CN101112789B - 制造图案化结构的工艺 - Google Patents
制造图案化结构的工艺 Download PDFInfo
- Publication number
- CN101112789B CN101112789B CN2007101391055A CN200710139105A CN101112789B CN 101112789 B CN101112789 B CN 101112789B CN 2007101391055 A CN2007101391055 A CN 2007101391055A CN 200710139105 A CN200710139105 A CN 200710139105A CN 101112789 B CN101112789 B CN 101112789B
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- China
- Prior art keywords
- pattern
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- pressing mold
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title abstract description 8
- 238000004519 manufacturing process Methods 0.000 title description 2
- 238000003825 pressing Methods 0.000 claims abstract description 55
- 238000005516 engineering process Methods 0.000 claims description 21
- 239000013078 crystal Substances 0.000 claims description 15
- 230000005484 gravity Effects 0.000 claims description 14
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 230000000881 depressing effect Effects 0.000 claims description 5
- 238000006073 displacement reaction Methods 0.000 claims description 4
- 238000003475 lamination Methods 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 230000009977 dual effect Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000007261 regionalization Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 238000007687 exposure technique Methods 0.000 description 3
- 238000001127 nanoimprint lithography Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000012815 thermoplastic material Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
- B29C2059/023—Microembossing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/84—Manufacture, treatment, or detection of nanostructure
- Y10S977/887—Nanoimprint lithography, i.e. nanostamp
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Micromachines (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006202802A JP5002207B2 (ja) | 2006-07-26 | 2006-07-26 | パターンを有する構造体の製造方法 |
| JP202802/2006 | 2006-07-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101112789A CN101112789A (zh) | 2008-01-30 |
| CN101112789B true CN101112789B (zh) | 2012-04-25 |
Family
ID=38985377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101391055A Expired - Fee Related CN101112789B (zh) | 2006-07-26 | 2007-07-25 | 制造图案化结构的工艺 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7976761B2 (enExample) |
| JP (1) | JP5002207B2 (enExample) |
| CN (1) | CN101112789B (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5294565B2 (ja) * | 2006-03-17 | 2013-09-18 | キヤノン株式会社 | 発光素子及び発光素子の製造方法 |
| KR101456504B1 (ko) * | 2006-10-25 | 2014-10-31 | 에이전시 포 사이언스, 테크놀로지 앤드 리서치 | 기판 표면의 젖음성 개질방법 |
| AU2008269284A1 (en) * | 2007-06-27 | 2008-12-31 | Agency For Science, Technology And Research | A method of making a secondary imprint on an imprinted polymer |
| JP2009238777A (ja) * | 2008-03-25 | 2009-10-15 | Toshiba Corp | 半導体装置の製造方法 |
| JP5376930B2 (ja) * | 2008-12-19 | 2013-12-25 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
| NL2003875A (en) * | 2009-02-04 | 2010-08-05 | Asml Netherlands Bv | Imprint lithography method and apparatus. |
| CN102566258B (zh) * | 2010-12-29 | 2013-09-18 | 中芯国际集成电路制造(上海)有限公司 | 双压印方法 |
| CN103826829B (zh) * | 2011-07-11 | 2015-12-23 | Scivax股份有限公司 | 具有用于加压部的固定工具的流体压印装置 |
| KR102296890B1 (ko) * | 2014-02-18 | 2021-08-31 | 퀄컴 인코포레이티드 | 비허가된 스펙트럼을 갖는 lte/lte-a 네트워크들에서의 안테나 선택 |
