JP5040247B2 - 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法 - Google Patents

半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法 Download PDF

Info

Publication number
JP5040247B2
JP5040247B2 JP2006274833A JP2006274833A JP5040247B2 JP 5040247 B2 JP5040247 B2 JP 5040247B2 JP 2006274833 A JP2006274833 A JP 2006274833A JP 2006274833 A JP2006274833 A JP 2006274833A JP 5040247 B2 JP5040247 B2 JP 5040247B2
Authority
JP
Japan
Prior art keywords
semiconductor
group
adhesive composition
epoxy
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006274833A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008094870A5 (enExample
JP2008094870A (ja
Inventor
敏央 野中
浩一 藤丸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP2006274833A priority Critical patent/JP5040247B2/ja
Publication of JP2008094870A publication Critical patent/JP2008094870A/ja
Publication of JP2008094870A5 publication Critical patent/JP2008094870A5/ja
Application granted granted Critical
Publication of JP5040247B2 publication Critical patent/JP5040247B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Die Bonding (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP2006274833A 2006-10-06 2006-10-06 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法 Expired - Fee Related JP5040247B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006274833A JP5040247B2 (ja) 2006-10-06 2006-10-06 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006274833A JP5040247B2 (ja) 2006-10-06 2006-10-06 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2008094870A JP2008094870A (ja) 2008-04-24
JP2008094870A5 JP2008094870A5 (enExample) 2009-11-19
JP5040247B2 true JP5040247B2 (ja) 2012-10-03

Family

ID=39378070

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006274833A Expired - Fee Related JP5040247B2 (ja) 2006-10-06 2006-10-06 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP5040247B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10703945B2 (en) 2018-04-25 2020-07-07 Daxin Materials Corporation Method for temporary bonding workpiece and adhesive

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5422878B2 (ja) * 2006-10-24 2014-02-19 東レ株式会社 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法
KR101485612B1 (ko) * 2008-04-25 2015-01-22 신에쓰 가가꾸 고교 가부시끼가이샤 반도체 웨이퍼용 보호 필름
KR101075192B1 (ko) * 2009-03-03 2011-10-21 도레이첨단소재 주식회사 전자부품 제조용 점착테이프
SG177608A1 (en) * 2009-07-10 2012-02-28 Toray Industries Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing these
KR101957532B1 (ko) * 2010-12-01 2019-03-12 도레이 카부시키가이샤 접착제 조성물, 접착제 시트 및 이들을 사용한 반도체 장치
DE102011100608B4 (de) 2011-03-03 2024-03-28 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Suspension zum Schutz eines Halbleitermaterials und Verfahren zur Herstellung eines Halbleiterkörpers
JP2013153012A (ja) * 2012-01-24 2013-08-08 Murata Mfg Co Ltd 電子部品モジュールの製造方法
JP6192635B2 (ja) * 2012-03-30 2017-09-06 株式会社トクヤマ 硬化性樹脂組成物及びその製造方法、高熱伝導性樹脂組成物及び高熱伝導性積層基板
EP2940094A4 (en) * 2012-12-27 2016-08-10 Toray Industries ADHESIVE, ADHESIVE AND SEMICONDUCTOR ELEMENT AND METHOD FOR THE PRODUCTION THEREOF
KR20150118094A (ko) * 2013-02-13 2015-10-21 가부시키가이샤 도쿠야마 수지 조성물 및 그의 제조 방법, 고열전도성 수지 성형체
JP6716939B2 (ja) * 2016-02-16 2020-07-01 東レ株式会社 接着剤、それからなる接着フィルム、それらの硬化物を含む半導体装置およびその製造方法
CN105925221A (zh) * 2016-05-06 2016-09-07 金宝丽科技（苏州）有限公司 一种高附着性的导热胶及其制备方法
WO2021200553A1 (ja) * 2020-04-01 2021-10-07 昭和電工マテリアルズ株式会社 半導体用接着剤、並びに、半導体装置及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006144022A (ja) * 2002-06-26 2006-06-08 Hitachi Chem Co Ltd フィルム状接着剤、接着シート及び半導体装置
JP2004211053A (ja) * 2002-06-26 2004-07-29 Hitachi Chem Co Ltd フィルム状接着剤、接着シート及び半導体装置
JP2004319823A (ja) * 2003-04-17 2004-11-11 Sumitomo Bakelite Co Ltd 半導体用接着フィルム、半導体装置、及び半導体装置の製造方法。
JP4390720B2 (ja) * 2004-02-23 2009-12-24 株式会社日本触媒 熱伝導性組成物及び熱伝導性フィルム
JP4275584B2 (ja) * 2004-07-05 2009-06-10 出光興産株式会社 電子写真感光体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10703945B2 (en) 2018-04-25 2020-07-07 Daxin Materials Corporation Method for temporary bonding workpiece and adhesive

Also Published As

Publication number Publication date
JP2008094870A (ja) 2008-04-24

Similar Documents

Publication Publication Date Title
JP3995022B2 (ja) 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法
JP5422878B2 (ja) 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法
KR101635659B1 (ko) 접착 조성물, 접착 시트, 이들을 이용한 회로 기판 및 반도체 장치 및 이들의 제조 방법
CN104870595B (zh) 粘合剂、粘合膜、半导体器件及其制造方法
JP5141366B2 (ja) 半導体用接着フィルムおよびこれを用いた半導体装置の製造方法
JP6040935B2 (ja) 樹脂組成物、樹脂組成物シート、半導体装置およびその製造方法
JP5040247B2 (ja) 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法
TWI608066B (zh) 樹脂組成物、樹脂片及其製造方法、以及半導體裝置的製造方法
JP5130939B2 (ja) 半導体用接着組成物およびそれを用いた半導体装置の製造方法
JP6112013B2 (ja) バンプ電極付き半導体装置製造用接着剤シートおよび半導体装置の製造方法
JP5292793B2 (ja) 半導体用接着シート、それを用いた半導体装置および半導体装置の製造方法
JP5040252B2 (ja) 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法。
JP6716939B2 (ja) 接着剤、それからなる接着フィルム、それらの硬化物を含む半導体装置およびその製造方法
JP5103870B2 (ja) 半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法
JP2009021562A (ja) 半導体用接着シート、それを用いた半導体装置および半導体装置の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20091006

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20091006

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120215

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120228

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120411

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120612

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120625

R151 Written notification of patent or utility model registration

Ref document number: 5040247

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150720

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees