JP5013596B2 - 裏面実装型led - Google Patents
裏面実装型led Download PDFInfo
- Publication number
- JP5013596B2 JP5013596B2 JP2007038182A JP2007038182A JP5013596B2 JP 5013596 B2 JP5013596 B2 JP 5013596B2 JP 2007038182 A JP2007038182 A JP 2007038182A JP 2007038182 A JP2007038182 A JP 2007038182A JP 5013596 B2 JP5013596 B2 JP 5013596B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- base insulating
- substrate
- led
- mounted led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims description 60
- 239000011347 resin Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 12
- 239000002184 metal Substances 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 229910001111 Fine metal Inorganic materials 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000005336 cracking Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 101100008050 Caenorhabditis elegans cut-6 gene Proteins 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Description
2、3 電極パターン
2a、3a 上面電極部
2b、3b 下面電極部
4、5 スリット状の切れ目
6 LEDチップ
7 金属細線
8 透光性封止樹脂
9 実装側の基板
10 貫通孔
Claims (4)
- 表面に一対の電極パターンが形成された薄い平板状のベース絶縁基板と、該ベース絶縁基板に形成された上面電極パターンにLEDチップを実装し透光性樹脂で封止した裏面実装型LEDにおいて、前記ベース絶縁基板の上下面に形成された一対の電極パターンは、前記ベース絶縁基板の表裏の略全域が覆われるように形成され、上下面に形成されたスリット状の切れ目により対向配置され、前記裏面実装型LEDの封止樹脂部を埋設するように貫通穴が形成された実装側の基板に裏面実装していることを特徴とする裏面実装型LED。
- 前記ベース絶縁基板は、フレキシブル基板であることを特徴とする請求項1記載の裏面実装型LED。
- 前記ベース絶縁基板の上下面に形成された一対の電極パターンの切れ目の位置は、上面と下面でズレていることを特徴とする請求項1または2記載の裏面実装型LED。
- 前記ベース絶縁基板の上下面に形成された一対の電極パターンで、LEDチップを実装したダイボンド側から延びる下面電極パターン領域を広く形成したことを特徴とする請求項1から3のいずれか1項記載の裏面実装型LED。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007038182A JP5013596B2 (ja) | 2007-02-19 | 2007-02-19 | 裏面実装型led |
US12/033,480 US7816691B2 (en) | 2007-02-19 | 2008-02-19 | Light-emitting diode having a flexible substrate |
CN2008101277105A CN101320779B (zh) | 2007-02-19 | 2008-02-19 | 发光二极管 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007038182A JP5013596B2 (ja) | 2007-02-19 | 2007-02-19 | 裏面実装型led |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008205107A JP2008205107A (ja) | 2008-09-04 |
JP5013596B2 true JP5013596B2 (ja) | 2012-08-29 |
Family
ID=39714873
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007038182A Active JP5013596B2 (ja) | 2007-02-19 | 2007-02-19 | 裏面実装型led |
Country Status (3)
Country | Link |
---|---|
US (1) | US7816691B2 (ja) |
JP (1) | JP5013596B2 (ja) |
CN (1) | CN101320779B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5290543B2 (ja) * | 2007-07-20 | 2013-09-18 | スタンレー電気株式会社 | 発光装置 |
KR101804406B1 (ko) * | 2011-05-06 | 2017-12-04 | 엘지이노텍 주식회사 | 발광소자 패키지 및 이를 포함하는 조명시스템 |
KR101861631B1 (ko) * | 2011-05-24 | 2018-05-28 | 엘지이노텍 주식회사 | 발광소자 패키지 및 이를 포함하는 조명시스템 |
CN103123949A (zh) * | 2011-11-21 | 2013-05-29 | 展晶科技(深圳)有限公司 | 可挠式发光二极管封装结构及其制造方法 |
CN103700747B (zh) * | 2012-09-27 | 2017-08-22 | 展晶科技(深圳)有限公司 | 发光二极管及其制造方法 |
WO2017209143A1 (ja) | 2016-05-31 | 2017-12-07 | シチズン電子株式会社 | 発光装置およびその製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4082544B2 (ja) * | 1999-12-24 | 2008-04-30 | ローム株式会社 | 裏面実装チップ型発光装置 |
JP2001326390A (ja) | 2000-05-18 | 2001-11-22 | Rohm Co Ltd | 裏面発光チップ型発光素子およびそれに用いる絶縁性基板 |
JP2004127988A (ja) * | 2002-09-30 | 2004-04-22 | Toyoda Gosei Co Ltd | 白色発光装置 |
JP2004134414A (ja) * | 2002-10-04 | 2004-04-30 | Ultrastar Ltd | 表面実装発光ダイオードのパッケージ構造及び製造方法 |
JP2005064047A (ja) * | 2003-08-13 | 2005-03-10 | Citizen Electronics Co Ltd | 発光ダイオード |
JP2006186297A (ja) * | 2004-12-03 | 2006-07-13 | Toshiba Corp | 半導体発光装置及びその製造方法 |
JP2006269782A (ja) * | 2005-03-24 | 2006-10-05 | Citizen Electronics Co Ltd | 発光ダイオード |
JP2006269778A (ja) * | 2005-03-24 | 2006-10-05 | Nichia Chem Ind Ltd | 光学装置 |
JP4989867B2 (ja) | 2005-08-26 | 2012-08-01 | スタンレー電気株式会社 | 表面実装型led |
-
2007
- 2007-02-19 JP JP2007038182A patent/JP5013596B2/ja active Active
-
2008
- 2008-02-19 US US12/033,480 patent/US7816691B2/en active Active
- 2008-02-19 CN CN2008101277105A patent/CN101320779B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP2008205107A (ja) | 2008-09-04 |
CN101320779B (zh) | 2011-09-28 |
CN101320779A (zh) | 2008-12-10 |
US7816691B2 (en) | 2010-10-19 |
US20080203423A1 (en) | 2008-08-28 |
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