| CN110299284B (zh) | 2018-03-23 | 2020-11-03 | 联华电子股份有限公司 | 图案化方法以及图案化结构 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0521310A (ja) * | 1991-07-11 | 1993-01-29 | Canon Inc | 微細パタン形成方法 |
| US6482742B1 (en) * | 2000-07-18 | 2002-11-19 | Stephen Y. Chou | Fluid pressure imprint lithography |
| US20040137734A1 (en) * | 1995-11-15 | 2004-07-15 | Princeton University | Compositions and processes for nanoimprinting |
| US5772905A (en) * | 1995-11-15 | 1998-06-30 | Regents Of The University Of Minnesota | Nanoimprint lithography |
| US6518189B1 (en) * | 1995-11-15 | 2003-02-11 | Regents Of The University Of Minnesota | Method and apparatus for high density nanostructures |
| US6309580B1 (en) * | 1995-11-15 | 2001-10-30 | Regents Of The University Of Minnesota | Release surfaces, particularly for use in nanoimprint lithography |
| US6602620B1 (en) * | 1998-12-28 | 2003-08-05 | Kabushiki Kaisha Toshiba | Magnetic recording apparatus, magnetic recording medium and manufacturing method thereof |
| KR100335070B1 (ko) * | 1999-04-21 | 2002-05-03 | 백승준 | 압축 성형 기법을 이용한 미세 패턴 형성 방법 |
| US6498640B1 (en) * | 1999-12-30 | 2002-12-24 | Koninklijke Philips Electronics N.V. | Method to measure alignment using latent image grating structures |
| US7211214B2 (en) * | 2000-07-18 | 2007-05-01 | Princeton University | Laser assisted direct imprint lithography |
| US7322287B2 (en) * | 2000-07-18 | 2008-01-29 | Nanonex Corporation | Apparatus for fluid pressure imprint lithography |
| JP2003068618A (ja) | 2001-08-28 | 2003-03-07 | Canon Inc | 露光装置、デバイス製造方法、半導体製造工場および露光装置の保守方法 |
| JP3830386B2 (ja) * | 2001-12-20 | 2006-10-04 | 英夫 吉田 | 陽極酸化法およびその処理装置 |
| US6999156B2 (en) * | 2002-09-30 | 2006-02-14 | Chou Stephen Y | Tunable subwavelength resonant grating filter |
| WO2004044654A2 (en) | 2002-11-12 | 2004-05-27 | Princeton University | Compositions and processes for nanoimprinting |
| JP2004296780A (ja) | 2003-03-27 | 2004-10-21 | Canon Inc | X線露光装置 |
| DE10330456B9 (de) * | 2003-07-05 | 2007-11-08 | Erich Thallner | Vorrichtung zum Erstellen einer Oberflächenstruktur auf einem Wafer |
| JP4093574B2 (ja) * | 2003-09-22 | 2008-06-04 | 株式会社東芝 | インプリントスタンパの製造方法、および磁気記録媒体の製造方法 |
| JP2005101201A (ja) * | 2003-09-24 | 2005-04-14 | Canon Inc | ナノインプリント装置 |
| JP4937500B2 (ja) * | 2004-06-15 | 2012-05-23 | 大日本印刷株式会社 | インプリント方法 |
| US7490547B2 (en) * | 2004-12-30 | 2009-02-17 | Asml Netherlands B.V. | Imprint lithography |
| US7686970B2 (en) * | 2004-12-30 | 2010-03-30 | Asml Netherlands B.V. | Imprint lithography |
| US7209217B2 (en) * | 2005-04-08 | 2007-04-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method utilizing plural patterning devices |
| JP5213335B2 (ja) * | 2006-02-01 | 2013-06-19 | キヤノン株式会社 | インプリント用モールド、該モールドによる構造体の製造方法 |
-
2006
- 2006-07-26 JP JP2006202802A patent/JP5002207B2/ja not_active Expired - Fee Related
-
2007
- 2007-07-05 US US11/773,739 patent/US7976761B2/en not_active Expired - Fee Related
- 2007-07-25 CN CN2007101391055A patent/CN101112789B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP5002207B2 (ja) | 2012-08-15 |
| US7976761B2 (en) | 2011-07-12 |
| US20080023880A1 (en) | 2008-01-31 |
| CN101112789A (zh) | 2008-01-30 |
| JP2008034412A (ja) | 2008-02-14 |
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Legal Events
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120425 Termination date: 20170725 |
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| CF01 | Termination of patent right due to non-payment of annual fee |