - Google Patents
光硬化型導電性インク用組成物 Download PDFInfo
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- JP5043226B1 JP5043226B1 JP2011237159A JP2011237159A JP5043226B1 JP 5043226 B1 JP5043226 B1 JP 5043226B1 JP 2011237159 A JP2011237159 A JP 2011237159A JP 2011237159 A JP2011237159 A JP 2011237159A JP 5043226 B1 JP5043226 B1 JP 5043226B1
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- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 13
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- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
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- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 2
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- PRBBFHSSJFGXJS-UHFFFAOYSA-N (2,2-dimethyl-3-prop-2-enoyloxypropyl) prop-2-enoate;3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)C(O)=O.C=CC(=O)OCC(C)(C)COC(=O)C=C PRBBFHSSJFGXJS-UHFFFAOYSA-N 0.000 description 1
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- XRMBQHTWUBGQDN-UHFFFAOYSA-N [2-[2,2-bis(prop-2-enoyloxymethyl)butoxymethyl]-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CC)COCC(CC)(COC(=O)C=C)COC(=O)C=C XRMBQHTWUBGQDN-UHFFFAOYSA-N 0.000 description 1
- KNSXNCFKSZZHEA-UHFFFAOYSA-N [3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical class C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C KNSXNCFKSZZHEA-UHFFFAOYSA-N 0.000 description 1
- DBHQYYNDKZDVTN-UHFFFAOYSA-N [4-(4-methylphenyl)sulfanylphenyl]-phenylmethanone Chemical compound C1=CC(C)=CC=C1SC1=CC=C(C(=O)C=2C=CC=CC=2)C=C1 DBHQYYNDKZDVTN-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 238000007774 anilox coating Methods 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 1
- 235000013361 beverage Nutrition 0.000 description 1
- VYHBFRJRBHMIQZ-UHFFFAOYSA-N bis[4-(diethylamino)phenyl]methanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=C(N(CC)CC)C=C1 VYHBFRJRBHMIQZ-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- 238000006356 dehydrogenation reaction Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- 239000004815 dispersion polymer Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 239000000374 eutectic mixture Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 150000002513 isocyanates Chemical group 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- MDYPDLBFDATSCF-UHFFFAOYSA-N nonyl prop-2-enoate Chemical compound CCCCCCCCCOC(=O)C=C MDYPDLBFDATSCF-UHFFFAOYSA-N 0.000 description 1
- FSAJWMJJORKPKS-UHFFFAOYSA-N octadecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C=C FSAJWMJJORKPKS-UHFFFAOYSA-N 0.000 description 1
