JP5020820B2 - カラーフィルタ基板の製造方法及びカラーフィルタ突起修正装置 - Google Patents
カラーフィルタ基板の製造方法及びカラーフィルタ突起修正装置 Download PDFInfo
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- JP5020820B2 JP5020820B2 JP2007529478A JP2007529478A JP5020820B2 JP 5020820 B2 JP5020820 B2 JP 5020820B2 JP 2007529478 A JP2007529478 A JP 2007529478A JP 2007529478 A JP2007529478 A JP 2007529478A JP 5020820 B2 JP5020820 B2 JP 5020820B2
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- 239000000758 substrate Substances 0.000 title claims description 79
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 238000012545 processing Methods 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 25
- 125000006850 spacer group Chemical group 0.000 claims description 19
- 230000003287 optical effect Effects 0.000 claims description 18
- 238000012937 correction Methods 0.000 claims description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 22
- 230000007547 defect Effects 0.000 description 10
- 239000013078 crystal Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 210000004027 cell Anatomy 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- XBJJRSFLZVLCSE-UHFFFAOYSA-N barium(2+);diborate Chemical compound [Ba+2].[Ba+2].[Ba+2].[O-]B([O-])[O-].[O-]B([O-])[O-] XBJJRSFLZVLCSE-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 210000002858 crystal cell Anatomy 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 241000135309 Processus Species 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- VCZFPTGOQQOZGI-UHFFFAOYSA-N lithium bis(oxoboranyloxy)borinate Chemical compound [Li+].[O-]B(OB=O)OB=O VCZFPTGOQQOZGI-UHFFFAOYSA-N 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
- G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Manufacturing & Machinery (AREA)
- Optical Filters (AREA)
- Liquid Crystal (AREA)
- Laser Beam Processing (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
2:カラーフィルタ用透明基板
3:3−1,3−2,3−3 カラーフィルタ
4−1:ブラックマトリックス
4−2:スペーサ
5:透明ガラス基板
6:画素制御用のトランジスタ
7−1:ゲート走査線
7−2:蓄積容量線
8、23:突起
8−1:被除去突起
8−2:残存突起
9:スペーサ高さ
10:突起高さ
14、27:切除面
16:ビームウエスト
17、19:ビーム
18:高NA集光レンズ
20、21:ビーム方向
22:ビームウエスト位置
24:XYステージ
25:ステージ台
26:軌跡
27:切除面
28:段差
29:突起頂上
30:模擬突起
100:カラーフィルタ基板
220:TFT基板
210:液晶
ビームを走査するには、ステージを移動させる方法以外に、ガルバノミラーを用いてビームを図4に示されたようなジグザグ状に動かす方法を用いてもよい。
Claims (11)
- カラーフィルタ基板の基板表面から突出する突起部を除去することを含むカラーフィルタ基板の製造方法であって、高NA集光レンズによる短加工焦点深度集光ビームを基板表面に平行に走査して、該ビームを基板表面に照射し、前記突起部に対しては基板表面に形成されたスペーサより低い所定の高さまで前記突起部を除去するのに必要なフルエンスを与えて、前記突起部を前記スペーサより低くなるように前記突起部を部分的に除去する工程を含むカラーフィルタ基板の製造方法。
- 前記ビームは基本波の高調波である請求項1に記載のカラーフィルタ基板の製造方法。
- 前記ビームは基本波の第2高調波である請求項1に記載のカラーフィルタ基板の製造方法。
- 突起部の表面近傍にビームウエストがくるように短加工焦点深度集光ビームを設定する請求項1ないし3のいずれかに記載のカラーフィルタ基板の製造方法。
- 突起部の平面形状を検出し、前記平面形状を含む一定の範囲だけを走査する請求項1ないし4のいずれかに記載のカラーフィルタ基板の製造方法。
