JP5018752B2 - 導電材料、及び導電材料の製造方法 - Google Patents

導電材料、及び導電材料の製造方法 Download PDF

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Publication number
JP5018752B2
JP5018752B2 JP2008302037A JP2008302037A JP5018752B2 JP 5018752 B2 JP5018752 B2 JP 5018752B2 JP 2008302037 A JP2008302037 A JP 2008302037A JP 2008302037 A JP2008302037 A JP 2008302037A JP 5018752 B2 JP5018752 B2 JP 5018752B2
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Japan
Prior art keywords
conductive material
metal
conductive
intermetallic compound
conductive paste
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JP2008302037A
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Japanese (ja)
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JP2009081142A (ja
JP2009081142A5 (fr
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誠樹 作山
浩基 内田
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Fujitsu Ltd
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Fujitsu Ltd
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Publication of JP2009081142A5 publication Critical patent/JP2009081142A5/ja
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  • Manufacturing Of Printed Wiring (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
JP2008302037A 2008-11-27 2008-11-27 導電材料、及び導電材料の製造方法 Expired - Lifetime JP5018752B2 (ja)

Priority Applications (1)

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JP2008302037A JP5018752B2 (ja) 2008-11-27 2008-11-27 導電材料、及び導電材料の製造方法

Applications Claiming Priority (1)

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JP2008302037A JP5018752B2 (ja) 2008-11-27 2008-11-27 導電材料、及び導電材料の製造方法

Related Parent Applications (1)

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JP2005211992A Division JP4254757B2 (ja) 2005-07-22 2005-07-22 導電材料及び導電性ペースト及び基板

Related Child Applications (1)

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JP2011196862A Division JP5252050B2 (ja) 2011-09-09 2011-09-09 回路基板、及び回路基板の製造方法

Publications (3)

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JP2009081142A JP2009081142A (ja) 2009-04-16
JP2009081142A5 JP2009081142A5 (fr) 2011-10-27
JP5018752B2 true JP5018752B2 (ja) 2012-09-05

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JP2008302037A Expired - Lifetime JP5018752B2 (ja) 2008-11-27 2008-11-27 導電材料、及び導電材料の製造方法

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JP (1) JP5018752B2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016029398A1 (fr) 2014-08-28 2016-03-03 E.I. Du Pont De Nemours And Company Cellules solaires pourvues d'électrodes en cuivre
DE112014006907T5 (de) 2014-08-28 2017-06-08 E.I. Du Pont De Nemours And Company Kupfer enthaltende leitfähige Pasten und daraus hergestellte Elektroden
DE112014006910T5 (de) 2014-08-28 2017-05-18 E.I. Du Pont De Nemours And Company Kupferhaltige leitfähige Pasten und daraus hergestellte Elektroden

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61198507A (ja) * 1985-02-28 1986-09-02 日本鉱業株式会社 電子部品用複合材料及びその製造方法
JPH0287416A (ja) * 1988-09-22 1990-03-28 Fujikura Ltd 無酸素マグネシウム銅被覆ジルコニウム銅複合体
JPH0813424B2 (ja) * 1991-05-27 1996-02-14 住友軽金属工業株式会社 スポット溶接用電極
TW340132B (en) * 1994-10-20 1998-09-11 Ibm Structure for use as an electrical interconnection means and process for preparing the same
JP3721660B2 (ja) * 1996-10-18 2005-11-30 富士通株式会社 導電材料及び導電性ペースト

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JP2009081142A (ja) 2009-04-16

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