- 229940065472 octyl acrylate Drugs 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- FZUGPQWGEGAKET-UHFFFAOYSA-N parbenate Chemical compound CCOC(=O)C1=CC=C(N(C)C)C=C1 FZUGPQWGEGAKET-UHFFFAOYSA-N 0.000 description 1
- ULDDEWDFUNBUCM-UHFFFAOYSA-N pentyl prop-2-enoate Chemical compound CCCCCOC(=O)C=C ULDDEWDFUNBUCM-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical compound C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 230000001443 photoexcitation Effects 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 150000003077 polyols Chemical group 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000012855 volatile organic compound Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Conductive Materials (AREA)
Abstract
【解決手段】(A)ウレタンアクリレート類のオリゴマー、(B)四官能のアクリレート類、三官能のアクリレート類、二官能のアクリレート類、及び一官能のアクリレート類から選択される少なくとも3種のアクリレート類、(C)導電性フィラー、(D)2種以上の光重合開始剤、及び(E)高分子分散剤を含有し、(C)導電性フィラーの配合量が、該光硬化型導電性インク用組成物の総質量に対して77〜85質量%であり、(C)導電性フィラーの80質量%以上が、鱗片状、箔状、あるいはフレーク状であって、粒度分布50%粒径が5μmを超える銀粉である光硬化型導電性インク用組成物。
【選択図】なし
Description
このような高速印刷方法に利用することができ、また、硬化した後に高い導電性を示す導電性インクが多数開発されている。たとえば、特許文献1には、フレキソ印刷やロートグラビア印刷などに適した導電性インクとして、ウレタンアクリレート類などの1以上のオリゴマー、ジアクリレートやトリアクリレートなどの1以上のアクリレートキャリヤー、ビニルエーテル類などの1以上の反応性モノマー、フレーク状銀粉などの1以上の伝導性充填材、および1以上の光開始剤を含む組成物が開示されている。
また、特許文献2には、フレキソ印刷やスクリーン印刷に適した導電性インクとして、導電性粉末と、活性エネルギー線硬化型樹脂と、希釈剤とを必須成分として含有する活性エネルギー線硬化型導電性インキ組成物であって、前記活性エネルギー線硬化型樹脂が多官能ウレタンアクリレートからなることを特徴とする活性エネルギー線硬化型導電性インキ組成物が開示されている。
さらに、特許文献3には、フレキソ印刷、グラビア印刷、グラビアオフセット印刷などに適した導電性インクとして、平均粒子径0.001〜0.10μmの導電性微粒子(A)と、平均粒子径または平均円相当径0.5〜10μmの導電性粉末(B)とを含み、フレーク状、鱗片状、板状、球状、または箔状である導電性物質と、塩化ビニル/酢酸ビニル/(メタ)アクリル酸ヒドロキシアルキル共重合体樹脂とを含む導電性インクが開示されている。
すなわち、本発明は、
(A)ウレタンアクリレート類のオリゴマー、
(B)四官能のアクリレート類、三官能のアクリレート類、二官能のアクリレート類、及び一官能のアクリレート類から選択される少なくとも3種のアクリレート類、
(C)導電性フィラー、
(D)2種以上の光重合開始剤、及び
(E)高分子分散剤、を含有する光硬化型導電性インク用組成物であって、
(C)導電性フィラーの配合量が、該光硬化型導電性インク用組成物の総質量に対して77〜85質量%であり、
(C)導電性フィラーの80質量%以上が、鱗片状、箔状、あるいはフレーク状であって、粒度分布50%粒径が5μmを超える銀粉であることを特徴とする光硬化型導電性インク用組成物である。
(A)成分は、ウレタンアクリレート類のオリゴマーであり、その基本構造は、分子鎖の中央部に位置するソフトセグメント(ポリオール部分)と、その両端に位置するハードセグメント(アクリレート部分とイソシアネート部分)により構成される。(A)ウレタンアクリレート類のオリゴマーは、(B)成分のアクリレートモノマーとともに架橋高分子網状構造を形成し、基材との密着性に優れた、柔軟で強靭な膜を形成する。また、本発明は、(A)成分及び(B)成分の組み合わせを採用したことにより、(C)導電性フィラーの配合量が多いにもかかわらず、低粘度を維持することができ、光重合反応が妨げられず、これにより良好な印刷性、印刷精度、高速印刷性、さらには安定した導電性を得ることができる。
また、(B)アクリレート類が、四官能のアクリレート類、三官能のアクリレート類、二官能のアクリレート類、及び一官能のアクリレート類で構成される場合、密着性・柔軟性の点からは、四官能のアクリレート類と三官能のアクリレート類の合計量は、(B)アクリレート類の総質量に対して、2〜6質量%とすることが好ましく、3〜5質量%とすることがより好ましい。