- 絞り込んだ光束あるいは開口の結像を走査する、請求項1ないし5のいずれかに記載のカラーフィルタ基板の製造方法。
- レーザの波長が560nm以下である請求項1ないし6のいずれかに記載のカラーフィルタ基板の製造方法。
- レーザの波長が390nm以下である請求項1ないし6のいずれかに記載のカラーフィルタ基板の製造方法。
- レーザのパルス幅が1×10 −12 秒以下である請求項1ないし8のいずれかに記載のカラーフィルタ基板の製造方法。
- レーザ光発生手段、前記レーザ光発生手段により発生したレーザ光を短加工焦点深度の収束ビームに変換する高NA集光レンズ、及び前記収束ビームを被処理物体であるカラーフィルタ基板の表面に平行な方向に相対的に走査をする相対的移動手段を有し、
前記収束ビームをカラーフィルタ基板の基板表面に平行に走査して、前記収束ビームを基板表面に照射し、基板表面から突出する突起部に対しては基板表面に形成されたスペーサより低い所定の高さまで前記突起部を除去するのに必要なフルエンスを与えて、前記突起部を前記スペーサより低くなるように前記突起部を部分的に除去することを特徴とするカラーフィルタ突起修正装置。 - 前記相対的走査手段が、ステージまたはガルバノミラー光学系であり、前記ステージの移動または前記ガルバノミラー光学系による前記短加工焦点深度の収束ビームの移動によって前記相対的走査がなされることを特徴とする請求項10記載のカラーフィルタ突起修正装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007529478A JP5020820B2 (ja) | 2005-08-05 | 2006-07-27 | カラーフィルタ基板の製造方法及びカラーフィルタ突起修正装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005228948 | 2005-08-05 | ||
JP2005228948 | 2005-08-05 | ||
JP2007529478A JP5020820B2 (ja) | 2005-08-05 | 2006-07-27 | カラーフィルタ基板の製造方法及びカラーフィルタ突起修正装置 |
PCT/JP2006/314829 WO2007018038A1 (ja) | 2005-08-05 | 2006-07-27 | 突起部除去工程を含む基板の製造方法並びにカラーフィルタ突起修正方法及び装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2007018038A1 JPWO2007018038A1 (ja) | 2009-02-19 |
JP5020820B2 true JP5020820B2 (ja) | 2012-09-05 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2007529478A Expired - Fee Related JP5020820B2 (ja) | 2005-08-05 | 2006-07-27 | カラーフィルタ基板の製造方法及びカラーフィルタ突起修正装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8124000B2 (ja) |
JP (1) | JP5020820B2 (ja) |
KR (1) | KR101250965B1 (ja) |
CN (1) | CN101248374A (ja) |
WO (1) | WO2007018038A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009008913A (ja) * | 2007-06-28 | 2009-01-15 | Ntn Corp | パターン修正装置および方法 |
JP2009009013A (ja) * | 2007-06-29 | 2009-01-15 | Toppan Printing Co Ltd | 欠陥修正方法及びそれを用いたlcd用カラーフィルタの製造方法並びにlcd用カラーフィルタ |
US10649497B2 (en) | 2014-07-23 | 2020-05-12 | Apple Inc. | Adaptive processes for improving integrity of surfaces |
WO2016014047A1 (en) * | 2014-07-23 | 2016-01-28 | Apple Inc. | Adaptive processes for improving integrity of surfaces |
CN110058439B (zh) * | 2019-05-20 | 2021-03-23 | 成都中电熊猫显示科技有限公司 | 彩色滤光片上的异物去除方法及设备 |
US20230302572A1 (en) * | 2022-03-22 | 2023-09-28 | Sodick Co., Ltd. | Laser processing method |
Citations (9)
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JPH04184301A (ja) * | 1990-11-19 | 1992-07-01 | Toshiba Corp | カラーフィルター基板の製造方法 |
JP2003001459A (ja) * | 2000-09-13 | 2003-01-08 | Hamamatsu Photonics Kk | レーザ加工装置 |
JP2003245784A (ja) * | 2002-02-21 | 2003-09-02 | Ricoh Co Ltd | レーザ加工方法、レーザ加工装置及び立体構造体 |
JP2003260581A (ja) * | 2002-03-08 | 2003-09-16 | Fujikura Ltd | レーザ加工方法およびレーザ加工装置 |
JP2003279722A (ja) * | 2002-03-26 | 2003-10-02 | Dainippon Printing Co Ltd | カラーフィルタの欠陥除去方法 |
