JP5002207B2 - パターンを有する構造体の製造方法 - Google Patents

パターンを有する構造体の製造方法 Download PDF

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Publication number
JP5002207B2
JP5002207B2 JP2006202802A JP2006202802A JP5002207B2 JP 5002207 B2 JP5002207 B2 JP 5002207B2 JP 2006202802 A JP2006202802 A JP 2006202802A JP 2006202802 A JP2006202802 A JP 2006202802A JP 5002207 B2 JP5002207 B2 JP 5002207B2
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Japan
Prior art keywords
pattern
stamper
manufacturing
forming
convex structure
Prior art date
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Expired - Fee Related
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JP2006202802A
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English (en)
Japanese (ja)
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JP2008034412A (ja
JP2008034412A5 (enExample
Inventor
彩 今田
透 田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
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Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2006202802A priority Critical patent/JP5002207B2/ja
Priority to US11/773,739 priority patent/US7976761B2/en
Priority to CN2007101391055A priority patent/CN101112789B/zh
Publication of JP2008034412A publication Critical patent/JP2008034412A/ja
Publication of JP2008034412A5 publication Critical patent/JP2008034412A5/ja
Application granted granted Critical
Publication of JP5002207B2 publication Critical patent/JP5002207B2/ja
Expired - Fee Related legal-status Critical Current
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023Microembossing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/84Manufacture, treatment, or detection of nanostructure
    • Y10S977/887Nanoimprint lithography, i.e. nanostamp

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Micromachines (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2006202802A 2006-07-26 2006-07-26 パターンを有する構造体の製造方法 Expired - Fee Related JP5002207B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006202802A JP5002207B2 (ja) 2006-07-26 2006-07-26 パターンを有する構造体の製造方法
US11/773,739 US7976761B2 (en) 2006-07-26 2007-07-05 Process of production of patterned structure
CN2007101391055A CN101112789B (zh) 2006-07-26 2007-07-25 制造图案化结构的工艺

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006202802A JP5002207B2 (ja) 2006-07-26 2006-07-26 パターンを有する構造体の製造方法

Publications (3)

Publication Number Publication Date
JP2008034412A JP2008034412A (ja) 2008-02-14
JP2008034412A5 JP2008034412A5 (enExample) 2009-09-10
JP5002207B2 true JP5002207B2 (ja) 2012-08-15

Family

ID=38985377

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006202802A Expired - Fee Related JP5002207B2 (ja) 2006-07-26 2006-07-26 パターンを有する構造体の製造方法

Country Status (3)

Country Link
US (1) US7976761B2 (enExample)
JP (1) JP5002207B2 (enExample)
CN (1) CN101112789B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5294565B2 (ja) * 2006-03-17 2013-09-18 キヤノン株式会社 発光素子及び発光素子の製造方法
KR101456504B1 (ko) * 2006-10-25 2014-10-31 에이전시 포 사이언스, 테크놀로지 앤드 리서치 기판 표면의 젖음성 개질방법
EP2171538A4 (en) * 2007-06-27 2011-08-17 Agency Science Tech & Res METHOD FOR PRODUCING A SECONDARY PRINT ON A PRINTED POLYMER
JP2009238777A (ja) * 2008-03-25 2009-10-15 Toshiba Corp 半導体装置の製造方法
JP5376930B2 (ja) * 2008-12-19 2013-12-25 キヤノン株式会社 液体吐出ヘッドの製造方法
NL2003875A (en) 2009-02-04 2010-08-05 Asml Netherlands Bv Imprint lithography method and apparatus.
CN102566258B (zh) * 2010-12-29 2013-09-18 中芯国际集成电路制造(上海)有限公司 双压印方法
JP5499306B2 (ja) * 2011-07-11 2014-05-21 Scivax株式会社 加圧部用固定具を備えた流体圧インプリント装置
KR102296890B1 (ko) * 2014-02-18 2021-08-31 퀄컴 인코포레이티드 비허가된 스펙트럼을 갖는 lte/lte-a 네트워크들에서의 안테나 선택
CN110299284B (zh) * 2018-03-23 2020-11-03 联华电子股份有限公司 图案化方法以及图案化结构

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521310A (ja) 1991-07-11 1993-01-29 Canon Inc 微細パタン形成方法
US20040137734A1 (en) 1995-11-15 2004-07-15 Princeton University Compositions and processes for nanoimprinting
US6482742B1 (en) 2000-07-18 2002-11-19 Stephen Y. Chou Fluid pressure imprint lithography
US6518189B1 (en) 1995-11-15 2003-02-11 Regents Of The University Of Minnesota Method and apparatus for high density nanostructures
US5772905A (en) 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
US6309580B1 (en) 1995-11-15 2001-10-30 Regents Of The University Of Minnesota Release surfaces, particularly for use in nanoimprint lithography
US6602620B1 (en) 1998-12-28 2003-08-05 Kabushiki Kaisha Toshiba Magnetic recording apparatus, magnetic recording medium and manufacturing method thereof
KR100335070B1 (ko) * 1999-04-21 2002-05-03 백승준 압축 성형 기법을 이용한 미세 패턴 형성 방법
US6498640B1 (en) * 1999-12-30 2002-12-24 Koninklijke Philips Electronics N.V. Method to measure alignment using latent image grating structures
US7322287B2 (en) 2000-07-18 2008-01-29 Nanonex Corporation Apparatus for fluid pressure imprint lithography
US7211214B2 (en) 2000-07-18 2007-05-01 Princeton University Laser assisted direct imprint lithography
JP2003068618A (ja) 2001-08-28 2003-03-07 Canon Inc 露光装置、デバイス製造方法、半導体製造工場および露光装置の保守方法
JP3830386B2 (ja) 2001-12-20 2006-10-04 英夫 吉田 陽極酸化法およびその処理装置
US6999156B2 (en) 2002-09-30 2006-02-14 Chou Stephen Y Tunable subwavelength resonant grating filter
AU2003291443A1 (en) 2002-11-12 2004-06-03 Princeton University Compositions and processes for nanoimprinting
JP2004296780A (ja) 2003-03-27 2004-10-21 Canon Inc X線露光装置
DE10330456B9 (de) * 2003-07-05 2007-11-08 Erich Thallner Vorrichtung zum Erstellen einer Oberflächenstruktur auf einem Wafer
JP4093574B2 (ja) * 2003-09-22 2008-06-04 株式会社東芝 インプリントスタンパの製造方法、および磁気記録媒体の製造方法
JP2005101201A (ja) 2003-09-24 2005-04-14 Canon Inc ナノインプリント装置
JP4937500B2 (ja) * 2004-06-15 2012-05-23 大日本印刷株式会社 インプリント方法
US7490547B2 (en) * 2004-12-30 2009-02-17 Asml Netherlands B.V. Imprint lithography
US7686970B2 (en) * 2004-12-30 2010-03-30 Asml Netherlands B.V. Imprint lithography
US7209217B2 (en) * 2005-04-08 2007-04-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method utilizing plural patterning devices
JP5213335B2 (ja) * 2006-02-01 2013-06-19 キヤノン株式会社 インプリント用モールド、該モールドによる構造体の製造方法

Also Published As

Publication number Publication date
CN101112789B (zh) 2012-04-25
JP2008034412A (ja) 2008-02-14
CN101112789A (zh) 2008-01-30
US20080023880A1 (en) 2008-01-31
US7976761B2 (en) 2011-07-12

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