前述した光重合開始剤のうち、好ましい光重合開始剤の組み合わせは、1−ヒドロキシシクロヘキシルフェニルケトン、ビス(2,4,6−トリメチルベンゾイル)―フェニルフォスフィンオキシド、2−メチル−1−(4−メチルチオフェニル)−2−モルフォリノプロパン−1−オン、ベンゾフェノン、及び2,4−ジエチルチオキサントンから選択される少なくとも2種の組み合わせであり、これらの組み合わせによれば、特に良好な印刷性、印刷精度、高速印刷性を得ることが可能となる。
(光硬化型導電性インク用組成物の作製)
表1に記載各材料を予備混練した後、三本ロールにて混練し、表1に示す組成の光硬化型導電性インク用組成物を作製した(各材料の数値は当該組成物の総質量に対する質量%を表す。)。使用した材料は下記のとおりである。
[導電性フィラー]
・フレーク状銀粉(粒度分布(PSD)50%粒径6.8μm、田中貴金属工業(株)製)
・フレーク状銀粉(粒度分布(PSD)50%粒径2.6μm、田中貴金属工業(株)製)
・球状銀粉(粒度分布(PSD)50%粒径1.3μm、田中貴金属工業(株)製)
[ウレタンアクリレート類のオリゴマー]
・ アロニックスM−1960(東亞合成(株)製、製品名)
[四官能のアクリレート類]
・ライトアクリレートDGE−4A(エチレンオキサイド変性ジグリセリンテトラアクリレート、共栄社化学(株)製、製品名)
[三官能のアクリレート類]
・アロニックスM−350(トリメチロールプロパンエチレンオキサイド変性トリアクリレート、東亞合成(株)製、製品名)
[二官能のアクリレート類]
・ライトアクリレート1.6HX−A(1,6−ヘキサンジオールジアクリレート、共栄社化学(株)製、製品名)
・ライトアクリレート1.9ND−A(1,9−ノナンジオールジアクリレート、共栄社化学(株)製、製品名)
[一官能のアクリレート類]
・ライトアクリレートPO−A(フェノキシエチルアクリレート、共栄社化学(株)製、製品名)
・ライトエステルHOP−A(N)(2−ヒドロキシプロピルアクリレート、共栄社化学(株)製、製品名)
[光重合開始剤]
・イルガキュア500(イルガキュア184(1−ヒドロキシシクロヘキシルフェニルケトン、製品名)とベンゾフェノン(増感剤)との共融混合物、チバ・スペシャリティ・ケミカルズ(株)社製、製品名)
・イルガキュア819(ビス(2,4,6−トリメチルベンゾイル)−フェニルフォスフィンオキサイド、チバ・スペシャリティ・ケミカルズ(株)社製、製品名)
・イルガキュア907(2−メチル−1−(4−メチルチオフェニル)−2−モルフォリノプロパン−1−オン、チバ・スペシャリティ・ケミカルズ(株)社製、製品名)
・カヤキュア DETX−S(2,4−ジエチルチオキサントン、日本化薬(株)社製、製品名)
[高分子分散剤]
・DisperBYK−111(酸性の吸着基を含む共重合体、ビックケミー・ジャパン(株)社製、製品名)
上記作製した光硬化型導電性インク用組成物について物性及び機能性の評価を行った。
[粘度及びTI値]
円錐型回転粘度計(HAAKE社製、Rheostress RS75、コーンプレート:チタン製 35mm、φ1°、ギャップ0.050mmにて測定)にて、測定温度25℃、シェアレート 0/sで30秒間保持後、シェアレート10/sで60秒間保持し、粘度を測定した。結果を表2に示す。
また、チクソトロピー指数(TI)値は、前記の粘度測定値と、同様にシェアレート1/sで測定された値から下記式にて算出した。結果を表2に示す。
TI値=(シェアレート10/sの粘度)÷(シェアレート1/sの粘度)
上記粘度の値が8以下であって、かつ、TI値が6以下であれば、フレキソ印刷において良好な印刷性、印刷精度を得やすい。
UV硬化型フレキソ印刷機(RK Print Coat Instruments Ltd.UK、商品名フレキシプループ):アニロックスロール500線/インチでポリビニルクロライドフィルム又はPETフィルムに、幅500μmの導電回路パターンをフレキソ印刷し、光活性線としてUV(300mJ/cm2)を用い20m/分の速度で照射し硬化させ、硬化後の膜厚、抵抗値、印刷性について評価した。
膜厚は膜厚測定器デジタルマイクロメーター(ミツトヨ株式会社製、商品名)で測定し、体積抵抗率は抵抗器ミリオームハイテスタ3540(製品名、HIOKI社製)を使用して測定した。また、印刷性は目視により、転写ミスや擦れの有無を確認し、有るものを不良、無いものを良好と評価した。結果を表2に示す。
Claims (4)
- (A)ウレタンアクリレート類のオリゴマー、
(B)四官能のアクリレート類または三官能のアクリレート類の何れか一つ、二官能のアクリレート類、及び一官能のアクリレート類からなる3種のアクリレート類、
(C)導電性フィラー、
(D)1−ヒドロキシシクロヘキシルフェニルケトン、ビス(2,4,6−トリメチルベンゾイル)―フェニルフォスフィンオキシド、2−メチル−1−(4−メチルチオフェニル)−2−モルフォリノプロパン−1−オン、ベンゾフェノン、及び2,4−ジエチルチオキサントンから選択される2種以上の光重合開始剤、及び
(E)高分子分散剤、を含有する光硬化型導電性インク用組成物であって、
(C)導電性フィラーの配合量が、該光硬化型導電性インク用組成物の総質量に対して77〜85質量%であり、
(C)導電性フィラーの80質量%以上が、鱗片状、箔状、あるいはフレーク状であって、粒度分布50%粒径が5μmを超える銀粉であることを特徴とする光硬化型導電性インク用組成物。 - 光硬化型導電性インク用組成物の総質量に対して、(A)ウレタンアクリレート類のオリゴマーの配合量が2〜5質量%、(D)光重合開始剤の配合量が0.5〜3.0質量%、(E)高分子分散剤の配合量が0.01〜0.5質量%である請求項1に記載の光硬化型導電性インク用組成物。
- (E)高分子分散剤が、酸性の吸着基を有する高分子分散剤である請求項1に記載の光硬化型導電性インク用組成物。