JP2004230466A (ja) * | 2000-08-29 | 2004-08-19 | Mitsubishi Electric Corp | レーザ加工装置 |
JP2004325837A (ja) * | 2003-04-25 | 2004-11-18 | Toppan Printing Co Ltd | レーザー加工装置及びその装置を用いた修正方法によるカラーフィルタ基板 |
JP2005017486A (ja) * | 2003-06-24 | 2005-01-20 | Toppan Printing Co Ltd | 液晶表示装置用カラーフィルタの修正方法 |
JP2005107318A (ja) * | 2003-09-30 | 2005-04-21 | Dainippon Printing Co Ltd | カラーフィルタの製造方法およびカラーフィルタの欠陥除去装置 |
Family Cites Families (5)
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JP4215905B2 (ja) | 1999-02-15 | 2009-01-28 | シャープ株式会社 | 液晶表示装置 |
JP2003057428A (ja) | 2001-08-09 | 2003-02-26 | Toshiba Corp | カラーフィルタの修正方法 |
JP3891865B2 (ja) | 2002-02-07 | 2007-03-14 | 奇美電子股▲ふん▼有限公司 | 液晶表示装置及びそのカラーフィルタ基板 |
US7170030B2 (en) * | 2003-09-12 | 2007-01-30 | International Business Machines Corporation | Method and apparatus for repair of reflective photomasks |
US7547866B2 (en) * | 2004-04-28 | 2009-06-16 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation method and method for manufacturing semiconductor device including an autofocusing mechanism using the same |
-
2006
- 2006-07-27 WO PCT/JP2006/314829 patent/WO2007018038A1/ja active Application Filing
- 2006-07-27 CN CNA200680028846XA patent/CN101248374A/zh active Pending
- 2006-07-27 US US11/997,607 patent/US8124000B2/en not_active Expired - Fee Related
- 2006-07-27 KR KR1020087005265A patent/KR101250965B1/ko not_active IP Right Cessation
- 2006-07-27 JP JP2007529478A patent/JP5020820B2/ja not_active Expired - Fee Related
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH04184301A (ja) * | 1990-11-19 | 1992-07-01 | Toshiba Corp | カラーフィルター基板の製造方法 |
JP2004230466A (ja) * | 2000-08-29 | 2004-08-19 | Mitsubishi Electric Corp | レーザ加工装置 |
JP2003001459A (ja) * | 2000-09-13 | 2003-01-08 | Hamamatsu Photonics Kk | レーザ加工装置 |
JP2003245784A (ja) * | 2002-02-21 | 2003-09-02 | Ricoh Co Ltd | レーザ加工方法、レーザ加工装置及び立体構造体 |
JP2003260581A (ja) * | 2002-03-08 | 2003-09-16 | Fujikura Ltd | レーザ加工方法およびレーザ加工装置 |
JP2003279722A (ja) * | 2002-03-26 | 2003-10-02 | Dainippon Printing Co Ltd | カラーフィルタの欠陥除去方法 |
JP2004325837A (ja) * | 2003-04-25 | 2004-11-18 | Toppan Printing Co Ltd | レーザー加工装置及びその装置を用いた修正方法によるカラーフィルタ基板 |
JP2005017486A (ja) * | 2003-06-24 | 2005-01-20 | Toppan Printing Co Ltd | 液晶表示装置用カラーフィルタの修正方法 |
JP2005107318A (ja) * | 2003-09-30 | 2005-04-21 | Dainippon Printing Co Ltd | カラーフィルタの製造方法およびカラーフィルタの欠陥除去装置 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2007018038A1 (ja) | 2009-02-19 |
US20100219542A1 (en) | 2010-09-02 |
WO2007018038A1 (ja) | 2007-02-15 |
US8124000B2 (en) | 2012-02-28 |
CN101248374A (zh) | 2008-08-20 |
KR20080052571A (ko) | 2008-06-11 |
WO2007018038A9 (ja) | 2007-10-04 |
KR101250965B1 (ko) | 2013-04-04 |
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