JP5040247B2 - 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法 - Google Patents

半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法 Download PDF

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Publication number
JP5040247B2
JP5040247B2 JP2006274833A JP2006274833A JP5040247B2 JP 5040247 B2 JP5040247 B2 JP 5040247B2 JP 2006274833 A JP2006274833 A JP 2006274833A JP 2006274833 A JP2006274833 A JP 2006274833A JP 5040247 B2 JP5040247 B2 JP 5040247B2
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semiconductor
group
adhesive composition
epoxy
adhesive
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JP2006274833A
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JP2008094870A (ja
JP2008094870A5 (https=
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敏央 野中
浩一 藤丸
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Toray Industries Inc
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Toray Industries Inc
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  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
JP2006274833A 2006-10-06 2006-10-06 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法 Expired - Fee Related JP5040247B2 (ja)

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JP2006274833A JP5040247B2 (ja) 2006-10-06 2006-10-06 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法

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JP2006274833A JP5040247B2 (ja) 2006-10-06 2006-10-06 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法

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JP2008094870A JP2008094870A (ja) 2008-04-24
JP2008094870A5 JP2008094870A5 (https=) 2009-11-19
JP5040247B2 true JP5040247B2 (ja) 2012-10-03

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10703945B2 (en) 2018-04-25 2020-07-07 Daxin Materials Corporation Method for temporary bonding workpiece and adhesive

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5422878B2 (ja) * 2006-10-24 2014-02-19 東レ株式会社 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法
KR101485612B1 (ko) * 2008-04-25 2015-01-22 신에쓰 가가꾸 고교 가부시끼가이샤 반도체 웨이퍼용 보호 필름
KR101075192B1 (ko) * 2009-03-03 2011-10-21 도레이첨단소재 주식회사 전자부품 제조용 점착테이프
MY160024A (en) 2009-07-10 2017-02-15 Toray Industries Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing these
WO2012073851A1 (ja) * 2010-12-01 2012-06-07 東レ株式会社 接着剤組成物、接着剤シートおよびこれらを用いた半導体装置
DE102011100608B4 (de) 2011-03-03 2024-03-28 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Suspension zum Schutz eines Halbleitermaterials und Verfahren zur Herstellung eines Halbleiterkörpers
JP2013153012A (ja) * 2012-01-24 2013-08-08 Murata Mfg Co Ltd 電子部品モジュールの製造方法
EP2832792A4 (en) * 2012-03-30 2015-11-18 Tokuyama Corp HARDENABLE RESIN COMPOSITION, METHOD FOR THE MANUFACTURE THEREOF, HIGH-CIRCULAR RESIN COMPOSITION, AND HIGH-WELDING MULTILAYER SUBSTRATE
US9591768B2 (en) 2012-12-27 2017-03-07 Toray Industries, Inc. Adhesive agent having a polyimide and acid modified rosin
KR20150118094A (ko) * 2013-02-13 2015-10-21 가부시키가이샤 도쿠야마 수지 조성물 및 그의 제조 방법, 고열전도성 수지 성형체
JP6716939B2 (ja) * 2016-02-16 2020-07-01 東レ株式会社 接着剤、それからなる接着フィルム、それらの硬化物を含む半導体装置およびその製造方法
CN105925221A (zh) * 2016-05-06 2016-09-07 金宝丽科技（苏州）有限公司 一种高附着性的导热胶及其制备方法
WO2021200553A1 (ja) * 2020-04-01 2021-10-07 昭和電工マテリアルズ株式会社 半導体用接着剤、並びに、半導体装置及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006144022A (ja) * 2002-06-26 2006-06-08 Hitachi Chem Co Ltd フィルム状接着剤、接着シート及び半導体装置
JP2004211053A (ja) * 2002-06-26 2004-07-29 Hitachi Chem Co Ltd フィルム状接着剤、接着シート及び半導体装置
JP2004319823A (ja) * 2003-04-17 2004-11-11 Sumitomo Bakelite Co Ltd 半導体用接着フィルム、半導体装置、及び半導体装置の製造方法。
JP4390720B2 (ja) * 2004-02-23 2009-12-24 株式会社日本触媒 熱伝導性組成物及び熱伝導性フィルム
JP4275584B2 (ja) * 2004-07-05 2009-06-10 出光興産株式会社 電子写真感光体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10703945B2 (en) 2018-04-25 2020-07-07 Daxin Materials Corporation Method for temporary bonding workpiece and adhesive

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