- 基材上に、請求項1〜3のいずれか1項に記載の光硬化型導電性インク用組成物を用いて印刷された包装体。
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SG11201401852XA SG11201401852XA (en) | 2011-10-28 | 2012-10-24 | Photocurable electroconductive ink composition |
CN201280053131.5A CN103930496B (zh) | 2011-10-28 | 2012-10-24 | 光固化型导电性油墨用组合物 |
KR1020147013834A KR101576759B1 (ko) | 2011-10-28 | 2012-10-24 | 광경화형 도전성 잉크용 조성물 |
PCT/JP2012/077399 WO2013061980A1 (ja) | 2011-10-28 | 2012-10-24 | 光硬化型導電性インク用組成物 |
EP12843350.5A EP2772518B1 (en) | 2011-10-28 | 2012-10-24 | Photocurable electroconductive ink composition |
US14/354,736 US9668343B2 (en) | 2011-10-28 | 2012-10-24 | Photocurable electroconductive ink composition |
TW101139710A TWI540189B (zh) | 2011-10-28 | 2012-10-26 | And a composition for photohardenable conductive ink |
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Cited By (3)
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JP2014088532A (ja) * | 2012-10-31 | 2014-05-15 | Seiren Co Ltd | グラビアオフセット印刷用インク |
JP2014177600A (ja) * | 2013-03-15 | 2014-09-25 | Ricoh Co Ltd | 分散剤及びその製造方法 |
JP2014185316A (ja) * | 2013-03-22 | 2014-10-02 | Eturbotouch Technology Corp | タッチパネルに用いられる光硬化型導電性接着剤 |
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KR101567924B1 (ko) | 2013-12-23 | 2015-11-20 | 조광페인트주식회사 | 무광 도료 조성물 및 이를 이용한 코팅 방법 |
JP6243251B2 (ja) * | 2014-02-20 | 2017-12-06 | Dicグラフィックス株式会社 | 活性エネルギー線硬化型オフセットインキ組成物 |
JP6309842B2 (ja) * | 2014-07-03 | 2018-04-11 | 田中貴金属工業株式会社 | 光硬化型導電性インク組成物 |
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US10647857B2 (en) * | 2015-01-14 | 2020-05-12 | Xilico, LLC | Method and resins for creating electrically-conductive objects |
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JP2014088532A (ja) * | 2012-10-31 | 2014-05-15 | Seiren Co Ltd | グラビアオフセット印刷用インク |
JP2014177600A (ja) * | 2013-03-15 | 2014-09-25 | Ricoh Co Ltd | 分散剤及びその製造方法 |
JP2014185316A (ja) * | 2013-03-22 | 2014-10-02 | Eturbotouch Technology Corp | タッチパネルに用いられる光硬化型導電性接着剤 |
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CN103930496B (zh) | 2015-11-25 |
KR101576759B1 (ko) | 2015-12-10 |
CN103930496A (zh) | 2014-07-16 |
EP2772518A4 (en) | 2015-10-21 |
TWI540189B (zh) | 2016-07-01 |
EP2772518A1 (en) | 2014-09-03 |
KR20140092847A (ko) | 2014-07-24 |
US20140311779A1 (en) | 2014-10-23 |
WO2013061980A1 (ja) | 2013-05-02 |
US9668343B2 (en) | 2017-05-30 |
TW201336941A (zh) | 2013-09-16 |
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SG11201401852XA (en) | 2014-09-26 |
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